XC6SLX45-2FGG484I vs XC6SLX75-2FGG484I 比較

詳細並排比較 XC6SLX45-2FGG484I 由 AMD 與 XC6SLX75-2FGG484I 由 AMD. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 XC6SLX45-2FGG484I XC6SLX75-2FGG484I
品牌 AMD AMD
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Spartan-6 LX —
Logic Cells 43,661 74,637
Logic Slices 6,822 —
Flip-Flops 54,576 —
Block RAM 2,138,112 bits (2,088 Kb/s) 4,824 Kbits (180 x 18 Kbit)
DSP Slices (DSP48A1) 58 132
Maximum User I/O 316 —
封裝 484-ball BGA (FBGA-484) 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch
Package Dimensions 23 x 23 mm, 1.0 mm ball pitch —
Speed Grade -2 -2 (mid-range)
Operating Temperature (I grade) -40C to +100C (industrial) —
Process Technology 45 nm low-power CMOS 45 nm CMOS
Supply Voltage Core 1.2 V typical —
Clock Management Tiles 6 CMT (4 DCM + 2 PLL) —
Maximum I/O Speed 800 Mbps LVDS —
Memory Interface Support DDR, DDR2, DDR3, LPDDR —
Configuration Memory AES-256 bitstream encryption —
RoHS Compliance Lead-free / RoHS compliant —
Device Family — Spartan-6 LX
Logic Elements / Slices — 11,650 slices
System Gates — 3,170,304
User I/Os — 280
Maximum Internal Frequency — 667 MHz
Core Supply Voltage (VCCINT) — 1.14 V to 1.26 V
Auxiliary Supply Voltage (VCCAUX) — 3.3 V
Operating Temperature (Industrial) — -40 °C to +100 °C (junction to +125 °C)
安裝類型 — Surface Mount (BGA)
MSL 等級 — 3 (168 hours)
RoHS 狀態 — Compliant

資料表與資源

瀏覽所有產品 建立 BOM 索取報價