P3041NXN1NNB vs P3041NXN1MMB Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng P3041NXN1NNB sa pamamagitan ng NXP Semiconductors at P3041NXN1MMB sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
P3041NXN1NNB QorIQ P3041 Quad-Core e500mc MPU 1.333GHz | NXP
P3041NXN1NNB ✓ NakahandaNXP Semiconductors
P3041NXN1MMB - QorIQ P3 Quad-Core 1.2GHz MPU | NXP Semiconductors
P3041NXN1MMB ✓ NakahandaPagsanggunian na paghahambing
| Parametro | P3041NXN1NNB | P3041NXN1MMB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Architecture | PowerPC e500mc | PowerPC e500mc |
| Number of Cores | 4 | 4 |
| Maximum Core Frequency | 1.333 GHz | 1.2 GHz |
| Silicon Revision | 1.1 | — |
| L2 Cache (per core) | 256 KB | — |
| Platform Cache | 2 MB | — |
| Memory Controller | Dual DDR3 with ECC | DDR3 / DDR3L with ECC (per product brief) |
| 10 Gigabit Ethernet | 3 XAUI interfaces | — |
| Gigabit Ethernet | 8 controllers | — |
| PCI Express | 4 x PCIe 2.0 controllers | — |
| Serial RapidIO | 1.0 Serial RapidIO 2.1 interface | — |
| Security Engine (SEC) | Not included (no SEC variant) | — |
| Temperature na Operasyon | -40C to +105C (extended) | — |
| Packhaging | 1295-ball FCBGA, 37.5 mm x 37.5 mm | 1295-FCPBGA (FCBGA, 37.5x37.5 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Width ng Data Bus | — | 32-bit |
| Family | — | QorIQ P3 |
| Encryption Acceleration | — | NonENC (no SEC engine) |
| Product Variant | — | r1.1 silicon revision |
| Hanay ng Temperature na Operasyon | — | -40C to +105C |
| High-Speed I/O | — | Multiple SerDes lanes for 10 GbE, GbE, PCIe (per family) |
| Process Technology | — | [DATA_NEEDED: process node] |
| Supply Voltage (Core) | — | [DATA_NEEDED: Vdd_core] |
| Tindminan RoHS | — | Compliant (BGA solder-ball lead-free per NXP product family) |