Intel

EPF81500ARC304-2 - FLEX 8000 FPGA 16K Gates 304-BFQFP | Intel

MPN: EPF81500ARC304-2 ✗ Tapus ng Buhay
5 V Vdss 304-BFQFP (RQFP) Package 125 MHz Speed
MOQ: 1 |

EPF81500ARC304-2 Ulas

The Intel EPF81500ARC304-2 is a FLEX 8000 family Field Programmable Gate Array (FPGA) IC offering 16,000 usable gates, 1,296 logic cells (logic elements), and 208 user I/O pins, housed in a 304-pin BFQFP (RQFP) package. The device is fabricated on a 0.42 µm CMOS SRAM process with 5 V core supply and supports system speeds up to 125 MHz. As a member of the FLEX 8000 register-rich PLD family, it provides 1,500 flip-flop-based registers and an interconnect fabric optimized for high fan-out and predictable timing.

A Field Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells that engineers can wire to implement arbitrary digital logic. In the system hierarchy, FPGAs sit between fixed-function ASICs (lower flexibility, lower NRE) and CPLDs (lower density, non-volatile) and are widely used as glue logic, accelerator blocks, and prototyping vehicles. The FLEX 8000 family, in particular, is a register-rich SRAM-based architecture suitable for state machines, datapath control, and bus interfacing where deterministic register-to-register timing is required.

Key features of the EPF81500ARC304-2 include in-circuit reconfigurability (ICR) via an external serial or parallel EPROM configuration device (EPC1, EPC1064, EPC1213, EPC1441), 304-pin BFQFP package with 208 user I/Os for high pin-count glue-logic and bus-interface designs, 5 V tolerant I/O with PCI-compliant drive options, JTAG-based boundary-scan test support, and built-in MAX+PLUS II toolchain support for VHDL, Verilog, and waveform design entry. The device is fully static and operates across the commercial temperature range.

Typical applications for the EPF81500ARC304-2 span glue logic in industrial controllers, peripheral bus interfacing (ISA, PCI bridge glue), high-density state-machine controllers, ASIC prototyping vehicles, and legacy telecom/datacom backplane control. The 208 I/Os allow direct connection to wide parallel buses and multiple peripheral interfaces without external bus expander logic.

When designing with the EPF81500ARC304-2, the engineer must implement a configuration scheme: select a serial (EPC1) or parallel (EPC1064/1213/1441) configuration EPROM, or use an intelligent host controller to load configuration data at every power-up. ICR allows in-field reconfiguration without powering down the board, a defining FLEX 8000 advantage over older one-time-programmable PLDs.

This page synthesizes distributor pricing across DigiKey, Mouser, Heisener, Xecor, and Wolfchip; drop-in and pin-compatible variants of the same FLEX 8000 family; and practical design notes on configuration memory, JTAG, and 5V I/O termination that are not consolidated in the manufacturer datasheet.

Mga alternatibo na pwedeng ilagay na EPF81500ARC304-2 — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.

Variante sa Seri na ito

Katulad na modelo sa serye na katugma sa pagpasok EPF81500ARC304-2 (parehas na form factor at footprint) — pagkakaiba sa Configuration Method, Process Technology, Usable Gates, RoHS Status.

Intel
Configuration Method: In-Circuit Reconfigurable (ICR) via external device or controller
Process Technology: 0.42 µm CMOS EPROM
RoHS Status: Compliant
Ikabit sa EPF81500ARC304-2 →
Altera
Configuration Method: Serial or parallel EPROM, EPC1/EPC1213/EPC1064/EPC1441, or microcontroller
Process Technology: 0.42 µm CMOS, SRAM-based
Usable Gates: 16,000 (max)
Ikabit sa EPF81500ARC304-2 →

EPF81500ARC304-2N

✅ Drop-In
📦 304-BFQFP (RQFP)
Same 304-BFQFP die, lead-free terminal finish variant; identical pinout, 16K gates, 208 I/O; drop-in replacement when lead-free compliance is required

📋 Alternatibo na Reference (hindi sa katalogo)

EPF81500ARC304-3

✅ Drop-In
Intel
📦 304-BFQFP (RQFP)
FLEX 8000 · 16,000 · 1,296 · 1,500 · 208 · 304-BFQFP (RQFP) · 5 V · 0.42 µm CMOS EPROM

Magkontak para sa presyo

Tingnan ang Datasheet →
ℹ️ 3 cross-package na parte(s) nakalipas – ibang pakete ay nangangailangan ng muling pagpapasok ng PCB at hindi tunay na pumapalit na walang pagbabago. Magkontak sa amin kung kailangan mo ng mga rekomendasyon sa ibang pakete.

EPF81500ARC304-2 Mga Pinakamataas na Rating at Electrical Characteristics

Family FLEX 8000
Product Type FPGA (Field Programmable Gate Array)
Usable Gates 16,000
Logic Elements / Cells 1,296
Registers 1,500
User I/O Pins 208
Packhaging 304-BFQFP (RQFP)
Process Technology 0.42 µm CMOS SRAM
Core Supply Voltage 5 V
Maximum Operating Frequency 125 MHz
Configuration Method Serial EPROM, Parallel EPROM, or intelligent controller
Supported Config Devices EPC1, EPC1064, EPC1213, EPC1441
In-Circuit Reconfigurability (ICR) Yes
JTAG Boundary Scan Yes
Development Tool Altera MAX+PLUS II (VHDL, Verilog, waveform)
Uri ng Pagpapasok Surface Mount

Gabay sa Pin Configuration ng EPF81500ARC304-2 304-bfqfp (rqfp)

Pin configuration para sa EPF81500ARC304-2 (304-bfqfp (rqfp) package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.

Pinout diagram ng 304-bfqfp (rqfp) package para sa EPF81500ARC304-2

Wala ng detalyadong pinout data na magagamit para sa EPF81500ARC304-2.

Sumangguni sa datasheet para sa buong pin configuration.

Tipikal na mga Gamit

EPF81500ARC304-2 ay nararapat para sa 6 aplikasyons: Industrial Glue Logic Controller, PCI Bridge / Bus Interface Logic, ASIC Prototyping Vehicle, Legacy Telecom Backplane Control, High-Density State-Machine Controller, JTAG-Based Production Programming Station.

🏭

Industrial Glue Logic Controller

The EPF81500ARC304-2 fits industrial glue-logic controller applications where multiple asynchronous buses (ISA, parallel I/O, proprietary backplanes) must be merged into a unified interface. Its 208 user I/Os and 1,500 registers provide enough fan-out and state-holding capacity for mid-density control panels, motor-driver interfaces, and sensor-multiplexer control. The 5 V I/O is directly compatible with TTL logic levels common in legacy industrial controllers, eliminating the need for level shifters. FLEX 8000 deterministic timing allows precise sequencing of relay drivers and stepper-motor pulses. The 304-BFQFP package's high pin count suits designs with many parallel signal paths to the controlled system.

🖥️

PCI Bridge / Bus Interface Logic

The EPF81500ARC304-2 fits PCI bridge and bus-interface applications requiring high I/O density with predictable timing. Its 208 user I/Os can absorb a 32-bit multiplexed address/data bus, command and byte-enable signals, plus interrupt and arbitration sidebands, without external bus-expanders. The device's 5 V I/O with PCI-compliant drive strength meets PCI 2.1 electrical specs for legacy add-in card designs. The 1,500 registers provide ample state-machine resources for burst-mode transfer control, target-termination state machines, and configuration-space registers. JTAG boundary-scan verifies card-level interconnect post-assembly, and ICR enables firmware updates to the bridge glue without removing the card from the chassis.

🔧

ASIC Prototyping Vehicle

The EPF81500ARC304-2 serves as a prototype vehicle for ASIC designs under 16,000 gates during pre-silicon validation. Engineers can map their RTL (VHDL/Verilog) directly into FLEX 8000 logic cells using MAX+PLUS II, validating functional correctness at 125 MHz before committing to NRE-bearing ASIC masks. The 208 I/Os map easily to standard ASIC I/O libraries for early bench testing, and JTAG provides a debug port for probing internal states. ICR allows rapid design-iteration cycles (compile, program, run, observe) measured in minutes rather than weeks. After ASIC tape-out, the same RTL can be reused; the FPGA is repurposed or removed from the BOM.

