Lattice Semiconductor

LFE2-6E-5FN256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice

MPN: LFE2-6E-5FN256I ✗ Tapus ng Buhay
1.2 V nominal Vdss 256-pin FBGA Package -5 speed grade Speed 56,320 bits Memory
MOQ: 1 |

LFE2-6E-5FN256I Ulas

The Lattice Semiconductor LFE2-6E-5FN256I is an ECP2 field-programmable gate array with 6,000 logic cells, 190 I/O, 1.2 V operation, and a 256-pin FBGA package. It is positioned for embedded systems that require reconfigurable logic, parallel interfaces, control functions, and moderate DSP processing in a compact surface-mount package. The -5 speed grade and industrial temperature designation identify this configuration for industrial operating conditions.

An FPGA is a programmable semiconductor used to implement digital control, interface, timing, signal-processing, and data-path logic. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured during development and can shorten the cycle between prototype and production. The ECP2 family belongs to Lattice Semiconductor's programmable-logic portfolio and is commonly used when design flexibility is more valuable than the very high logic density of a large FPGA.

The LFE2-6E-5FN256I combines 6K LUTs, 190 I/O, 1.2 V supply operation, and embedded DSP capability in a 256-BGA package. The 190 I/O count supports connections to external memories, parallel buses, sensors, converters, and industrial peripherals. Its 1.2 V operating supply is suitable for systems designed around modern low-voltage digital logic. The -5 suffix identifies the speed grade, while the I suffix identifies the industrial temperature option.

The FPGA architecture allows designers to implement parallel control logic, interface translation, data acquisition, and fixed-point signal-processing functions in one programmable device. This can reduce the number of supporting discrete logic components and allow firmware or configuration updates during product development. Designers must still account for I/O assignment, pin constraints, configuration memory, clocking, power integrity, and thermal performance in the PCB design.

Typical uses include industrial automation, test and measurement, communications interfaces, embedded control, data acquisition, and compact embedded processing systems. The 256-BGA package is appropriate for multilayer PCB designs with adequate escape-routing capability and careful power delivery. It is not intended for a simple two-wire serial interface or a low-pin-count control-only design.

When planning the layout, follow the manufacturer pinout and package guidelines, provide clean 1.2 V power rails, keep configuration and clock signals away from noisy analog or high-current switching paths, and validate all I/O standards against the target board voltage. This page summarizes the available LFE2-6E-5FN256I information, practical application fit, and same-package alternatives for engineering evaluation.

The LFE2-6E-5FN256I is best selected when a 6K-logic ECP2 design needs 190 I/O, a 256-BGA footprint, and industrial-grade programmable logic. Compare speed-grade and package variants carefully, because a related MPN with a similar family name may not have identical electrical ratings, temperature coverage, or pin compatibility.

Mga alternatibo na pwedeng ilagay na LFE2-6E-5FN256I — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.

Variante sa Seri na ito

Katulad na modelo sa serye na katugma sa pagpasok LFE2-6E-5FN256I (parehas na form factor at footprint) — pagkakaiba sa Package, Device Type, Lead-Free Status, Speed Grade.

Lattice Semiconductor
Package: 256-ball Fine Pitch Ball Grid Array
Device Type: ECP2 Field Programmable Gate Array (FPGA)
Lead-Free Status: Lead free
Ikabit sa LFE2-6E-5FN256I →
Lattice Semiconductor
Package: 256-ball FBGA, 17 mm × 17 mm
Device Type: ECP2 Field Programmable Gate Array (FPGA)
Lead-Free Status: Lead free
Ikabit sa LFE2-6E-5FN256I →

LFE2-6E-6FN256I

✅ Drop-In
Lattice Semiconductor
📦 256-pin FBGA
ECP2 Field Programmable Gate Array (FPGA) · 6,000 cells · 750 LABs · 56,320 bits (67 KB) · 190 I/O · 357 MHz · 1.14 V to 1.26 V · 1.2 V

