TC222L16F133NACKXUMA1 vs XC2287M104F80LRABKXUMA1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng TC222L16F133NACKXUMA1 sa pamamagitan ng Infineon at XC2287M104F80LRABKXUMA1 sa pamamagitan ng Infineon. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Infineon
TC222L16F133NACKXUMA1 - AURIX 32-Bit MCU 133MHz 1MB Flash | Infineon
TC222L16F133NACKXUMA1 ✓ NakahandaInfineon
XC2287M104F80LRABKXUMA1 - 16/32-Bit 80MHz 832KB Flash MCU | Infineon
XC2287M104F80LRABKXUMA1 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | TC222L16F133NACKXUMA1 | XC2287M104F80LRABKXUMA1 |
|---|---|---|
| Brand | Infineon | Infineon |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Architecture | TriCore AURIX TC2xx (32-bit) | C166SV2 (CISC + DSP + RISC extensions) |
| Maksimum na Taktiko ng Oras | 133 MHz | 80 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) | 832 KB (832K x 8) |
| SRAM (incl. Cache) | 96 KB | — |
| CAN Nodes | 3 | — |
| ADC | 12-bit, up to 16 channels | — |
| Supply Voltage (Core) | 1.3 V (typ.) | — |
| I/O Voltage | 3.3 V / 5 V (per datasheet) | — |
| Number of I/O | 59 | — |
| Packhaging | PG-TQFP-80-7 (HTFQFP, exposed pad) | PG-LQFP-144-4 (144-pin LQFP with exposed pad, 20x20 mm) |
| Terminal Form | GULL WING | — |
| Number of Terminals | 80 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature Grade | Automotive | — |
| Lead Pitch | 0.5 mm | — |
| Family | AURIX TC22xL Series 1 | — |
| Core Count | Single Core | — |
| Manufacturer | — | Infineon Technologies |
| Series | — | XC2000 / XC22xxM |
| Core Size | — | 16/32-Bit |
| RAM Size | — | 58 KB |
| Supply Voltage Range | — | 3.0 V to 5.5 V |
| Hanay ng Temperature na Operasyon | — | -40 °C to +125 °C |
| ADC Resolution | — | 10-bit |
| Number of ADC Inputs | — | [DATA_NEEDED: number of ADC channels] |
| Communication Interfaces | — | MultiCAN (up to 5 nodes), USART, SSC, I2C |
| Tindminan RoHS | — | Compliant |
| Packing Method | — | Tape & Reel |