🌐

Legacy Telecom Backplane Control

The EPF81500ARC304-2 fits legacy telecom backplane-control applications where 5 V TTL signalling, high I/O density, and register-rich state machines are required. Telecom backplanes often carry many control lines (alarm, status, switch fabric management) that need fan-out logic, parity generators, and address decoding - all well-served by FLEX 8000's register-heavy architecture. The 5 V I/O is directly compatible with legacy telecom backplane drivers. The 304-BFQFP package supports the dense connector pinout required for multi-slot backplane cards. In-circuit reconfigurability allows telecom service providers to update control logic without removing the card from the live chassis, minimizing service interruptions.

🔧

High-Density State-Machine Controller

The EPF81500ARC304-2 fits state-machine controller applications where 1,500 registers are needed to hold dozens of parallel state machines for protocol handling, motor sequencing, or instrument control. Each FLEX 8000 logic element contains a register, so the 1,500-register count translates directly to 1,500 state bits, supporting complex multi-state controllers like MIL-STD-1553 bus controllers, HDLC framer/deframer state machines, or multi-axis CNC interpolators. The 125 MHz maximum frequency supports fast bus rates. JTAG allows real-time state observation for debug, and the MAX+PLUS II simulator provides cycle-accurate verification before hardware integration.

🖥️

JTAG-Based Production Programming Station

The EPF81500ARC304-2 fits production programming stations where the FPGA is used as a JTAG-controlled reconfigurable test fixture for board-level boundary-scan tests. The 208 user I/Os are wired to the UUT (unit-under-test) connector pins, and the FPGA is reconfigured on the fly to drive different test vectors for each product variant. FLEX 8000 ICR (in-circuit reconfigurability) lets the test fixture switch between product test programs in milliseconds, supporting high-volume production test throughput. The 5 V I/O is robust against factory floor ESD/EMI conditions. The legacy Altera MAX+PLUS II toolchain continues to compile new test programs and generate EPC1-compatible bitstreams.

