EP4SGX530HH35C2N - Stratix IV GX FPGA 531K LE | Intel | BGA-1152
MPN: EP4SGX530HH35C2N ✓ NakahandaEP4SGX530HH35C2N Ulas
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected by a programmable routing fabric. FPGAs sit within the broader hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix IV GX family specifically targets applications requiring multi-gigabit transceivers and parallel DSP performance, bridging the gap between ASIC-level integration and discrete logic design.
Key features include 21,248 adaptive logic modules (ALMs), 564 user I/O pins, embedded 8-input lookup tables (LUTs), dedicated DSP blocks, and hard PCI Express Gen1/Gen2 IP cores. The device operates from a 0.9 V core supply with auxiliary rails for transceivers and I/O banks, and supports I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL across multiple voltage-referenced banks.
The architecture combines a 40 nm process node with embedded transceivers capable of data rates up to 8.5 Gbps, enabling protocols such as PCIe Gen2, Serial RapidIO, XAUI, and custom serial links. Hard memory controllers and dedicated circuitry for DDR2/DDR3 SDRAM interfaces reduce soft-logic overhead and accelerate timing closure.
Typical applications include high-end telecommunications infrastructure (OTU/SONET/SDH line cards, baseband processing), high-performance computing acceleration, ASIC prototyping, broadcast video processing, and defense signal-intelligence systems. The transceiver-rich fabric suits designs requiring multiple high-speed serial links alongside deep logic capacity.
Designers should plan PCB layout for a 1152-ball flip-chip BGA with high-speed transceiver channels routed with controlled impedance. Decoupling strategy must address the multi-rail power architecture: separate core, PLL, transceiver, and I/O bank supplies each require their own bypass network. Thermal management is critical because the 42.5 mm package body concentrates significant power dissipation across the substrate.
This page synthesizes distributor pricing, drop-in alternatives, design considerations, and lifecycle status that go beyond the manufacturer datasheet itself, providing engineering decision support for Stratix IV GX selections.
Mga alternatibo na pwedeng ilagay na EP4SGX530HH35C2N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP4SGX530HH35C2N (parehas na form factor at footprint) — pagkakaiba sa Package, Operating Temperature, Transceivers, Speed Grade, Mounting Type.
EP4SGX530HH35C2
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX530HH35C3N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX530HH35C4N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX530KF40C2N
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
EP4SGX530NF45C2N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX530HH35C2N Mga Pinakamataas na Rating at Electrical Characteristics
| Device Type | FPGA - Field Programmable Gate Array |
| Series | Stratix IV GX |
| Logic Elements (LE) | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 |
| Embedded Memory | 28,033,024 bits |
| Logic Cells / LABs | 21,248 LABs |
| User I/O Pins | 564 |
| Packhaging | 1152-BBGA, FCBGA (FC-HFBGA) |
| Package Size | 42.50 mm x 42.50 mm |
| Volte ng Pagbibigay | 0.9 V (core) |
| Internal Frequency | 800 MHz (max) |
| Temperature na Operasyon | 0C to +85C (commercial) |
| Uri ng Pagpapasok | Surface Mount |
| Level ng MSL | 3 |
| Tindminan RoHS | Compliant |
| Transceiver Data Rate | up to 8.5 Gbps |
| PCIe Hard IP | Gen1 / Gen2 |
Gabay sa Pin Configuration ng EP4SGX530HH35C2N 42.50 mm x 42.50 mm
Pin configuration para sa EP4SGX530HH35C2N (42.50 mm x 42.50 mm package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP4SGX530HH35C2N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP4SGX530HH35C2N ay nararapat para sa 6 aplikasyons: Telecommunications Line Cards, ASIC Prototyping, High-Performance Computing Acceleration, Broadcast Video Processing, Defense Signal Intelligence, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP4SGX530HH35C2N's 531,200 logic elements and 8.5 Gbps multi-gigabit transceivers deliver the throughput required for OTN/SONET/SDH line cards and metro Ethernet aggregation. Its hard PCI Express Gen2 cores enable direct backplane connectivity to host processors without external bridging chips, while 28 Mbits of embedded memory absorb packet buffers and lookup tables. The 1152-ball FC-HFBGA package consolidates 564 user I/Os onto a single substrate, simplifying multi-channel fronthaul designs.
Inirekomenda
ASIC Prototyping
Designers use the EP4SGX530HH35C2N as an ASIC prototyping platform because its high logic density and ample I/O bandwidth allow full emulation of complex ASICs before tape-out. The Quartus II design flow accepts RTL targeted at the FPGA and later maps to a synthesized ASIC netlist, accelerating verification cycles. Embedded transceivers and PCIe cores allow the prototype to mirror real-world ASIC interfaces without external components.
