EP1M350F780C8 - Mercury PLD FPGA 350K Gates 780-BGA | Altera
MPN: EP1M350F780C8 ✗ Tapus ng BuhayEP1M350F780C8 Ulas
What is a Mercury PLD? A programmable logic device (PLD) is a semiconductor whose logic function is defined after manufacture rather than at the fab. The Altera Mercury family is a high-performance subgroup of the APEX architecture, extending the basic PLD/FPGA concept with embedded dual-port RAM, fast carry chains, and a multi-volt I/O ring; in the taxonomy it sits at PLD -> programmable logic -> FPGA -> ASIC-prototyping silicon. This background context helps engineers evaluate the part against modern alternatives such as Cyclone, Stratix, or Lattice ECP5 devices.
Key differentiating features include up to 12,160 logic elements (LEs), 4 embedded dual-port RAM blocks for on-chip memory, 8 global clock networks with up to 20 I/O standards (LVTTL, LVCMOS, PCI, SSTL, LVDS), and in-system programmability via the IEEE 1532 / passive serial configuration interface. The device targets commercial operating temperatures (0C to +85C) and supports 32-bit and 64-bit data-path designs through cascaded multiplier and carry-chain primitives.
Architecturally, the EP1M350F780C8 uses a 4-input LUT fabric with distributed RAM capability and dedicated high-speed carry chains that deliver arithmetic operations in a single logic level. The IOE (I/O element) ring supports multi-voltage interfacing, and the global clock tree supports up to 8 clock domains with PLL-style phase alignment for synchronous designs.
Typical applications include high-speed telecommunications interfaces (SONET/SDH framers, ATM switches), ASIC prototyping of multi-million-gate designs, DSP co-processing for image and video pipelines, and PCI-bus bridging. The 780-ball FineLine BGA package also enables dense board layouts in compute-dense line cards.
When designing with this device, ensure the JTAG chain is correctly terminated and that the configuration EEPROM matches the device's MSEL pins; legacy APEX firmware can be migrated to Quartus II version 13.1 or earlier. For new designs, engineers should evaluate Cyclone IV/V or Lattice ECP5 as modern equivalents offering lower power and higher LE density per dollar.
This page synthesizes the Mercury device family context, Octopart distributor pricing, and drop-in pin-compatible variants that are not consolidated in any single distributor listing, providing a single reference for procurement, redesign, and obsolescence planning.
Mga alternatibo na pwedeng ilagay na EP1M350F780C8 — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP1M350F780C8 (parehas na form factor at footprint) — pagkakaiba sa Package, Operating Temperature, Family, Speed Grade, Architecture.
EP1M350F780C7N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1M350F780C7ES
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1M350F780C7
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1M350F780C6N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1M350F780C6
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1M350F780C5N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1M350F780C5ES
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1M350F780C5
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1M350F780C8 Mga Pinakamataas na Rating at Electrical Characteristics
| Device Family | Altera APEX Mercury (EP1M) |
| Typical Gates | 350,000 |
| Maximum Logic Elements (LEs) | 12,160 |
| Embedded RAM Blocks | 4 dual-port RAM blocks |
| Packhaging | 780-ball FineLine BGA |
| Speed Grade | C8 (commercial, speed bin 8) |
| Temperature na Operasyon | 0C to +85C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, LVDS (up to 20 standards) |
| Global Clock Networks | 8 |
| Configuration Interface | IEEE 1532 / passive serial / JTAG |
| In-System Programmability | Yes (ISP via JTAG) |
| Tindminan RoHS | unknown (legacy device) |
| Uri ng Pagpapasok | Surface Mount (BGA) |
Gabay sa Pin Configuration ng EP1M350F780C8 780-ball fineline bga
Pin configuration para sa EP1M350F780C8 (780-ball fineline bga package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP1M350F780C8.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP1M350F780C8 ay nararapat para sa 6 aplikasyons: Telecom Line-Card Interface (SONET/SDH Framer), ASIC Prototyping of Multi-Million Gate Designs, DSP Co-Processing for Image and Video Pipelines, PCI Bus Bridge and Legacy Peripheral Aggregation, Industrial Control and Factory Automation Backplanes, Legacy Test and Measurement Instrumentation.
Telecom Line-Card Interface (SONET/SDH Framer)
The EP1M350F780C8 fits telecom line-card framer applications because the 780-ball FineLine BGA package exposes the high pin count needed for parallel STS-1/STM-1 tributary interfaces, and the 8 global clock networks plus LVDS I/O support OC-3/STM-1 line rates. With 12,160 LEs the device absorbs both the framer state machine and the overhead-processing FIFO without external glue logic. The IEEE 1532 ISP allows field upgrades via JTAG during commissioning.
Inirekomenda
ASIC Prototyping of Multi-Million Gate Designs
Engineers use the EP1M350F780C8 for ASIC prototyping because 350K typical gates and 12,160 LEs provide enough capacity to map representative sub-modules of a multi-million gate ASIC for at-speed verification. The C8 speed grade is conservative but predictable, simplifying timing closure against the target ASIC. The 780-ball FineLine BGA exposes dedicated JTAG and configuration pins that map cleanly to standard prototype daughter-cards.