Buod ng mga Inirekomendang Produkto

EPC1064 Parallel configuration EPROM for FLEX 8000 Ginagamit sa: Industrial Glue Logic Controller, High-Density State-Machine Controller EPC1 Serial configuration EPROM (8-pin DIP) Ginagamit sa: Industrial Glue Logic Controller, Legacy Telecom Backplane Control, JTAG-Based Production Programming Station EPC1213 Parallel configuration EPROM, larger density Ginagamit sa: PCI Bridge / Bus Interface Logic EPF10K50VRC240-3 Intel Ginagamit sa: PCI Bridge / Bus Interface Logic EPF10K70RC240-3N Intel Ginagamit sa: ASIC Prototyping Vehicle EPC1441 Largest FLEX 8000 parallel configuration EPROM Ginagamit sa: ASIC Prototyping Vehicle, JTAG-Based Production Programming Station EPF6024AQC208-2 Intel Ginagamit sa: Legacy Telecom Backplane Control EPF81188ARC240-3 Altera Ginagamit sa: High-Density State-Machine Controller
What is the EPF81500ARC304-2?
The EPF81500ARC304-2 is an Intel (formerly Altera) FLEX 8000 family FPGA with 16,000 usable gates, 1,296 logic cells, 1,500 registers, and 208 user I/Os in a 304-pin BFQFP (RQFP) package. According to the Altera FLEX 8000 datasheet, it is a register-rich CMOS SRAM-based programmable logic device with in-circuit reconfigurability, fabricated on 0.42 µm technology and operating from a 5 V core supply at speeds up to 125 MHz.
What is the operating voltage of the EPF81500ARC304-2?
The EPF81500ARC304-2 operates from a 5 V core supply with 5 V tolerant I/O. According to the FLEX 8000 datasheet, the device is fully static and supports PCI-compliant I/O drive. Configuration is loaded at power-up from a serial EPC1, parallel EPC1064/EPC1213/EPC1441 EPROM, or an intelligent controller, after which the SRAM cells drive the logic implementation.
How many user I/O pins does the EPF81500ARC304-2 have?
The EPF81500ARC304-2 provides 208 user I/O pins. According to the Altera product listing on DigiKey, this high pin count supports wide parallel bus interfaces (ISA, PCI bridge glue), multi-peripheral bridging, and backplane control applications where many simultaneous GPIO, address, and data lines must be routed to the FPGA.
What configuration devices does the EPF81500ARC304-2 support?
The EPF81500ARC304-2 supports Altera EPC1 (serial), EPC1064, EPC1213, and EPC1441 (parallel) configuration devices. According to the FLEX 8000 datasheet, configuration is loaded automatically at system power-up from CMOS SRAM cells, and in-circuit reconfigurability (ICR) allows the design to be updated without powering down the board.
Is the EPF81500ARC304-2 still in production?
No, the EPF81500ARC304-2 is an obsolete part. The original Altera FLEX 8000 family was succeeded by FLEX 10K, then Cyclone, and current mainstream Stratix/Agilex families. Per Heisener and Wolfchip distributor listings (fetched 2026-09-12), the part is currently available only from authorized excess stock distributors, and pricing reflects this scarcity.
Where can I buy the EPF81500ARC304-2?
The EPF81500ARC304-2 is available from authorized excess stock distributors including DigiKey, Heisener, Xecor, Wolfchip, Veswin, Jotrin, and WIN SOURCE. Per distributor inventory data fetched 2026-09-12, Wolfchip reports in stock, and Heisener reports 4,912 pcs with Oct 25 - Oct 30 estimated delivery. Pricing varies by distributor; compare before ordering.
What is the price of the EPF81500ARC304-2?
As of 2026-09-12, distributor pricing for the EPF81500ARC304-2 ranges from approximately $92.50 per unit at 1,000-piece volume to $145.00 per unit at single-piece quantity, reflecting its scarcity and obsolete lifecycle status. Heisener and Veswin mark the part as 'Request for Quote' for live pricing. Always request multiple quotes before placing an order.
What is the lead time for the EPF81500ARC304-2?
Lead time for the EPF81500ARC304-2 is generally 5-7 business days for in-stock parts at Wolfchip, DigiKey, or Xecor, and 2-4 weeks for special-order or back-ordered requests through Heisener. Per Heisener's 2026-09-12 inventory entry, estimated delivery for in-stock parts is Oct 25 - Oct 30, with expedited shipping available for an additional fee.
Is the EPF81500ARC304-2 in stock?
Yes, the EPF81500ARC304-2 is in stock at multiple authorized distributors as of 2026-09-12. Wolfchip reports 18,875 pieces, Heisener reports 4,912 pieces, and Veswin/Jotrin list available stock for RFQ. Since the part is obsolete, verify authorized-distributor authenticity and warranty terms before procurement.
What is the best drop-in replacement for the EPF81500ARC304-2?
The best drop-in replacement for the EPF81500ARC304-2 is the EPF81500ARC240-2 (same FLEX 8000 family, 240-pin RQFP package, same die) if your PCB footprint allows the smaller package; otherwise EPF81500ARC304-2N (same 304-pin package, lead-free variant). For newer-generation compatibility, EPF10K70RC240-3N (FLEX 10K, 240-pin) is a common migration path but requires PCB rework.
Can I use the EPF81500ARC304-2 with MAX+PLUS II software?
Yes, the EPF81500ARC304-2 is fully supported by Altera MAX+PLUS II development software. Per the FLEX 8000 datasheet, MAX+PLUS II provides VHDL, Verilog HDL, and waveform design entry, compilation logic synthesis, simulation, and timing analysis. The tool generates EDIF 2.0.0 netlists and configuration bitstreams compatible with EPC1/EPC1064/EPC1213/EPC1441 configuration devices.
Where to download the EPF81500ARC304-2 datasheet PDF?
The EPF81500ARC304-2 datasheet PDF can be downloaded from the Altera datasheet archive at https://www.alterasemi.com/datasheet/alterasemi/EPF81500ARC304-2.pdf or from DigiKey's product page at https://www.digikey.com/en/products/detail/altera/EPF81500ARC304-2/4161740. The datasheet contains pinout, electrical characteristics, configuration timing, and JTAG boundary-scan descriptions.
Where to find the EPF81500ARC304-2 pinout?
The EPF81500ARC304-2 pinout is documented in the FLEX 8000 datasheet, which assigns all 304 pins of the BFQFP package including 208 user I/Os, dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0), JTAG pins (TCK, TMS, TDI, TDO), and supply/ground pins. The package is a 304-BFQFP (Bumpered Fine-pitch QFP) with 0.5 mm or 0.8 mm pitch as detailed in the datasheet package drawing.
EPF81500ARC304-2 vs EPF81500ARC240-2 - which should I choose?
Choose EPF81500ARC304-2 if your design requires 208 user I/O pins and uses the 304-BFQFP footprint; choose EPF81500ARC240-2 if your design needs 184 or fewer I/Os and can use the smaller 240-RQFP footprint (lower cost, smaller PCB area). Both share the same FLEX 8000 die and electrical characteristics; the difference is only the pin count and package. Migration from 240 to 304 requires a PCB redesign.
What are the key specifications of the EPF81500ARC304-2 that engineers should know?
Key specifications engineers must know for the EPF81500ARC304-2 are: 16,000 usable gates, 1,296 logic cells, 1,500 registers, 208 user I/Os, 304-pin BFQFP package, 0.42 µm CMOS SRAM process, 5 V core supply, 125 MHz maximum operating frequency, in-circuit reconfigurability (ICR), JTAG boundary-scan support, and configuration via EPC1/EPC1064/EPC1213/EPC1441 EPROMs. The device is obsolete; current Intel FPGA migration targets are Cyclone or MAX II families.
What is the best equivalent for the EPF81500ARC304-2 from a different brand?
There is no true cross-brand drop-in equivalent for the EPF81500ARC304-2 because Xilinx's contemporaneous XC4000-series and Lattice's ispMACH 4000-series devices use different bitstream formats, configuration schemes, and pinouts. For new designs, the recommended cross-brand migration is the Xilinx XC95144XL-10CSG144I (CPLD, lower density) or the Lattice ispMACH 4000V (CPLD), but both require PCB redesign and do not share the 304-BFQFP footprint.
Does the EPF81500ARC304-2 support JTAG boundary scan?
Yes, the EPF81500ARC304-2 supports IEEE 1149.1 JTAG boundary-scan test through its TCK, TMS, TDI, TDO, and TRST pins. Per the FLEX 8000 datasheet, the JTAG interface allows board-level interconnect testing, device programming, and post-assembly verification. The JTAG pins are 5 V tolerant and dedicated; they cannot be repurposed as user I/O.

Impormasyon ng Talumpati sa Engineering for EPF81500ARC304-2 — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.

Paunawang Hanapin

Choose the EPF81500ARC304-2 when your design requires 208 user I/Os and 16,000 gates in the FLEX 8000 family, with the -2 speed grade supporting 125 MHz fMAX. Choose EPF81500ARC304-2N if you need lead-free terminal finish for compliance (same die and footprint). Choose EPF81500ARC240-2 if your design needs ≤184 I/Os and can use the smaller 240-RQFP footprint (lower cost, easier PCB layout, but +0 I/O margin). Choose EPF81500AQC240-2 if you want the same 16K-gate silicon in a plastic QFP for cost-sensitive applications (also 240-RQFP). Choose EPF81500ARC304-3 only if you cannot source the -2 grade and your timing margin accommodates the slower speed grade. Choose EPF81188ARC240-3 if your design needs ≤8K gates and 100 I/Os and you prefer the more available 81188 stock.

Ikabit sa Mga Alternatibo

Parametro Ito ang Producto EPF81500ARC304-2N EPF81500ARC240-2 EPF81500AQC240-2 EPF81500ARC304-3 EPF81188ARC240-3
Brand Intel Intel Intel Intel Intel Intel
Package 304-BFQFP (RQFP) 304-BFQFP (RQFP) - same 240-RQFP - different footprint 240-RQFP - different footprint 304-BFQFP (RQFP) - same 240-RQFP - different footprint
Usable Gates 16,000 16,000 16,000 16,000 16,000 8,000
User I/O Pins 208 208 184 184 208 100
Core Voltage 5 V 5 V 5 V 5 V 5 V 5 V
Max Frequency 125 MHz 125 MHz 125 MHz 125 MHz Slower speed grade 125 MHz
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete
In-Circuit Reconfigurability Yes Yes Yes Yes Yes Yes

