LFE2-6E-5FN256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice
料号： LFE2-6E-5FN256I ✗ 停产LFE2-6E-5FN256I 概述
An FPGA is a programmable semiconductor used to implement digital control, interface, timing, signal-processing, and data-path logic. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured during development and can shorten the cycle between prototype and production. The ECP2 family belongs to Lattice Semiconductor's programmable-logic portfolio and is commonly used when design flexibility is more valuable than the very high logic density of a large FPGA.
The LFE2-6E-5FN256I combines 6K LUTs, 190 I/O, 1.2 V supply operation, and embedded DSP capability in a 256-BGA package. The 190 I/O count supports connections to external memories, parallel buses, sensors, converters, and industrial peripherals. Its 1.2 V operating supply is suitable for systems designed around modern low-voltage digital logic. The -5 suffix identifies the speed grade, while the I suffix identifies the industrial temperature option.
The FPGA architecture allows designers to implement parallel control logic, interface translation, data acquisition, and fixed-point signal-processing functions in one programmable device. This can reduce the number of supporting discrete logic components and allow firmware or configuration updates during product development. Designers must still account for I/O assignment, pin constraints, configuration memory, clocking, power integrity, and thermal performance in the PCB design.
Typical uses include industrial automation, test and measurement, communications interfaces, embedded control, data acquisition, and compact embedded processing systems. The 256-BGA package is appropriate for multilayer PCB designs with adequate escape-routing capability and careful power delivery. It is not intended for a simple two-wire serial interface or a low-pin-count control-only design.
When planning the layout, follow the manufacturer pinout and package guidelines, provide clean 1.2 V power rails, keep configuration and clock signals away from noisy analog or high-current switching paths, and validate all I/O standards against the target board voltage. This page summarizes the available LFE2-6E-5FN256I information, practical application fit, and same-package alternatives for engineering evaluation.
The LFE2-6E-5FN256I is best selected when a 6K-logic ECP2 design needs 190 I/O, a 256-BGA footprint, and industrial-grade programmable logic. Compare speed-grade and package variants carefully, because a related MPN with a similar family name may not have identical electrical ratings, temperature coverage, or pin compatibility.
直接替换替代料： LFE2-6E-5FN256I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： LFE2-6E-5FN256I （相同外形与封装尺寸） ——差异在于 Package, Device Type, Lead-Free Status, Speed Grade.
LFE2-6E-6FN256I
✅ 直接替换联系询价
查看数据手册 →LFE2-6SE-5FN256I
✅ 直接替换📋 参考替代料（不在目录中）
LFE2-6E-7FN256C
✅ 直接替换📋 参考替代料（不在目录中）
LFE2-6SE-7FN256C
✅ 直接替换📋 参考替代料（不在目录中）
LFE2-6E-5F256I
✅ 直接替换联系询价
查看数据手册 →LFE2-6E-5FN256I 最大额定值与电气特性
| Device Type | ECP2 field-programmable gate array (FPGA) |
| Logic Cells | 6,000 cells |
| Lookup Tables | 6K LUTs |
| I/O Count | 190 I/O |
| Embedded Memory | 56,320 bits |
| DSP Resources | 6,000 DSP slices |
| 电源电压 | 1.2 V nominal |
| Operating Voltage | 1.14 V to 1.26 V |
| Speed Grade | -5 speed grade |
| Temperature Grade | Industrial |
| 封装 | 256-pin FBGA |
| Case / Package Designation | FPBGA-256 |
| Package Dimensions | 17 mm x 17 mm |
| 安装类型 | Surface mount |
| Lead-Free Status | Lead-free |
LFE2-6E-5FN256I 17 mm x 17 mm 引脚配置指南
LFE2-6E-5FN256I（17 mm x 17 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： LFE2-6E-5FN256I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LFE2-6E-5FN256I 适用于 6 应用s: Industrial Automation Controller, Data-Acquisition Front End, Test and Measurement Equipment, Communications Interface Bridge, Embedded Signal Processing, Programmable Embedded Control.
Industrial Automation Controller
The LFE2-6E-5FN256I fits industrial automation controllers that require flexible logic for sequencing, machine-state monitoring, and communication interfaces. Its 6,000 logic cells and 190 I/O provide enough parallel resources for digital I/O expansion, encoder or sensor interfaces, and control peripherals, while the -5 industrial speed grade supports timing-sensitive automation functions. The 1.2 V supply requirement should be integrated with a robust regulator and carefully decoupled. Compared with a fixed controller, the FPGA permits logic revisions without changing the PCB. The 256-FBGA package requires multilayer escape routing, but it reduces board area when many external connections are needed.
推荐
Data-Acquisition Front End
The LFE2-6E-5FN256I is suitable for programmable data-acquisition front ends that collect parallel sensor outputs, perform digital filtering, and transfer results to a processor or communications link. The available 190 I/O supports multiple input banks, and the 6K LUT architecture can implement timing control, acquisition sequencing, and sample tagging. Its DSP resources can also support fixed-point arithmetic where appropriate. The principal design constraint is the 1.2 V core supply and the 256-BGA footprint. Engineers should constrain inputs to the supported voltage standards, terminate them according to the selected interface, and verify timing closure for the target clock rate.
