EP1M350F780C8 - Mercury PLD FPGA 350K Gates 780-BGA | Altera
MPN： EP1M350F780C8 ✗ 停產EP1M350F780C8 概覽
What is a Mercury PLD? A programmable logic device (PLD) is a semiconductor whose logic function is defined after manufacture rather than at the fab. The Altera Mercury family is a high-performance subgroup of the APEX architecture, extending the basic PLD/FPGA concept with embedded dual-port RAM, fast carry chains, and a multi-volt I/O ring; in the taxonomy it sits at PLD -> programmable logic -> FPGA -> ASIC-prototyping silicon. This background context helps engineers evaluate the part against modern alternatives such as Cyclone, Stratix, or Lattice ECP5 devices.
Key differentiating features include up to 12,160 logic elements (LEs), 4 embedded dual-port RAM blocks for on-chip memory, 8 global clock networks with up to 20 I/O standards (LVTTL, LVCMOS, PCI, SSTL, LVDS), and in-system programmability via the IEEE 1532 / passive serial configuration interface. The device targets commercial operating temperatures (0C to +85C) and supports 32-bit and 64-bit data-path designs through cascaded multiplier and carry-chain primitives.
Architecturally, the EP1M350F780C8 uses a 4-input LUT fabric with distributed RAM capability and dedicated high-speed carry chains that deliver arithmetic operations in a single logic level. The IOE (I/O element) ring supports multi-voltage interfacing, and the global clock tree supports up to 8 clock domains with PLL-style phase alignment for synchronous designs.
Typical applications include high-speed telecommunications interfaces (SONET/SDH framers, ATM switches), ASIC prototyping of multi-million-gate designs, DSP co-processing for image and video pipelines, and PCI-bus bridging. The 780-ball FineLine BGA package also enables dense board layouts in compute-dense line cards.
When designing with this device, ensure the JTAG chain is correctly terminated and that the configuration EEPROM matches the device's MSEL pins; legacy APEX firmware can be migrated to Quartus II version 13.1 or earlier. For new designs, engineers should evaluate Cyclone IV/V or Lattice ECP5 as modern equivalents offering lower power and higher LE density per dollar.
This page synthesizes the Mercury device family context, Octopart distributor pricing, and drop-in pin-compatible variants that are not consolidated in any single distributor listing, providing a single reference for procurement, redesign, and obsolescence planning.
直接替換替代品，適用於 EP1M350F780C8 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1M350F780C8 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Family, Speed Grade, Architecture.
EP1M350F780C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780C7ES
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780C7
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780C6
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780C5ES
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780C5
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780C8 最大額定值與電氣特性
| Device Family | Altera APEX Mercury (EP1M) |
| Typical Gates | 350,000 |
| Maximum Logic Elements (LEs) | 12,160 |
| Embedded RAM Blocks | 4 dual-port RAM blocks |
| 封裝 | 780-ball FineLine BGA |
| Speed Grade | C8 (commercial, speed bin 8) |
| 工作溫度 | 0C to +85C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, LVDS (up to 20 standards) |
| Global Clock Networks | 8 |
| Configuration Interface | IEEE 1532 / passive serial / JTAG |
| In-System Programmability | Yes (ISP via JTAG) |
| RoHS 狀態 | unknown (legacy device) |
| 安裝類型 | Surface Mount (BGA) |
EP1M350F780C8 780-ball fineline bga 腳位配置指南
EP1M350F780C8（780-ball fineline bga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1M350F780C8.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1M350F780C8 適用於 6 應用s: Telecom Line-Card Interface (SONET/SDH Framer), ASIC Prototyping of Multi-Million Gate Designs, DSP Co-Processing for Image and Video Pipelines, PCI Bus Bridge and Legacy Peripheral Aggregation, Industrial Control and Factory Automation Backplanes, Legacy Test and Measurement Instrumentation.
Telecom Line-Card Interface (SONET/SDH Framer)
The EP1M350F780C8 fits telecom line-card framer applications because the 780-ball FineLine BGA package exposes the high pin count needed for parallel STS-1/STM-1 tributary interfaces, and the 8 global clock networks plus LVDS I/O support OC-3/STM-1 line rates. With 12,160 LEs the device absorbs both the framer state machine and the overhead-processing FIFO without external glue logic. The IEEE 1532 ISP allows field upgrades via JTAG during commissioning.
推薦
ASIC Prototyping of Multi-Million Gate Designs
Engineers use the EP1M350F780C8 for ASIC prototyping because 350K typical gates and 12,160 LEs provide enough capacity to map representative sub-modules of a multi-million gate ASIC for at-speed verification. The C8 speed grade is conservative but predictable, simplifying timing closure against the target ASIC. The 780-ball FineLine BGA exposes dedicated JTAG and configuration pins that map cleanly to standard prototype daughter-cards.
