STM32MP157CAC3 vs STM32MP153DAC1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng STM32MP157CAC3 sa pamamagitan ng STMicroelectronics at STM32MP153DAC1 sa pamamagitan ng STMicroelectronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
STMicroelectronics
STM32MP153DAC1 - Dual Cortex-A7 + M4 MPU | STMicroelectronics
STM32MP153DAC1 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | STM32MP157CAC3 | STM32MP153DAC1 |
|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics |
| Kategorya | Microprocessors | Microprocessors |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Processor | Dual Arm Cortex-A7 + Arm Cortex-M4 | ARM Cortex-A7 + Cortex-M4 |
| Cortex-A7 Max Frequency | 650 MHz | — |
| Cortex-M4 Max Frequency | 209 MHz | — |
| Architecture | 32-bit, 2+1 core heterogeneous | — |
| Series | STM32MP1 | STM32MP1 |
| Ethernet | 2x GMAC, 1-Gbps RGMII (IEEE-802.3ab) | — |
| USB | 2x USB 2.0 OTG | — |
| UART | 8x | — |
| SPI | 5x | — |
| I2C | 5x | — |
| CAN | 2x CAN FD | — |
| GPU | 3D GPU (OpenGL ES 2.0) | — |
| Display Interface | TFT / MIPI DSI | — |
| DRAM Controller | 16-bit DDR3/DDR3L/LPDDR2/LPDDR3 | — |
| Security | Crypto accelerator (AES, DES, 3DES, SHA-1, SHA-256, MD5), secure boot | — |
| Temperature na Operasyon | -40C to +125C | [DATA_NEEDED: Operating Temperature] |
| Packhaging | 361-TFBGA (12x12 mm) | 361-TFBGA (12x12) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| Tindminan RoHS | Compliant | Compliant |
| Number of Cores | — | 2 Core, 32-Bit |
| Core Speed | — | 209MHz, 800MHz |
| Volte ng Pagbibigay | — | [DATA_NEEDED: Supply Voltage] |
| RAM Size | — | [DATA_NEEDED: RAM Size] |
| Number of I/O | — | [DATA_NEEDED: Number of I/O] |
| Connectivity | — | Gigabit Ethernet, USB 2.0, CAN FD, UART, SPI, I2C |
| Graphics | — | 3D GPU |
| Security Features | — | Secure boot, cryptographic acceleration, TRNG |
| Process Technology | — | 28nm FD-SOI |