Magkontak para sa presyo

Tingnan ang Datasheet →

LFE2-6SE-5FN256I

✅ Drop-In
📦 256-pin FBGA
Same ECP2 6,000-cell, 190-I/O, 1.2 V and 256-FBGA family; SE feature designation differs from the standard ECP2 configuration

📋 Alternatibo na Reference (hindi sa katalogo)

LFE2-6E-7FN256C

✅ Drop-In
📦 256-pin FBGA
Same ECP2 6,000-cell, 190-I/O, 1.2 V and 256-FBGA family; -7 speed grade and C temperature suffix differ from -5 and I

📋 Alternatibo na Reference (hindi sa katalogo)

LFE2-6SE-7FN256C

✅ Drop-In
📦 256-pin FBGA
Same ECP2 6,000-cell, 190-I/O, 1.2 V and 256-FBGA family; SE feature configuration, -7 speed grade, and C temperature suffix differ

📋 Alternatibo na Reference (hindi sa katalogo)

LFE2-6E-5F256I

✅ Drop-In
Lattice Semiconductor
📦 256-pin FBGA
ECP2 Field Programmable Gate Array (FPGA) · 6,000 cells · 190 I/O · 56,320 bits · 1.2 V · -5 · Industrial · 256-ball Fine Pitch Ball Grid Array

Magkontak para sa presyo

Tingnan ang Datasheet →

LFE2-6E-5FN256I Mga Pinakamataas na Rating at Electrical Characteristics

Device Type ECP2 field-programmable gate array (FPGA)
Logic Cells 6,000 cells
Lookup Tables 6K LUTs
I/O Count 190 I/O
Embedded Memory 56,320 bits
DSP Resources 6,000 DSP slices
Volte ng Pagbibigay 1.2 V nominal
Operating Voltage 1.14 V to 1.26 V
Speed Grade -5 speed grade
Temperature Grade Industrial
Packhaging 256-pin FBGA
Case / Package Designation FPBGA-256
Package Dimensions 17 mm x 17 mm
Uri ng Pagpapasok Surface mount
Lead-Free Status Lead-free

Gabay sa Pin Configuration ng LFE2-6E-5FN256I 17 mm x 17 mm

Pin configuration para sa LFE2-6E-5FN256I (17 mm x 17 mm package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.

Pinout diagram ng 17 mm x 17 mm package para sa LFE2-6E-5FN256I

Wala ng detalyadong pinout data na magagamit para sa LFE2-6E-5FN256I.

Sumangguni sa datasheet para sa buong pin configuration.

Tipikal na mga Gamit

LFE2-6E-5FN256I ay nararapat para sa 6 aplikasyons: Industrial Automation Controller, Data-Acquisition Front End, Test and Measurement Equipment, Communications Interface Bridge, Embedded Signal Processing, Programmable Embedded Control.

🏭

Industrial Automation Controller

The LFE2-6E-5FN256I fits industrial automation controllers that require flexible logic for sequencing, machine-state monitoring, and communication interfaces. Its 6,000 logic cells and 190 I/O provide enough parallel resources for digital I/O expansion, encoder or sensor interfaces, and control peripherals, while the -5 industrial speed grade supports timing-sensitive automation functions. The 1.2 V supply requirement should be integrated with a robust regulator and carefully decoupled. Compared with a fixed controller, the FPGA permits logic revisions without changing the PCB. The 256-FBGA package requires multilayer escape routing, but it reduces board area when many external connections are needed.

📊

Data-Acquisition Front End

The LFE2-6E-5FN256I is suitable for programmable data-acquisition front ends that collect parallel sensor outputs, perform digital filtering, and transfer results to a processor or communications link. The available 190 I/O supports multiple input banks, and the 6K LUT architecture can implement timing control, acquisition sequencing, and sample tagging. Its DSP resources can also support fixed-point arithmetic where appropriate. The principal design constraint is the 1.2 V core supply and the 256-BGA footprint. Engineers should constrain inputs to the supported voltage standards, terminate them according to the selected interface, and verify timing closure for the target clock rate.