Inirekomenda
High-Performance Computing Acceleration
The EP4SGX530HH35C2N accelerates HPC workloads such as FFT, FIR filtering, and matrix operations through dedicated DSP blocks distributed across the fabric. Each DSP block operates at up to 600 MHz in commercial grade, allowing engineers to build deep pipelines that offload compute from host CPUs. The 564 user I/Os provide sufficient DDR3 memory channels for high-bandwidth external memory access.
Inirekomenda
Broadcast Video Processing
The EP4SGX530HH35C2N processes uncompressed broadcast video streams in real time, supporting SDI, HDMI, and DisplayPort interfaces through IP cores mapped to its transceivers and parallel I/O banks. Its 28 Mbits of embedded memory act as line buffers and frame stores, reducing the need for external SRAM. Commercial temperature grade and high logic density suit studio and head-end equipment.
Inirekomenda
Defense Signal Intelligence
Defense signal-intelligence (SIGINT) systems leverage the EP4SGX530HH35C2N's parallel DSP blocks and high-speed transceivers for wideband digital signal acquisition, demodulation, and decoding. The Stratix IV GX family is widely deployed in electronic-warfare subsystems where reconfigurability matters. Designers pair the FPGA with high-speed ADCs and DACs through the device's 564 I/O channels.
Inirekomenda
Test and Measurement Instrumentation
Test and measurement instruments, including protocol analyzers, oscilloscopes, and BERT testers, use the EP4SGX530HH35C2N to capture and generate high-speed serial traffic for compliance testing. The integrated 8.5 Gbps transceivers handle standards like PCIe, SATA, XAUI, and Serial RapidIO without external PHYs. Embedded memory buffers raw data streams before post-processing by host software.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP4SGX530HH35C2N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP4SGX530HH35C2 | EP4SGX530HH35C3N | EP4SGX530HH35C4N | EP4SGX530KF40C2N | EP4SGX530NF45C2N |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA (FC-HFBGA), 42.5x42.5 mm | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Embedded Memory (bits) | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 |
| Speed Grade | C2 (commercial, 8.5 Gbps transceivers) | C2 | C3 (faster Fmax) | C4 (highest Fmax) | C2 (lower transceiver speed) | C2 (slowest Fmax) |
| User I/O Pins | 564 | 564 | 564 | 564 | 564 | 564 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Pangunahing mga Pagkakaiba
- Lowest-speed grade (C2) for power-sensitive designs (kumpara saEP4SGX530HH35C4N)
- Highest transceiver speed bin (H35 vs F40/N45) (kumpara saEP4SGX530KF40C2N / EP4SGX530NF45C2N)
- Maximum logic density in Stratix IV GX family (kumpara saEP4SGX360 / EP4SGX290 lower-density Stratix IV GX variants)
Talaan ng Disenyo
Estimated: design the PCB for a 1152-ball FC-HFBGA with 1.0 mm pitch, requiring HDI microvia stack-up with at least 4-6 routing layers. Use laser-drilled vias and 0.4 mm trace/space rules. Allocate dedicated transceiver channels on outer layers for 8.5 Gbps signaling with controlled impedance (100 ohm differential), and keep AC coupling capacitors within 200 mil of each transceiver ball.
The EP4SGX530HH35C2N requires multiple supply rails: 0.9 V core, 1.1 V/1.2 V PLLs and transceivers, plus per-bank VCCIO supplies. Decoupling must follow Intel's Stratix IV GX PDN guidelines: place 0.1 uF and 10 uF ceramic capacitors adjacent to each rail pin, and use a bulk capacitor network near the regulator. Estimate a minimum 60 A peak on the 0.9 V rail for typical logic utilization; size the DC-DC converter accordingly.
Estimated: with 531K LE at high toggle rates and active transceivers, junction temperature can approach 100C. The FC-HFBGA exposes the die top for heatsink attach; use a thermal interface material (TIM) with conductivity above 3 W/mK and a heatsink rated for 10-15 W dissipation. Validate with the Stratix IV PowerPlay early-power estimator before tape-out.
Differential transceiver pairs (8.5 Gbps) require matched-length routing within 5 mil tolerance and continuous reference planes. Use a SerDes IBIS-AMI model from Intel for channel simulation, and verify pre-emphasis and equalization settings with the Quartus II Transceiver Toolkit. Stagger AC-coupling caps to minimize common-mode discontinuities.
Do not assume pin compatibility with other Altera FPGAs - the 1152-ball FC-HFBGA pinout is unique to the EP4SGX530 family. Migrating to Stratix V requires a footprint change. Always generate pin assignments with Quartus II pin planner and check the design against the latest device errata before fabrication.
Impormasyon ng Pagsunod sa Kautusan
RoHS and REACH compliant per Intel (formerly Altera) product documentation. Not AEC-Q100 qualified - FPGAs are typically not automotive-grade unless explicitly labeled.
