SPC5601PEF0MLL6 vs SPC5602PEF0MLL6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng SPC5601PEF0MLL6 sa pamamagitan ng NXP Semiconductors at SPC5602PEF0MLL6 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
SPC5601PEF0MLL6 - 32-bit Power Arch MCU, 192KB Flash, 100-LQFP | NXP
SPC5601PEF0MLL6 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | SPC5601PEF0MLL6 | SPC5602PEF0MLL6 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Processor | e200z0h (Power Architecture) | e200z0h (Power Architecture) |
| Core Size | 32-Bit Single-Core | 32-bit |
| Core Architecture | Power Architecture, single-issue, in-order | — |
| Speed (Max) | 64 MHz | — |
| Program Memory Size (Flash) | 192 KB (192K x 8) | — |
| RAM Size | 12 KB | 20 KB |
| Connectivity | CANbus, LINbus, SCI (UART), SPI | — |
| Peripherals | DMA, POR, PWM, WDT (Watchdog) | — |
| Number of I/O | 79 | [DATA_NEEDED: number of GPIO] |
| Packhaging / Kaso | 100-LQFP (14x14 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Terminal Form | GULL WING | — |
| Peak Reflow Temperature | 260C (JEDEC lead-free profile) | — |
| Hanay ng Temperature na Operasyon | -40C to +125C | — |
| Supply Voltage Range | [DATA_NEEDED: VDD minimum/nominal/maximum] | — |
| Grade | Automotive Grade (AEC-Q100) | — |
| Series / Family | MPC56xx Qorivva | — |
| Tindminan RoHS | Compliant (lead-free per package datasheet) | [DATA_NEEDED: RoHS status] |
| Maksimum na Taktiko ng Oras | — | 64 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| Volte ng Pagbibigay | — | 3.3 V / 5 V |
| Packhaging | — | 100-LQFP (14x14 mm) |
| Qualification | — | AEC-Q100 (automotive) |
| Product Family | — | Qorivva MPC560xP |
| CAN Controller | — | FlexCAN integrated |
| Application Domain | — | Automotive chassis, body, industrial |
| Packaging | — | Tray |
| Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution] |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |