XA7Z020-1CLG400Q vs XC7Z010-1CLG400C Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XA7Z020-1CLG400Q sa pamamagitan ng AMD at XC7Z010-1CLG400C sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
AMD
XA7Z020-1CLG400Q - Automotive Zynq-7000 SoC with Artix-7 FPGA | AMD
XA7Z020-1CLG400Q ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | XA7Z020-1CLG400Q | XC7Z010-1CLG400C |
|---|---|---|
| Brand | AMD | AMD |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Zynq-7000 XA | — |
| FPGA Fabric | Artix-7 | — |
| Number of Logic Cells | 85K | — |
| Number of LUTs | 53,200 | — |
| Processor | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Processor Max Frequency | 667 MHz (-1 speed grade) | — |
| Total Block RAM | 560 Kbit | — |
| DSP Slices | 220 (DSP48E1) | 80 dedicated DSP slices |
| User I/O Count | 200 | — |
| Transceivers | 4 (up to 6.25 Gb/s) | — |
| Hard Memory Controller | 32-bit DDR3/DDR3L | — |
| Hard PCIe | Gen2 x4 | — |
| Temperature na Operasyon | -40C to +100C (AEC-Q100 Grade 2) | [DATA_NEEDED: operating temperature range] |
| Packhaging | 400-ball CSPBGA (CLG400), 17x17 mm, 0.8 mm pitch | 400-CSBGA |
| Automotive Qualification | AEC-Q100 Grade 2 | — |
| Process Node | 28 nm HPL | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant | — |
| Speed Grade | -1 (slowest) | — |
| Lead Free | Yes | — |
| Product Type | — | Zynq-7000 All Programmable System on Chip |
| Processor Core | — | Dual Arm Cortex-A9 MPCore |
| Processor Frequency | — | 667 MHz |
| FPGA Logic Cells | — | 28,000 cells |
| Registers | — | 35,200 registers |
| Block RAM | — | 60 block RAMs |
| Block RAM Capacity | — | 240 Kbit |
| Multipliers | — | 80 multipliers (18x25) |
| Ethernet MACs | — | 2 Ethernet MACs |
| Maximum User I/O | — | 128 I/Os |
| Process Technology | — | 28 nm |
| Differential I/O Standards | — | LVDS, SSTL, and HSTL |
| Package Dimensions | — | 17 mm x 17 mm |
| Architecture | — | MCU and FPGA |
| CoreSight Support | — | CoreSight |