🔧

Test and Measurement Equipment

The LFE2-6E-5FN256I can implement programmable control and signal-path logic in compact test and measurement equipment. Its 6,000 LUTs, 190 I/O, and embedded memory are useful for instrument sequencing, trigger generation, bus control, status reporting, and data capture. The industrial designation supports equipment intended to operate beyond benign indoor conditions, subject to the exact manufacturer temperature limits. Use deterministic clocking and careful I/O assignment to maintain measurement integrity. Because the device uses a dense 256-pin FBGA, the PCB should provide continuous power planes, multiple decoupling positions, and test access that does not disturb sensitive routing.

🌐

Communications Interface Bridge

The LFE2-6E-5FN256I fits communications interface bridges that translate between parallel FPGA logic and external bus peripherals. Its 190 I/O allows parallel data paths, control signals, and chip-select logic to be implemented together, while the programmable architecture allows protocol-specific handling without a fixed-function bridge IC. The 6K LUT capacity can accommodate framing, byte alignment, and flow-control functions. At the 1.2 V supply voltage, power integrity and output timing become important, particularly for high-rate interfaces. Validate source-synchronous timing, I/O standards, and clock topology against the manufacturer device specifications and the PCB return path design.

📡

Embedded Signal Processing

The LFE2-6E-5FN256I supports embedded fixed-point signal-processing functions alongside control logic. Its 6,000 DSP slices and 6K LUTs provide resources for filters, arithmetic pipelines, modulation stages, or other configurable processing blocks, while 190 I/O allows processed data to move between external converters and storage. This mixed architecture can reduce the need for separate programmable logic and glue components. The -5 grade should be selected only after the design's timing requirements are checked. Use synchronous design practices, pipeline arithmetic where needed, and analyze worst-case clock slack at the intended temperature and supply conditions.

🧩

Programmable Embedded Control

The LFE2-6E-5FN256I is appropriate for compact embedded-control subsystems that benefit from reconfigurable logic close to sensors, actuators, or communications circuits. The device can consolidate sequencing, peripheral interfacing, diagnostics, and local data transformation in one 6,000-cell FPGA. Its industrial-grade ordering option helps align the component with industrial product requirements, while the 1.2 V operating range supports integration into modern embedded platforms. The dense 256-FBGA package is best used when minimizing total board area outweighs assembly complexity. Plan configuration programming, power-up behavior, unused-pin treatment, and programming-recovery requirements before production release.