Inirekomenda
DSP Co-Processing for Image and Video Pipelines
The EP1M350F780C8 supports DSP co-processing because its 4 dual-port RAM blocks provide fast on-chip memory for line buffers and coefficient storage, while cascaded carry chains implement add-multiply trees in a single logic level. The 20 supported I/O standards including LVDS pair cleanly with external video ADCs and DACs. At 350K gates, the device hosts medium-complexity kernels such as 2D-DCT, motion estimation, and color-space conversion.
Inirekomenda
PCI Bus Bridge and Legacy Peripheral Aggregation
The EP1M350F780C8 is a strong fit for PCI bus bridging because it natively supports the PCI I/O standard with the 33 MHz/66 MHz signaling required by the PCI Local Bus Specification, and the 8 global clock networks simplify the PCI clock-domain crossing. The 12,160 LEs implement the transaction layer, arbiter, and interrupt logic for legacy peripheral aggregation in industrial PCs. The 780-ball BGA package supports the high pin count for a 32-bit PCI bus plus side-band signals.
Inirekomenda
Industrial Control and Factory Automation Backplanes
The EP1M350F780C8 fits industrial backplane aggregation because its commercial 0C to +85C temperature range covers most factory-floor environments, the 780-ball BGA supports dense backplane pin-out, and the LVDS I/O standards enable long backplane traces with strong EMI immunity. Engineers use the device to aggregate multiple fieldbus segments (PROFIBUS, DeviceNet) onto an industrial Ethernet backbone with deterministic latency.
Inirekomenda
Legacy Test and Measurement Instrumentation
The EP1M350F780C8 serves in legacy test and measurement equipment where the same Mercury design IP must be preserved across product generations, and where in-system programmability allows field firmware updates to instrument calibration constants. The 350K-gate capacity is sufficient to host custom DSP measurement kernels, real-time signal-trigger state machines, and front-panel display controllers, while the LVDS I/O supports high-speed ADC capture front-ends.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP1M350F780C8 — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP1M350F780C7N | EP1M350F780C7 | EP1M350F780C6 | EP1M350F780C5 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-ball FineLine BGA | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Device Family | APEX Mercury (EP1M) | APEX Mercury (EP1M) | APEX Mercury (EP1M) | APEX Mercury (EP1M) | APEX Mercury (EP1M) |
| Typical Gates | 350,000 | 350,000 (same die) | 350,000 (same die) | 350,000 (same die) | 350,000 (same die) |
| Speed Grade | C8 (slowest commercial) | C7N (1 grade faster + N-screening) | C7 (1 grade faster) | C6 (2 grades faster) | C5 (3 grades faster) |
| Operating Temperature | 0C to +85C (commercial) | N-screening variant (may extend range) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Logic Elements | 12,160 | 12,160 | 12,160 | 12,160 | 12,160 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Pangunahing mga Pagkakaiba
- Same die, multiple speed grades provide at-speed ASIC prototyping flexibility (kumpara saEP1M350F780C5)
- Pin-compatible across full Mercury 350K-gate family (kumpara saEP1M350F672C7)
- 12,160 LEs vs lower-density EP1M120 family (kumpara saEP1M120F484C7)
Talaan ng Disenyo
The 780-ball FineLine BGA package requires a multi-layer PCB with at least 4 routing layers and microvia or via-in-pad technology to fan out the 1.0 mm ball pitch. Decoupling capacitors (0.1 uF and 0.01 uF) must be placed as close as practical to each VCC and GND ball pair to limit transient current demand from the internal logic. According to Altera APEX Mercury design guidelines, leave at least 4 ball-pitch clearance around the BGA for escape routing and place at least one 4.7 uF bulk capacitor near the package corner.
Estimated: at typical Mercury PLD core utilization of 60% and 100 MHz internal clock, total power dissipation is approximately 1.5 W. With the FineLine BGA theta_JA of approximately 18 C/W, junction temperature rises about 27C above ambient. Ensure adequate airflow or attach a small heatsink if the design operates at >85% utilization or higher clock rates, especially in sealed industrial enclosures.
Do not confuse the EP1M350F780C8 (Mercury family, 780-ball BGA) with the EP1M120F484C8 (Mercury family, 484-ball BGA, lower density) or with the ACEX EP1K50 family which shares the speed-grade suffix but a different die. JTAG chain termination (VIO pull-up on TCK/TMS/TDO) must be present or ISP programming will fail intermittently. When migrating from Quartus II version 13.1 or earlier, confirm that all Mercury PLD IP cores are still supported before recompiling the design.
Use LVDS pairs matched within 1 mm of trace length and route them over a continuous ground plane to maintain the 100 ohm differential impedance required by the Mercury IOE. Source-synchronous clock and data traces should be length-matched within 150 ps for interfaces running above 100 MHz. Place a 100 ohm differential termination resistor near the receiver end of each LVDS pair to suppress reflections.
Impormasyon ng Pagsunod sa Kautusan
Compliance status not stated in Verified Web Data. EP1M350F780C8 is a legacy Altera PLD introduced before RoHS compliance was mandatory for many FPGA packages; the original FineLine BGA likely contains lead-based solder balls. Engineers should verify RoHS compliance with the distributor before designing into a RoHS-restricted product.