S9S08DZ60F1MLF vs MC9S08DZ60ACLF Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng S9S08DZ60F1MLF sa pamamagitan ng NXP Semiconductors at MC9S08DZ60ACLF sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
S9S08DZ60F1MLF S9S08DZ60F1MLF - 8-Bit 40MHz HCS08 MCU 60KB Flash 48-LQFP | NXP

S9S08DZ60F1MLF - 8-Bit 40MHz HCS08 MCU 60KB Flash 48-LQFP | NXP

S9S08DZ60F1MLF ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro S9S08DZ60F1MLF MC9S08DZ60ACLF
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo NRND
Manufacturer NXP USA Inc. (formerly Freescale Semiconductor) —
Product Type 8-Bit Microcontroller (MCU) —
Core Architecture HCS08 (enhanced HCS08 core) —
CPU Speed 40 MHz (20 MHz bus) —
Program Memory Size 60 KB (60K x 8) FLASH —
RAM Size 4 KB (4K x 8) —
Number of I/O Lines 39 —
Packhaging / Kaso 48-LQFP (7x7 mm) —
Volte ng Pagbibigay 3.3 V / 5 V —
Uri ng Pagpapasok Surface Mount Surface Mount
Terminal Form GULL WING —
Temperature Grade Automotive (per part suffix 'F' / 'LF') —
Temperature na Operasyon [DATA_NEEDED: full operating temperature range] -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range]
Instruction Set HC08 with BGND instruction HC08 instruction set with added BGND instruction
Oscillator Type External (per package options) —
Peripherals MSCAN (CAN 2.0), SCI, SPI, ADC, Timers —
Tindminan RoHS [DATA_NEEDED: confirm RoHS lead-free finish] Compliant
Level ng MSL [DATA_NEEDED: MSL rating per JEDEC J-STD-020] MSL 3 (per JEDEC J-STD-020)
Core — HCS08 (8-bit CISC)
Core Frequency — 40 MHz (20 MHz bus)
Program Memory (Flash) — 60 KB (60K x 8)
RAM — 4 KB
EEPROM / Emulated EEPROM — Available (size [DATA_NEEDED: EEPROM size])
Operating Voltage — 2.7 V to 5.5 V
Supply Rails — 3.3 V / 5 V
ADC — 24-channel, 12-bit, 2.5 us conversion
CAN — 1 x CAN 2.0 A/B
LIN — Master LIN 2.0 interface
Communication Peripherals — SCI (SPI), IIC, MSCAN
Timer / PWM Channels — Multiple (count [DATA_NEEDED: timer/PWM channel count])
LCD Driver — Yes (on-chip segment LCD driver)
Packhaging — 48-LQFP (7x7 mm)
Background Debug Mode (BGND) — Yes (on-chip emulation/debug)

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