N25Q256A13E12A0F vs N25Q128A13E12A0F Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng N25Q256A13E12A0F sa pamamagitan ng Micron Technology at N25Q128A13E12A0F sa pamamagitan ng Micron Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Micron Technology
N25Q256A13E12A0F - 256Mb SPI NOR Flash, 108MHz | Micron
N25Q256A13E12A0F ✓ NakahandaMicron Technology
N25Q128A13E12A0F - 128Mb SPI NOR Flash, 108 MHz | Micron
N25Q128A13E12A0F ✓ NakahandaPagsanggunian na paghahambing
| Parametro | N25Q256A13E12A0F | N25Q128A13E12A0F |
|---|---|---|
| Brand | Micron Technology | Micron Technology |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | NOR Flash, Serial SPI | NOR Flash, Serial SPI |
| Density | 256 Mbit (32 MB) | 128 Mbit (16M x 8 bit) |
| Organisasyon | 64M x 4 (Mouser listing); 32M x 8 per FindIC listing - see validation note | — |
| Volte ng Pagbibigay | 2.7 V to 3.6 V | 2.7 V to 3.6 V (3 V / 3.3 V class) |
| Max SPI Clock Frequency | 108 MHz | — |
| I/O Modes | Single, Dual, Quad I/O (Multiple I/O Serial Flash) | — |
| Technology | SLC (Single-Level Cell) | — |
| Sector Erase Size | 4 KB | — |
| Packhaging | 24-ball T-PBGA (6x8 mm) | 24-ball TBGA (T-PBGA), 6x8 mm |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +125C | -40C to +125C |
| Access Time | 8 ns (per FindIC listing) | 7 ns |
| Tindminan RoHS | Compliant | Compliant |
| Packaging | Tape & Reel (TR suffix) | Tape & Reel |
| Program/Erase Endurance | [DATA_NEEDED: program/erase endurance cycles] | — |
| Data Retention | [DATA_NEEDED: data retention years] | — |
| Active Read Current | [DATA_NEEDED: ICC read current] | — |
| Standby Current | [DATA_NEEDED: ICC standby current] | — |
| Max Clock Frequency | — | 108 MHz |
| Interface | — | SPI, Dual SPI, Quad SPI |
| Word Size | — | 8 bit |
| Subsector Erase | — | 4 KB (boot sectors) |
| XiP Support | — | Yes (execute-in-place) |
| Maximum Seated Height | — | 1.2 mm |
| Qualification | — | Automotive, AEC-Q100 (per distributor listing) |