EP4SGX360KF40I3N - Stratix IV GX FPGA, 360K LEs, 1517-FBGA | Intel
MPN: EP4SGX360KF40I3N ⚠ Huling PagbiliEP4SGX360KF40I3N Ulas
An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration bitstreams rather than at the factory. FPGAs sit between fixed-function ASICs and software-defined processors in the design hierarchy, offering hardware-timed parallelism, sub-nanosecond latency, and the ability to integrate multi-gigabit transceivers, memory controllers, and DSP blocks on a single die. The Stratix IV GX family specifically adds embedded transceivers up to 8.5 Gbps, distinguishing it from logic-only or memory-optimized predecessors.
Key features include 48 full-duplex transceiver channels supporting common serial protocols, dedicated hard IP for PCI Express Gen1/Gen2, 8-input adaptive logic modules (ALMs), and on-chip memory with optional ECC. The 1517-FCBGA package exposes 744 general-purpose I/Os distributed across 16 banks, allowing flexible mixed-voltage interfacing (1.2 V to 3.3 V). Eight phase-locked loops (PLLs) provide robust clock management across multiple frequency domains, critical for protocol bridging and source-synchronous memory interfaces.
Architecture highlights include the ALM (Adaptive Logic Module) which combines the capabilities of LUT-based logic with dedicated arithmetic paths, and the MLAB (Memory Logic Array Block) which can operate as either distributed SRAM or as additional logic. Hard IP blocks for transceivers, PCIe, and external memory controllers free up logic resources and reduce latency compared to soft implementations. Power is managed via the PowerPlay toolkit with fine-grained quiescent power gating.
Typical applications include 40G/100G line card packet processing, OTN/SONET framer designs, ASIC and DSP prototyping, high-frequency trading accelerators, and broadcast video processing. The integrated transceivers and high logic density make it well suited for protocol bridging and high-throughput data aggregation where deterministic latency is required.
When designing with this device, pay close attention to PCB escape routing for the 1517-ball FCBGA; high-speed transceiver channels require impedance-controlled differential pairs and length matching. Plan power sequencing across multiple supply rails (0.9 V core, 1.1 V transceiver, 1.8 V/2.5 V/3.3 V I/O) and consult the Stratix IV GX Handbook for transceiver channel placement rules. Configuration via JTAG or fast passive parallel mode is required at every power-up.
This page synthesizes Intel distributor pricing, verified drop-in alternatives from the same Stratix IV GX family, and engineering design notes that go beyond what the manufacturer datasheet alone provides.
Mga alternatibo na pwedeng ilagay na EP4SGX360KF40I3N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP4SGX360KF40I3N (parehas na form factor at footprint) — pagkakaiba sa Package, Speed Grade, Process Technology, Operating Temperature, Embedded Memory.
EP4SGX360KF40I3
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX360KF40C3N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX360KF40C4N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX360KF40I4N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX360KF40C3
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX360KF40C2N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX360KF40C2
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX360KF40I3N Mga Pinakamataas na Rating at Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| Embedded Memory (bits) | 23,105,536 |
| User I/O Pins | 744 |
| Transceiver Data Rate | Up to 8.5 Gbps |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Packhaging | 1517-BGA, FC-FBGA |
| Uri ng Pagpapasok | Surface Mount |
| Temperature na Operasyon | -40C to +100C (Industrial, I3 grade) |
| Tindminan RoHS | Compliant |
| Lead-Free | Yes |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel |
| Hard IP Blocks | PCIe Gen1/Gen2, External Memory Controllers |
Gabay sa Pin Configuration ng EP4SGX360KF40I3N 1517-bga, fc-fbga
Pin configuration para sa EP4SGX360KF40I3N (1517-bga, fc-fbga package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP4SGX360KF40I3N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP4SGX360KF40I3N ay nararapat para sa 6 aplikasyons: 40G/100G Telecom Line Card Packet Processing, ASIC and DSP Prototyping, High-Frequency Trading Accelerators, Broadcast Video Processing and Format Conversion, Industrial Control and Automation Backplanes, Medical Imaging Front-End Processing.
40G/100G Telecom Line Card Packet Processing
The EP4SGX360KF40I3N is well suited to 40G and 100G line card designs because it combines 353,600 logic elements with embedded transceivers up to 8.5 Gbps. Multiple transceiver channels can be aggregated to feed OTN framer, packet parser, and traffic manager blocks, while the abundant on-chip memory (23 Mbits) provides deep packet buffers. Compared with ASIC-only predecessors, this FPGA cuts development time from years to months while still hitting line-rate forwarding performance.