Buod ng mga Inirekomendang Produkto

LFE2-6E-6FN256I Lattice Semiconductor Ginagamit sa: Industrial Automation Controller, Embedded Signal Processing LFE2-6SE-5FN256I Related ECP2 configuration in the same 256-FBGA family Ginagamit sa: Data-Acquisition Front End LFE2-6E-7FN256C Related ECP2 speed-grade family member Ginagamit sa: Test and Measurement Equipment LFE2-6E-5F256I Lattice Semiconductor Ginagamit sa: Communications Interface Bridge LFE2-6SE-7FN256C Related ECP2 family configuration Ginagamit sa: Programmable Embedded Control
What is the LFE2-6E-5FN256I?
The LFE2-6E-5FN256I is a Lattice Semiconductor ECP2 FPGA with 6,000 logic cells, 6K LUTs, 190 I/O, 56,320 bits of embedded memory, and 6,000 DSP slices in a 256-pin FBGA package. It operates from a nominal 1.2 V supply and uses the -5 speed grade with an industrial temperature designation. According to the manufacturer family information and distributor technical listings, it is intended for programmable control, interface, data-acquisition, and embedded signal-processing designs.
How many I/O and logic cells does the LFE2-6E-5FN256I have?
The LFE2-6E-5FN256I provides 190 I/O and 6,000 logic cells, also described as 6K LUTs. The listed device parameters also identify 56,320 bits of embedded memory and 6,000 DSP slices. These figures make the part suitable for designs that need substantially more parallel connectivity than a small CPLD, while remaining within the ECP2 family's low-power, 1.2 V architecture. Verify the final I/O count against the package-specific pin table before assigning board functions.
What supply voltage does the LFE2-6E-5FN256I use?
The LFE2-6E-5FN256I operates from 1.14 V to 1.26 V, with a nominal supply of 1.2 V. The manufacturer comparison information identifies the same voltage range for the closely related LFE2-6E-5F256I device. This low-voltage requirement means the board must provide a properly regulated 1.2 V rail with adequate current capacity, low ripple, and suitable decoupling. Confirm the exact core and I/O voltage requirements against the manufacturer datasheet before releasing the PCB.
Where can I find the LFE2-6E-5FN256I datasheet and pinout?
The LFE2-6E-5FN256I datasheet and package pinout should be obtained from the Lattice Semiconductor ECP2 family documentation. The manufacturer product page is the authoritative starting point for the current device data, while the verified distributor listings identify the device as a 256-pin FBGA with 190 I/O. Use the package-specific pin table to map power, ground, configuration, clock, and user I/O signals; do not infer a 256-BGA pinout from a generic BGA drawing.
Where can I buy the LFE2-6E-5FN256I and what is its price?
Use the Request a Quote form on this page to request the current LFE2-6E-5FN256I price, stock status, quantity breaks, and lead time. The verified listings show multiple distribution channels and a starting unit-price reference, but pricing is dynamic and may change with quantity, inventory, and market conditions. XAIPART's quote form is the appropriate route for a current procurement response tied to your requested quantity and delivery requirements.
What is the lead time for the LFE2-6E-5FN256I?
The current lead time for the LFE2-6E-5FN256I should be confirmed through the Request a Quote form on this page. The verified listings indicate that the part is actively offered by several suppliers, but they do not establish one guaranteed factory or distributor lead time. When requesting a quote, specify the required quantity, package orientation, destination, target date, and whether partial delivery is acceptable so the response reflects the actual procurement position.
Is the LFE2-6E-5FN256I in stock?
Current LFE2-6E-5FN256I inventory must be checked through the Request a Quote form on this page. The verified product listings show active sourcing channels and references to available inventory, but no single universally valid stock quantity applies across all sellers or regions. Submit the required quantity and delivery information for an availability confirmation. Do not base a production schedule on a generic listing page that may not reflect reserved or regional stock.
What is the LFE2-6E-5FN256I versus LFE2-6E-6FN256I difference?