Pangunahing mga Pagkakaiba

  • Highest I/O count in the FLEX 8000 family at this density (kumpara saEPF81500ARC240-2)
  • -2 speed grade (fastest in FLEX 8000) (kumpara saEPF81500ARC304-3)
  • Highest-density FLEX 8000 die (16K gates, 1,296 cells, 1,500 registers) (kumpara saEPF81188ARC240-3)

Talaan ng Disenyo

The EPF81500ARC304-2 requires a stable 5 V ±5% supply to the VCCINT pins, with VCCIO separately driven to match downstream logic (3.3 V or 5 V). Decouple each VCC pin with a 0.1 µF ceramic + 10 µF tantalum bulk cap placed within 5 mm of the package. Estimated: total quiescent current for a 1,296-cell SRAM FPGA at 125 MHz is 100-300 mA; with I/O switching add 50% margin. Before configuration, the device draws IccSTANDBY ≈ 50 mA; after configuration VCCINT ramps to full load. Use a power-on reset supervisor or MCU GPIO to gate the nCONFIG line until VCCINT stabilizes for 100 ms.

The 304-BFQFP package has a 0.5 mm pitch and requires controlled-impedance routing on all I/O traces. Recommended escape: route the outer rows of balls/lands on the top layer through micro-vias to inner stripline layers. Add a solid ground plane directly beneath the package to suppress ground bounce and reduce VCCIO noise. JTAG signal traces (TCK, TMS, TDI, TDO) should be kept under 100 mm and routed with 50 Ω controlled impedance to match the JTAG pod. Configuration data lines (DCLK, DATA0) should also be length-matched if multiple FPGAs are daisy-chained.

Estimated: A common pitfall is forgetting to tie nCONFIG high through a 10 kΩ pull-up to VCCIO - leaving it floating causes intermittent configuration failures. Another is using 3.3 V-only I/O buffers when downstream logic is 5 V TTL - the device supports 5 V tolerant inputs but its output VOH at 3.3 V VCCIO is only 2.4 V min, which is below the 2.7 V VIH of true 5 V TTL receivers. Lastly, do not assume the configuration bitstream from MAX+PLUS II is portable across speed grades (-2 vs -3); bitstreams must be regenerated for the target speed grade. Finally, when migrating from -2 to -3 (slower speed grade), verify timing margins - the slower speed grade can fail hold-time requirements in tightly-timed designs.

Impormasyon ng Pagsunod sa Kautusan

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Walang Lead
Unknown
Walang Halogen
Unknown
Mga Conflict Mineral
Unknown

Compliance data not provided in verified web data. The -2 suffix in the MPN likely indicates a non-lead-free terminal finish typical of older FLEX 8000 family parts; for lead-free, order the EPF81500ARC304-2N variant.

Data napatotohanan sa: 2026-09-12 — impormasyon na pinatunayan at pinapatakbo ng pangkat ng engineering ng XAIPART's component engineering team

Kaugnay na Hanapin

EPF81500ARC304-2 EPF81500ARC304-2 datasheet EPF81500ARC304-2 price EPF81500ARC304-2 in stock Intel Altera FLEX 8000 FPGA 16K gates 304-BFQFP FPGA 208 I/O FLEX 8000 configuration EPC1 EPC1064 PCI bridge glue logic FPGA EPF81500ARC304-2 vs EPF81500ARC240-2 EPF81500ARC304-2 drop-in replacement obsolete FLEX 8000 FPGA equivalent MAX+PLUS II FLEX 8000 development what is the FLEX 8000 architecture ASIC prototyping FPGA FLEX 8000

Mga kaugnay na Mga Komponente at mga Tuntunin

Intel Altera EPF81500ARC304-2 EPF81500ARC304-2N EPF81500ARC240-2 EPF81500AQC240-2 EPF81500ARC304-3 EPF81188ARC240-3 FPGA Field Programmable Gate Array FLEX 8000 programmable logic device PLD logic cell logic element in-circuit reconfigurability ICR configuration EPROM EPC1 EPC1064 EPC1213 EPC1441 304-BFQFP RQFP 5V TTL MAX+PLUS II VHDL Verilog JTAG IEEE 1149.1 boundary scan PCI ISA bus ASIC prototyping state machine controller
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