TJA1024HG vs TJA1022HGZ Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng TJA1024HG sa pamamagitan ng NXP Semiconductors at TJA1022HGZ sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
TJA1022HGZ - Dual LIN 2.2A/SAE J2602 Transceiver DHVQFN-24 | NXP
TJA1022HGZ ✓ NakahandaPagsanggunian na paghahambing
| Parametro | TJA1024HG | TJA1022HGZ |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Interface ICs | Interface ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Fungsi | Quad LIN 2.2A/SAE J2602 transceiver | Dual LIN 2.2A / SAE J2602 transceiver |
| Number of LIN Channels | 4 (two independent dual-LIN transceivers) | — |
| Rate ng Data | Up to 20 kBd | — |
| LIN Compliance | LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602 | — |
| LIN Bus Peak Current | 2.2 A | — |
| Supply Voltage (VBAT) | 5 V to 27 V (load-dump tolerant to 40 V) | 5 V to 27 V (load-dump tolerant to 40 V) |
| Sleep Mode Current | < 10 uA (typical per dual channel) | — |
| Temperature na Operasyon | -40 C to +125 C | -40 C to +125 C |
| ESD (LIN pin, HBM) | [DATA_NEEDED: HBM ESD value V] | — |
| Packhaging | DHVQFN-24 (SOT815-1), 3.5 x 5.5 mm | DHVQFN-24 (5.5 x 3.5 mm) with exposed pad |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| AEC-Q100 | Qualified | — |
| Tindminan RoHS | Compliant | — |
| Software Compatibility | TJA1022, TJA1027, TJA1029 | — |
| Bilang ng Pins | 24 | — |
| Number of Channels | — | 2 (dual independent LIN physical layer) |
| Protocol | — | LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602 |
| Maximum Data Rate | — | 20 kBd |
| Logic Supply (VCC) | — | 3.3 V or 5 V integrated LDO |
| MSL (Moisture Sensitivity Level) | — | 1 |
| Peak Reflow Temperature | — | 260 C (max 30 s) |
| Terminal Finish | — | Nickel-Palladium-Gold-Silver (NiPdAuAg) |
| JEDEC J-Standard | — | JESD-609 code e4 |
| Automotive Qualification | — | AEC-Q100 (intended for in-vehicle sub-networks) |
| RoHS / REACH | — | RoHS compliant per NXP product page |