Inirekomenda
ASIC and DSP Prototyping
Designers use the EP4SGX360KF40I3N for ASIC and DSP prototyping because its 353,600 logic elements and abundant memory can hold multi-million-gate ASIC designs at full speed. The industrial temperature grade enables bring-up in harsh lab and field environments. Designers also benefit from Quartus II synthesis, simulation, and debug flows plus logic analyzer and SignalTap II integration, reducing prototype-to-silicon iteration time.
Inirekomenda
High-Frequency Trading Accelerators
In high-frequency trading systems the EP4SGX360KF40I3N is used to accelerate order-book matching, market-data fan-out, and risk checks where sub-microsecond latency is critical. The dedicated transceivers deliver market data into the FPGA at 10 Gbps line rate, while the parallel ALM fabric executes custom match engines in fewer clock cycles than a CPU. The industrial temperature grade and high logic density make it a strong fit for colocation rack-mounted trading appliances.
Inirekomenda
Broadcast Video Processing and Format Conversion
Broadcast studios deploy the EP4SGX360KF40I3N for SD/HD/3G-SDI routing, frame-rate conversion, color-space transformation, and HDR/SDR mapping. Its parallel processing fabric handles real-time multi-stream video at very low latency, while 8.5 Gbps transceivers support 3G-SDI and emerging 12G-SDI over coaxial cable. Industrial temperature operation also enables outdoor broadcast trucks and stadium installs.
Inirekomenda
Industrial Control and Automation Backplanes
The EP4SGX360KF40I3N is used as a backplane controller in factory automation and process control systems. Its 744 user I/O pins aggregate fieldbus signals (PROFIBUS, EtherCAT, RS-485) plus Ethernet, while the industrial temperature grade handles harsh factory environments. The embedded transceivers support SFP-based gigabit uplinks and deterministic low-latency control loops required for servo drives and robotic controllers.
Inirekomenda
Medical Imaging Front-End Processing
In ultrasound, CT, and MRI systems the EP4SGX360KF40I3N performs beamforming, channel equalization, and image reconstruction in real time. Its abundant DSP blocks and on-chip memory deliver the multiply-accumulate throughput needed for parallel image reconstruction algorithms. The industrial temperature grade supports continuous operation in controlled but thermally loaded equipment rooms, while the high I/O count aggregates many analog front-end channels.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP4SGX360KF40I3N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP4SGX360KF40I3 | EP4SGX360KF40C3N | EP4SGX360KF40C4N | EP4SGX360KF40I4N | EP4SGX360KF40C3 |
|---|---|---|---|---|---|---|
| Package | 1517-FCBGA (KF40) | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Logic Array Blocks (LABs) | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/O Pins | 744 | 744 | 744 | 744 | 744 | 744 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -3 | -3 | -3 | -4 (faster) | -4 (faster) | -3 |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
Pangunahing mga Pagkakaiba
- Highest-density Stratix IV GX variant in KF40 package (kumpara saEP4SGX230KF40I3N)
- Largest user I/O count in Stratix IV GX family (kumpara saEP4SGX360HF35I3N)
- Hard IP for PCIe and external memory controllers (kumpara saEP4CGX150DF31I7N)
Talaan ng Disenyo
The 1517-ball FC-FBGA package requires high-density PCB technology: microvia (laser-drilled or stacked), 1 oz copper on outer layers, and tight trace-and-space rules (typically 4 mil/4 mil or finer). Escape routing on the top layer is essentially impossible; plan a 1-2-1 or 1-2-2-1 stackup with via-in-pad if BGA breakout density is critical. Use the Stratix IV GX Pin-Out File to identify high-speed transceiver ball locations and route differential pairs first, with intra-pair skew target below 5 mil.
Provide independent decoupling for each power rail: 0.9 V core, 1.1 V transceiver analog (XCVR_VCC), 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V I/O banks, and the 2.5 V/3.0 V PLL analog supply. Place 0.1 uF X7R ceramic decoupling capacitors on every power pin pair as close to the BGA ball as possible, supplemented by bulk 10-47 uF tantalum or polymer capacitors near the package edges. Use PowerPlay early-power estimator in Quartus II to size your VRMs.
Do not mix the EP4SGX360KF40I3N with the EP4SGX360HF35I3N on the same PCB footprint - the HF35 1152-ball package has a different ball map. Also, verify that you have selected the correct Quartus II device library and pin assignments before generating the SOF/POF programming file, as some pin names differ between speed grades. Configuration mode (AS, PS, FPP, JTAG) is set by MSEL pins - do not leave them floating.
Impormasyon ng Pagsunod sa Kautusan
RoHS and lead-free compliance confirmed by Intel product datasheet and Bettlink/Besenchips listings. Halogen-free and conflict-mineral status not explicitly stated in the provided data.