推薦
DSP Co-Processing for Image and Video Pipelines
The EP1M350F780C8 supports DSP co-processing because its 4 dual-port RAM blocks provide fast on-chip memory for line buffers and coefficient storage, while cascaded carry chains implement add-multiply trees in a single logic level. The 20 supported I/O standards including LVDS pair cleanly with external video ADCs and DACs. At 350K gates, the device hosts medium-complexity kernels such as 2D-DCT, motion estimation, and color-space conversion.
推薦
PCI Bus Bridge and Legacy Peripheral Aggregation
The EP1M350F780C8 is a strong fit for PCI bus bridging because it natively supports the PCI I/O standard with the 33 MHz/66 MHz signaling required by the PCI Local Bus Specification, and the 8 global clock networks simplify the PCI clock-domain crossing. The 12,160 LEs implement the transaction layer, arbiter, and interrupt logic for legacy peripheral aggregation in industrial PCs. The 780-ball BGA package supports the high pin count for a 32-bit PCI bus plus side-band signals.
推薦
Industrial Control and Factory Automation Backplanes
The EP1M350F780C8 fits industrial backplane aggregation because its commercial 0C to +85C temperature range covers most factory-floor environments, the 780-ball BGA supports dense backplane pin-out, and the LVDS I/O standards enable long backplane traces with strong EMI immunity. Engineers use the device to aggregate multiple fieldbus segments (PROFIBUS, DeviceNet) onto an industrial Ethernet backbone with deterministic latency.
推薦
Legacy Test and Measurement Instrumentation
The EP1M350F780C8 serves in legacy test and measurement equipment where the same Mercury design IP must be preserved across product generations, and where in-system programmability allows field firmware updates to instrument calibration constants. The 350K-gate capacity is sufficient to host custom DSP measurement kernels, real-time signal-trigger state machines, and front-panel display controllers, while the LVDS I/O supports high-speed ADC capture front-ends.
推薦
推薦產品摘要
工程參考資料，適用於 EP1M350F780C8 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1M350F780C7N | EP1M350F780C7 | EP1M350F780C6 | EP1M350F780C5 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-ball FineLine BGA | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Device Family | APEX Mercury (EP1M) | APEX Mercury (EP1M) | APEX Mercury (EP1M) | APEX Mercury (EP1M) | APEX Mercury (EP1M) |
| Typical Gates | 350,000 | 350,000 (same die) | 350,000 (same die) | 350,000 (same die) | 350,000 (same die) |
| Speed Grade | C8 (slowest commercial) | C7N (1 grade faster + N-screening) | C7 (1 grade faster) | C6 (2 grades faster) | C5 (3 grades faster) |
| Operating Temperature | 0C to +85C (commercial) | N-screening variant (may extend range) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Logic Elements | 12,160 | 12,160 | 12,160 | 12,160 | 12,160 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Same die, multiple speed grades provide at-speed ASIC prototyping flexibility (對比EP1M350F780C5)
- Pin-compatible across full Mercury 350K-gate family (對比EP1M350F672C7)
- 12,160 LEs vs lower-density EP1M120 family (對比EP1M120F484C7)
設計說明
The 780-ball FineLine BGA package requires a multi-layer PCB with at least 4 routing layers and microvia or via-in-pad technology to fan out the 1.0 mm ball pitch. Decoupling capacitors (0.1 uF and 0.01 uF) must be placed as close as practical to each VCC and GND ball pair to limit transient current demand from the internal logic. According to Altera APEX Mercury design guidelines, leave at least 4 ball-pitch clearance around the BGA for escape routing and place at least one 4.7 uF bulk capacitor near the package corner.
Estimated: at typical Mercury PLD core utilization of 60% and 100 MHz internal clock, total power dissipation is approximately 1.5 W. With the FineLine BGA theta_JA of approximately 18 C/W, junction temperature rises about 27C above ambient. Ensure adequate airflow or attach a small heatsink if the design operates at >85% utilization or higher clock rates, especially in sealed industrial enclosures.
Do not confuse the EP1M350F780C8 (Mercury family, 780-ball BGA) with the EP1M120F484C8 (Mercury family, 484-ball BGA, lower density) or with the ACEX EP1K50 family which shares the speed-grade suffix but a different die. JTAG chain termination (VIO pull-up on TCK/TMS/TDO) must be present or ISP programming will fail intermittently. When migrating from Quartus II version 13.1 or earlier, confirm that all Mercury PLD IP cores are still supported before recompiling the design.
Use LVDS pairs matched within 1 mm of trace length and route them over a continuous ground plane to maintain the 100 ohm differential impedance required by the Mercury IOE. Source-synchronous clock and data traces should be length-matched within 150 ps for interfaces running above 100 MHz. Place a 100 ohm differential termination resistor near the receiver end of each LVDS pair to suppress reflections.
合規資訊
Compliance status not stated in Verified Web Data. EP1M350F780C8 is a legacy Altera PLD introduced before RoHS compliance was mandatory for many FPGA packages; the original FineLine BGA likely contains lead-based solder balls. Engineers should verify RoHS compliance with the distributor before designing into a RoHS-restricted product.