The LFE2-6E-5FN256I and LFE2-6E-6FN256I are closely related ECP2 devices in the same 6,000-cell, 190-I/O, 1.2 V family, and the listed comparison identifies both as 256-pin FBGA devices. Their primary documented distinction is speed grade: -5 versus -6. A faster grade can improve timing margin, while the lower-grade device may be selected for cost or power objectives. Review the manufacturer comparison table and verify pin compatibility before substituting one for the other.
Can the LFE2-6E-5FN256I replace an LFE2-6E-5F256I?
The LFE2-6E-5F256I is a closely related ECP2 device listed with the same 256-BGA package, 6,000-cell family, 190 I/O, and 1.14 V to 1.26 V operating range. However, the exact ordering-code meaning and package-specific pin map must be checked in the manufacturer documentation before calling it a drop-in replacement. Use the manufacturer comparison table to confirm speed grade, temperature grade, package balls, configuration, and I/O compatibility.
When should I choose the LFE2-6E-5FN256I instead of a faster ECP2 variant?
Choose the LFE2-6E-5FN256I when a design needs the 6,000-cell ECP2 architecture, 190 I/O, a 1.2 V supply, and the -5 speed grade without requiring the additional timing margin associated with a faster grade. It is also appropriate for industrial embedded-control and interface designs where the exact industrial ordering option and package are more important than maximum performance. Final timing closure should use the manufacturer speed-grade data and the actual board constraints.
Is the LFE2-6E-5FN256I suitable for industrial control and data acquisition?
The LFE2-6E-5FN256I is suitable for industrial control and data-acquisition designs that benefit from configurable parallel logic and numerous external connections. Its 190 I/O, 6K LUTs, 56,320 embedded-memory bits, and DSP resources can implement control sequencing, bus interfaces, sampling logic, and fixed-point processing in one device. The -5 speed grade and industrial temperature designation support industrial planning, while the 256-BGA package requires multilayer PCB design and careful power, escape-routing, and thermal work.
What are the key specifications of the LFE2-6E-5FN256I?
The key LFE2-6E-5FN256I specifications are 6,000 logic cells, 6K LUTs, 190 I/O, 56,320 bits of embedded memory, 6,000 DSP slices, 1.2 V nominal operation, and a 256-pin FBGA package. It is identified as an ECP2 FPGA using 90 nm technology, with a -5 speed grade and industrial temperature designation. These parameters position the device between small CPLDs and larger FPGAs for embedded logic, interface, control, and DSP applications.
What can replace the LFE2-6E-5FN256I?
Potential replacements include same-package ECP2 variants such as the LFE2-6E-6FN256I, LFE2-6SE-5FN256I, LFE2-6E-7FN256C, and LFE2-6SE-7FN256C, but interchangeability depends on more than the 256-BGA outline. Check the exact ball map, I/O standards, core voltage, speed grade, temperature rating, embedded-memory configuration, and performance timing in the manufacturer comparison documentation. Some alternatives change speed, temperature, or family features and therefore may not be suitable drop-in replacements.
Is the LFE2-6E-5FN256I the same as the LFE2-6SE-5FN256I?
The LFE2-6E-5FN256I and LFE2-6SE-5FN256I belong to the related Lattice ECP2 naming family and appear in same-package cross-reference results, but they are not automatically identical. The ordering codes can indicate different feature, speed, or package attributes that affect qualification and interchangeability. Compare the manufacturer family tables and package-specific pin information before selecting the LFE2-6SE-5FN256I as a drop-in substitute for an existing board.
What is the best Lattice alternative to the LFE2-6E-5FN256I?
The best Lattice alternative depends on the design constraint: use the LFE2-6E-6FN256I when additional speed-grade margin is appropriate, and consider LFE2-6SE-5FN256I when the alternate ECP2 feature configuration fits the application. For commercial availability, current lead time, and exact package equivalence, use the Request a Quote form on this page. No universal cross-brand equivalent can be declared without a verified 256-BGA ball map, equivalent I/O capability, and matching operating limits.