推荐
Test and Measurement Equipment
The LFE2-6E-5FN256I can implement programmable control and signal-path logic in compact test and measurement equipment. Its 6,000 LUTs, 190 I/O, and embedded memory are useful for instrument sequencing, trigger generation, bus control, status reporting, and data capture. The industrial designation supports equipment intended to operate beyond benign indoor conditions, subject to the exact manufacturer temperature limits. Use deterministic clocking and careful I/O assignment to maintain measurement integrity. Because the device uses a dense 256-pin FBGA, the PCB should provide continuous power planes, multiple decoupling positions, and test access that does not disturb sensitive routing.
推荐
Communications Interface Bridge
The LFE2-6E-5FN256I fits communications interface bridges that translate between parallel FPGA logic and external bus peripherals. Its 190 I/O allows parallel data paths, control signals, and chip-select logic to be implemented together, while the programmable architecture allows protocol-specific handling without a fixed-function bridge IC. The 6K LUT capacity can accommodate framing, byte alignment, and flow-control functions. At the 1.2 V supply voltage, power integrity and output timing become important, particularly for high-rate interfaces. Validate source-synchronous timing, I/O standards, and clock topology against the manufacturer device specifications and the PCB return path design.
推荐
Embedded Signal Processing
The LFE2-6E-5FN256I supports embedded fixed-point signal-processing functions alongside control logic. Its 6,000 DSP slices and 6K LUTs provide resources for filters, arithmetic pipelines, modulation stages, or other configurable processing blocks, while 190 I/O allows processed data to move between external converters and storage. This mixed architecture can reduce the need for separate programmable logic and glue components. The -5 grade should be selected only after the design's timing requirements are checked. Use synchronous design practices, pipeline arithmetic where needed, and analyze worst-case clock slack at the intended temperature and supply conditions.
推荐
Programmable Embedded Control
The LFE2-6E-5FN256I is appropriate for compact embedded-control subsystems that benefit from reconfigurable logic close to sensors, actuators, or communications circuits. The device can consolidate sequencing, peripheral interfacing, diagnostics, and local data transformation in one 6,000-cell FPGA. Its industrial-grade ordering option helps align the component with industrial product requirements, while the 1.2 V operating range supports integration into modern embedded platforms. The dense 256-FBGA package is best used when minimizing total board area outweighs assembly complexity. Plan configuration programming, power-up behavior, unused-pin treatment, and programming-recovery requirements before production release.
推荐
推荐产品汇总
工程参考数据： LFE2-6E-5FN256I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LFE2-6E-6FN256I | LFE2-6SE-5FN256I | LFE2-6E-7FN256C | LFE2-6SE-7FN256C | LFE2-6E-5F256I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 256-pin FBGA | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same |
| Logic Cells | 6,000 cells | 6,000 cells | 6,000 cells | 6,000 cells | 6,000 cells | 6,000 cells |
| Lookup Tables | 6K LUTs | 6K LUTs | 6K LUTs | 6K LUTs | 6K LUTs | 6K LUTs |
| I/O Count | 190 I/O | 190 I/O | 190 I/O | 190 I/O | 190 I/O | 190 I/O |
| Supply Voltage | 1.2 V nominal | 1.2 V nominal | 1.2 V nominal | 1.2 V nominal | 1.2 V nominal | 1.2 V nominal |
| Speed Grade | -5 speed grade | -6 speed grade | -5 speed grade | -7 speed grade | -7 speed grade | -5 speed grade |
关键差异点
- Lower -5 speed grade with industrial ordering option （对比 LFE2-6E-6FN256I)
- Same 6,000-cell and 190-I/O resource baseline （对比 LFE2-6SE-5FN256I)
- Industrial temperature designation in the same package family （对比 LFE2-6E-7FN256C)
设计说明
Design the board around the 1.14 V to 1.26 V operating range and the exact core and I/O requirements in the manufacturer datasheet. Place bulk and local decoupling capacitors close to the device supply and ground balls, with multiple connection points distributed around the BGA. Validate the power source for transient response, ripple, startup sequencing, and current limit behavior. Estimated thermal calculations should use the actual VIN-to-VOUT drop, load current, and board copper area rather than a generic dissipation figure.
The 256-pin FBGA requires a multilayer PCB with short, matched escape-routing paths. Follow the manufacturer ball-map and recommended land pattern rather than a generic BGA footprint. Reserve test access for configuration, clock, and selected user signals, while keeping configuration routing away from noisy switching nodes. Review via placement, plane splits, thermal-via distribution, and assembly capability before releasing the fabrication data.
Do not treat a related ECP2 ordering code as interchangeable solely because it uses a 256-BGA package. Check speed grade, temperature grade, embedded features, ball assignments, supported I/O standards, and configuration behavior in the manufacturer comparison tables. For a board already designed around LFE2-6E-5FN256I, perform a complete pin and timing review before approving LFE2-6E-6FN256I, LFE2-6SE-5FN256I, or another listed family member.
Use a low-noise, deterministic clock source and keep clock distribution away from high-current switching paths and noisy interface returns. For high-speed I/O, confirm voltage standards, edge rates, source-synchronous timing, and receiver thresholds against the device specifications. PCB signal-integrity analysis should include package transitions and breakout effects, particularly where external buses or converters operate close to the FPGA's 1.2 V supply region.
合规信息
The verified listing identifies the device as lead-free. RoHS, REACH, halogen-free, and conflict-minerals status were not explicitly stated.
