XC6SLX45-2FGG484I vs XC6SLX75-2FGG484I Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX45-2FGG484I sa pamamagitan ng AMD at XC6SLX75-2FGG484I sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro XC6SLX45-2FGG484I XC6SLX75-2FGG484I
Brand AMD AMD
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Spartan-6 LX —
Logic Cells 43,661 74,637
Logic Slices 6,822 —
Flip-Flops 54,576 —
Block RAM 2,138,112 bits (2,088 Kb/s) 4,824 Kbits (180 x 18 Kbit)
DSP Slices (DSP48A1) 58 132
Maximum User I/O 316 —
Packhaging 484-ball BGA (FBGA-484) 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch
Package Dimensions 23 x 23 mm, 1.0 mm ball pitch —
Speed Grade -2 -2 (mid-range)
Operating Temperature (I grade) -40C to +100C (industrial) —
Process Technology 45 nm low-power CMOS 45 nm CMOS
Supply Voltage Core 1.2 V typical —
Clock Management Tiles 6 CMT (4 DCM + 2 PLL) —
Maximum I/O Speed 800 Mbps LVDS —
Memory Interface Support DDR, DDR2, DDR3, LPDDR —
Configuration Memory AES-256 bitstream encryption —
RoHS Compliance Lead-free / RoHS compliant —
Device Family — Spartan-6 LX
Logic Elements / Slices — 11,650 slices
System Gates — 3,170,304
User I/Os — 280
Maximum Internal Frequency — 667 MHz
Core Supply Voltage (VCCINT) — 1.14 V to 1.26 V
Auxiliary Supply Voltage (VCCAUX) — 3.3 V
Operating Temperature (Industrial) — -40 °C to +100 °C (junction to +125 °C)
Uri ng Pagpapasok — Surface Mount (BGA)
Level ng MSL — 3 (168 hours)
Tindminan RoHS — Compliant

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