Impormasyon ng Talumpati sa Engineering for LFE2-6E-5FN256I — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.

Paunawang Hanapin

Choose the LFE2-6E-5FN256I when an ECP2 design requires 6,000 logic cells, 190 I/O, a 1.2 V core supply, the -5 speed grade, and an industrial-grade ordering option in a 256-pin FBGA. Select the LFE2-6E-6FN256I when the same resource and package baseline is needed with a different speed grade. Evaluate the LFE2-6SE-5FN256I when the alternate ECP2 feature configuration meets the design, and treat LFE2-6E-7FN256C as a faster but C-designated family member rather than a temperature-equivalent choice. The LFE2-6E-5F256I is a closely related ordering variant, but its exact code interpretation and pin compatibility must be confirmed. For every candidate, verify the manufacturer ball map, I/O standards, temperature limits, embedded resources, configuration method, and timing closure before approving a substitution.

Ikabit sa Mga Alternatibo

Parametro Ito ang Producto LFE2-6E-6FN256I LFE2-6SE-5FN256I LFE2-6E-7FN256C LFE2-6SE-7FN256C LFE2-6E-5F256I
Brand Lattice Semiconductor Lattice Semiconductor Lattice Semiconductor Lattice Semiconductor Lattice Semiconductor Lattice Semiconductor
Package 256-pin FBGA 256-pin FBGA - same 256-pin FBGA - same 256-pin FBGA - same 256-pin FBGA - same 256-pin FBGA - same
Logic Cells 6,000 cells 6,000 cells 6,000 cells 6,000 cells 6,000 cells 6,000 cells
Lookup Tables 6K LUTs 6K LUTs 6K LUTs 6K LUTs 6K LUTs 6K LUTs
I/O Count 190 I/O 190 I/O 190 I/O 190 I/O 190 I/O 190 I/O
Supply Voltage 1.2 V nominal 1.2 V nominal 1.2 V nominal 1.2 V nominal 1.2 V nominal 1.2 V nominal
Speed Grade -5 speed grade -6 speed grade -5 speed grade -7 speed grade -7 speed grade -5 speed grade

Pangunahing mga Pagkakaiba

  • Lower -5 speed grade with industrial ordering option (kumpara saLFE2-6E-6FN256I)
  • Same 6,000-cell and 190-I/O resource baseline (kumpara saLFE2-6SE-5FN256I)
  • Industrial temperature designation in the same package family (kumpara saLFE2-6E-7FN256C)

Talaan ng Disenyo

Design the board around the 1.14 V to 1.26 V operating range and the exact core and I/O requirements in the manufacturer datasheet. Place bulk and local decoupling capacitors close to the device supply and ground balls, with multiple connection points distributed around the BGA. Validate the power source for transient response, ripple, startup sequencing, and current limit behavior. Estimated thermal calculations should use the actual VIN-to-VOUT drop, load current, and board copper area rather than a generic dissipation figure.

The 256-pin FBGA requires a multilayer PCB with short, matched escape-routing paths. Follow the manufacturer ball-map and recommended land pattern rather than a generic BGA footprint. Reserve test access for configuration, clock, and selected user signals, while keeping configuration routing away from noisy switching nodes. Review via placement, plane splits, thermal-via distribution, and assembly capability before releasing the fabrication data.

Do not treat a related ECP2 ordering code as interchangeable solely because it uses a 256-BGA package. Check speed grade, temperature grade, embedded features, ball assignments, supported I/O standards, and configuration behavior in the manufacturer comparison tables. For a board already designed around LFE2-6E-5FN256I, perform a complete pin and timing review before approving LFE2-6E-6FN256I, LFE2-6SE-5FN256I, or another listed family member.

Use a low-noise, deterministic clock source and keep clock distribution away from high-current switching paths and noisy interface returns. For high-speed I/O, confirm voltage standards, edge rates, source-synchronous timing, and receiver thresholds against the device specifications. PCB signal-integrity analysis should include package transitions and breakout effects, particularly where external buses or converters operate close to the FPGA's 1.2 V supply region.

Impormasyon ng Pagsunod sa Kautusan

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Walang Lead
Yes
Walang Halogen
Unknown
Mga Conflict Mineral
Unknown

The verified listing identifies the device as lead-free. RoHS, REACH, halogen-free, and conflict-minerals status were not explicitly stated.

Data napatotohanan sa: 2026-11-07 — impormasyon na pinatunayan at pinapatakbo ng pangkat ng engineering ng XAIPART's component engineering team

Kaugnay na Hanapin

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Mga kaugnay na Mga Komponente at mga Tuntunin

Lattice Semiconductor LFE2-6E-5FN256I LFE2-6E-6FN256I LFE2-6SE-5FN256I LFE2-6E-7FN256C LFE2-6SE-7FN256C LFE2-6E-5F256I ECP2 FPGA CPLD field-programmable gate array programmable logic lookup table LUT DSP slice embedded memory 1.2 V power supply 190 I/O 256-pin FBGA BGA-256 surface mount industrial control data acquisition programmable embedded control RoHS REACH
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