XC6SLX75-3FG484I vs XC6SLX75-2FG484C Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX75-3FG484I sa pamamagitan ng AMD at XC6SLX75-2FG484C sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | XC6SLX75-3FG484I | XC6SLX75-2FG484C |
|---|---|---|
| Brand | AMD | AMD |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Unknown | Unknown |
| Device Type | FPGA | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 74,637 cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs | 5,831 CLBs |
| Process Technology | 45 nm CMOS | CMOS |
| Volte ng Pagbibigay | 1.2 V | [DATA_NEEDED: supply voltage] |
| User I/O | 280 I/O | [DATA_NEEDED: user I/O count] |
| Internal Frequency | 667 MHz | 667 MHz |
| Catalog Maximum Frequency | 862 MHz | — |
| Speed Grade | -3 highest-performance family grade | -2 |
| Temperature Grade | Industrial | Commercial |
| Temperature na Operasyon | 0°C to 85°C (32°F to 185°F) | 0 to 85 C |
| Packhaging | FBGA-484 | — |
| Package Dimensions | 23 mm × 23 mm | 23 x 23 mm |
| Package Pitch | 1 mm | 1 mm |
| Terminal Count | 484 balls | — |
| Uri ng Pagpapasok | Surface mount | Surface mount ball grid array |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Package Type | — | 484-BBGA, MS-034 FBGA |
| Number of Balls | — | 484 balls |
| Configuration | — | [DATA_NEEDED: configuration architecture] |
| Block RAM | — | [DATA_NEEDED: block RAM] |
| DSP Resources | — | [DATA_NEEDED: DSP resources] |