EP4SGX530HH35I3N - Stratix IV GX FPGA, 531K LE, 1152-BGA | Intel
MPN: EP4SGX530HH35I3N ✗ Tapus ng BuhayEP4SGX530HH35I3N Ulas
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, interconnect fabric, and dedicated silicon resources such as block RAM, DSP slices, and (in modern families) hardened transceivers and processor cores. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> high-performance FPGA -> system-on-chip FPGA. Unlike a fixed-function ASIC, an FPGA is reprogrammed in-system to implement arbitrary digital logic, parallel processing pipelines, or hardware accelerators. The Stratix IV family targets mid-to-high-end designs where ASIC-like performance is needed without the NRE cost of mask-set production.
Key features of the EP4SGX530HH35I3N include 21,248 adaptive logic modules (ALMs), 1,290 Kbits of MLAB memory plus dedicated M9K and M144K block RAM blocks, 1,024 DSP blocks (18x18 multipliers), 24 full-duplex transceivers operating up to 8.5 Gbps, and eight PLLs with fractional support. The part ships in the commercial (I) temperature grade, supports hot-socketing, and provides PCI-SIG compliant PCIe hard IP. Hard memory controllers and partial reconfiguration capability are standard Stratix IV features.
The EP4SGX530HH35I3N targets high-throughput digital designs: ASIC prototyping, high-speed data acquisition, video broadcast infrastructure, 40G/100G line-card MACs, radar baseband, and software-defined radio. With PCIe Gen2 x4/x8 hard IP and 8.5 Gbps transceivers, it is commonly used in test equipment, medical imaging, and defense signal-processing platforms. The 1152-ball FCBGA package requires a 1.0 mm pitch PCB land pattern and a multi-layer PCB with controlled-impedance routing.
When designing with this device, ensure your PCB stack-up supports 100-ohm differential routing for the transceiver channels and provides adequate decoupling (typically 0402/0201 ceramics in a dense pattern under the BGA). JTAG and active serial configuration via EPCS or enhanced EPCQ flash is supported. Quartus II design software (v13.0+ for legacy Stratix IV) is required; Altera ModelSim or Questa is recommended for RTL simulation.
This page synthesizes distributor pricing, verified drop-in Stratix IV GX siblings, and practical design considerations not consolidated in the manufacturer datasheet.
Mga alternatibo na pwedeng ilagay na EP4SGX530HH35I3N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP4SGX530HH35I3N (parehas na form factor at footprint) — pagkakaiba sa Package, Operating Temperature, Speed Grade, Transceivers, Mounting Type.
EP4SGX530HH35C4N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX530HH35C3N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX530HH35I3
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX530HH35C2N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX530HH35C4
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4SGX530HH35I3N Mga Pinakamataas na Rating at Electrical Characteristics
| Family | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 |
| Embedded Memory (bits) | 28,033,024 |
| Logic Blocks / LABs | 21,248 |
| Maximum User I/Os | 564 |
| DSP Blocks | 1,024 (18x18 multipliers) |
| Transceivers | 24 channels |
| Transceiver Data Rate (max) | 8.5 Gbps |
| PLLs | 8 (fractional support) |
| Temperature na Operasyon | -40C to +85C (industrial) |
| Internal Frequency (max) | 800 MHz |
| Packhaging | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount (BGA) |
| Tindminan RoHS | Compliant |
| Lead-Free | Yes |
| Level ng MSL | 3 |
| Process Node | 40 nm |
Gabay sa Pin Configuration ng EP4SGX530HH35I3N 1152-ball fcbga (hbga), 42.5 x 42.5 mm, 1.0 mm pitch
Pin configuration para sa EP4SGX530HH35I3N (1152-ball fcbga (hbga), 42.5 x 42.5 mm, 1.0 mm pitch package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP4SGX530HH35I3N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP4SGX530HH35I3N ay nararapat para sa 6 aplikasyons: ASIC Prototyping and Emulation, High-Speed Data Acquisition Systems, 40G/100G Line-Card MAC Processing, Software Defined Radio (SDR) Baseband, Medical Imaging (CT/MRI Reconstructors), Video Broadcast and Production Infrastructure.
ASIC Prototyping and Emulation
The EP4SGX530HH35I3N's 531K logic elements and 28 Mbits of block RAM make it ideal for ASIC prototyping where designers map millions of gates of ASIC RTL into FPGA fabric for verification before tape-out. With 1,024 DSP blocks operating at up to 550 MHz, the device can emulate DSP-heavy ASICs (e.g. baseband modems, video codecs, cryptographic accelerators) at near-ASIC speed. Quartus II incremental compilation and partial reconfiguration allow multiple engineers to iterate independently on the same silicon. For multi-FPGA partitioning, the 24 transceivers provide the high-speed chip-to-chip links needed to bridge multiple FPGAs in an emulation farm.
Inirekomenda
High-Speed Data Acquisition Systems
The EP4SGX530HH35I3N's 24 transceivers at 8.5 Gbps aggregate to >200 Gbps of serial I/O bandwidth, suitable for high-speed digitizer cards, oscilloscope front-ends, and radar baseband digitizers. The 1,024 DSP blocks enable real-time FFTs, channelization, and beam-forming at multi-GSPS sample rates without external DSPs. The large embedded memory (28 Mbits) buffers deep capture windows before host transfer. PCIe Gen2 x8 hard IP provides >3 GB/s host throughput for real-time streaming to CPU/GPU processing pipelines.
Inirekomenda
40G/100G Line-Card MAC Processing
In telecom line-card applications, the EP4SGX530HH35I3N implements 40G/100G Ethernet MACs, OTN framer/mappers, and packet processors. The device's hard PCIe Gen2 and 8.5 Gbps transceivers map cleanly to OTU2/OTU3 client-side optics (CFP/CFP2 modules) via SFP+ breakout or direct attach. Multiple MAC instances (up to ~20-30 10G ports) fit comfortably thanks to 531K logic elements and abundant block RAM for packet buffering. The industrial temperature grade supports outdoor telecom equipment deployments.
Inirekomenda
Software Defined Radio (SDR) Baseband
The EP4SGX530HH35I3N is widely deployed in military and commercial SDR baseband processing where wideband ADC/DAC data streams must be channelized, demodulated, and decoded in real time. The 1,024 DSP blocks (18x18 multipliers at 550 MHz) deliver ~2.4 TMACS of DSP throughput, sufficient for multiple wideband DDC/DUC channels and physical-layer processing of LTE/WiMAX/UMTS waveforms. Transceivers connect directly to RF front-end ADCs/DACs (e.g. AD9680, AD9144) at JESD204B data rates. Partial reconfiguration enables runtime waveform switching.
Inirekomenda
Medical Imaging (CT/MRI Reconstructors)
In CT and MRI image reconstruction systems, the EP4SGX530HH35I3N performs back-projection and iterative reconstruction algorithms in real time at sub-second frame rates. The 531K logic elements and abundant DSP slices accelerate FDK cone-beam and iterative reconstruction kernels. PCI-SIG-compliant PCIe Gen2 hard IP simplifies interface to the host workstation. The 1152-FCBGA package is suitable for board-mount in chassis-resident imaging cards. Medical-grade designs benefit from the -40C to +85C industrial temperature range for reliability in controlled-environment installations.
Inirekomenda
Video Broadcast and Production Infrastructure
The EP4SGX530HH35I3N is widely used in video broadcast routers, multi-viewers, and contribution codecs where uncompressed 3G-SDI / 12G-SDI / IP-video streams need real-time processing. Up to 24 transceivers handle dozens of SDI streams or multiple 10G Ethernet video channels. The block RAM serves as line/frame buffers for video processing pipelines, while the 1,024 DSP blocks accelerate video scaling, color-space conversion, and compression pre-processing. PCI Express Gen2 links to host CPUs for playlist and control integration.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP4SGX530HH35I3N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP4SGX530HH35C4N | EP4SGX530HH35C3N | EP4SGX530HH35I3 | EP4SGX530HH35C2N | EP4SGX530HH35C4 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-ball FCBGA (HH35), 42.5x42.5 mm | 1152-ball FCBGA (HH35) - same | 1152-ball FCBGA (HH35) - same | 1152-ball FCBGA (HH35) - same | 1152-ball FCBGA (HH35) - same | 1152-ball FCBGA (HH35) - same |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Embedded Memory (Mbits) | 27.36 (28,033,024 bits) | 27.36 | 27.36 | 27.36 | 27.36 | 27.36 |
| DSP Blocks | 1,024 | 1,024 | 1,024 | 1,024 | 1,024 | 1,024 |
| Speed Grade | I3 | C4 (fastest) | C3 | I3 | C2 (slower) | C4 |
| Operating Temperature | -40C to +85C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +85C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Transceivers | 24 channels @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Pangunahing mga Pagkakaiba
- Highest-density member of Stratix IV GX HH35 package line (kumpara saEP4SGX360HF35I3N)
- Industrial -40C to +85C temperature range (kumpara saEP4SGX530HH35C4N)
- Same-die family enables transparent Quartus recompilation (kumpara saEP4SGX230KF40I3N)
Talaan ng Disenyo
The 1152-ball FCBGA at 1.0 mm pitch demands a 12+ layer PCB stack-up with controlled-impedance routing for the 24 transceiver channels. Use 100-ohm differential pairs with length matching to within 5 mils for transceiver traces. Provide dense power decoupling (10uF bulk + 0.1uF/0.01uF/0.001uF ceramics) under the BGA. Estimated: total PCB thickness ~3.2 mm with 4 ground/power planes to deliver clean power and minimize crosstalk on SERDES lanes.
Estimated: at full utilization (531K LE @ ~70% toggle, 24 transceivers active), the EP4SGX530HH35I3N can dissipate 15-25 W. The FCBGA package theta_JA is approximately 0.5 C/W with a properly designed heat-sink-attached thermal solution, requiring forced airflow (at least 200 LFM) for reliable operation. Use thermal interface material rated for the -40C to +85C industrial range. Without active cooling, junction temperature can exceed 100C, triggering thermal throttle or damage.
Place the EPCQ configuration flash within 2 inches of the FPGA's active serial (AS) configuration pins to minimize signal integrity issues. JTAG chain needs TCK pull-down and TMS pull-up; route the JTAG signals away from noisy power planes. Differential transceiver pairs should reference a continuous ground plane and avoid layer transitions where possible. Estimated: total transceiver channel loss budget of ~10 dB at 8.5 Gbps for typical FR-4 traces less than 8 inches.
Do not assume the EP4SGX530HH35I3N is in active production - confirm NRND status before committing to long-term designs; Intel recommends Stratix V (5SGXEA7K1F40C2N) or newer for new platforms. Configuration mode mismatch (AS vs JTAG vs PS) is a common failure cause; verify MSEL pins are set correctly per the configuration scheme used. The I3 speed grade is the slowest of the I-grade family; do not substitute I2/I1 (which do not exist) and verify timing closure before tape-out.
Impormasyon ng Pagsunod sa Kautusan
RoHS compliant per Altera/Intel product declaration (suffix 'N'). Not AEC-Q100 qualified - FPGAs are not typical AEC-Q100 parts. Lead-free terminal finish per RoHS requirements.
