NXP

LPC1830FET100Y - 180MHz Cortex-M3 MCU | NXP | Industrial

MPN: LPC1830FET100Y ✓ Nakahanda
2.5 V or 3.3 V Vdss TFBGA-100 Package 180 MHz Speed ROMless; external boot memory required Memory
MOQ: 1 |

LPC1830FET100Y Ulas

The NXP LPC1830FET100Y is a 32-bit ARM Cortex-M3 microcontroller operating up to 180 MHz, with 200 kB of SRAM, external memory interfaces, Ethernet, USB 2.0, CAN 2.0B, SPI Flash Interface, and a State Configurable Timer in a 100-ball TFBGA package measuring 9 x 9 mm. The ROMless architecture requires an external boot memory source, making the device suitable for applications that need flexible firmware storage or field-programmable memory.

A microcontroller is a programmable semiconductor that integrates a processor core, memory interfaces, communication peripherals, timers, and general-purpose I/O into one compact device. The LPC1830 belongs to the Cortex-M3 embedded-processing hierarchy, where a microcontroller sits below the broader category of microprocessors and above application-specific embedded control systems. It combines deterministic real-time control with network and high-speed connectivity.

The LPC1830FET100Y provides 200 kB of SRAM and operates from 2.5 V or 3.3 V, according to the verified NXP and distributor product information. Its Ethernet controller, two high-speed USB interfaces, and CAN 2.0B controller support connected industrial, communications, and data-acquisition equipment. The dedicated SPI Flash Interface allows the MCU to access external serial flash, while the State Configurable Timer supports timing functions that can be adapted to different control tasks.

Operation up to 180 MHz provides sufficient processing performance for protocol handling, control logic, and concurrent peripheral activity. Because the device is ROMless, designers must provide suitable external boot memory and include a valid startup image in the system architecture. The 100-TFBGA package also requires careful PCB layout, with short escape routing and a ball grid that is not directly compatible with a conventional fine-pitch TQFP footprint.

Typical applications include industrial Ethernet controllers, USB-to-serial and USB-to-CAN gateways, network-connected instrumentation, embedded data loggers, and industrial automation modules. The Ethernet and USB peripherals are especially useful where a single controller must bridge embedded processing with external hosts or network equipment. CAN support also permits connection to industrial bus nodes, sensors, and actuator networks.

A primary design consideration is the 100-ball BGA assembly process. The PCB should be designed for the manufacturer-recommended land pattern, with controlled impedance routing for Ethernet and USB, local decoupling near each supply ball, and thermal-via placement beneath the device where required. Component availability, flash configuration, boot behavior, and interface timing must be validated before production release.

This product page consolidates verified manufacturer and distributor information, identifies the MCU's principal connectivity and memory features, and documents the engineering trade-offs associated with its ROMless architecture, 100-TFBGA package, and external peripheral ecosystem.

Mga alternatibo na pwedeng ilagay na LPC1830FET100Y — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.

Wala ng magagamit na drop-in alternatibo para sa produkto na ito.

Hilingin ang Alternatibo

LPC1830FET100Y Mga Pinakamataas na Rating at Electrical Characteristics

Product Type 32-bit ARM Cortex-M3 microcontroller
Processor Core ARM Cortex-M3
Maximum Operating Frequency 180 MHz
Instruction Set Width 32 bit
Internal SRAM 200 kB
Program Memory ROMless; external boot memory required
Supply Voltage na Operasyon 2.5 V or 3.3 V
Ethernet Interface 1 Ethernet controller
USB Interface 2 high-speed USB controllers supporting Host, OTG, and Device roles
CAN Interface CAN 2.0B controller
SPI Flash Interface 1 configurable SPI Flash Interface
State Configurable Timer 2 State Configurable Timer peripherals
Wake-Up Function Wake-up function supported
Package Type TFBGA-100
Package Dimensions 9 x 9 mm
Package Pin Count 100 balls
Uri ng Pagpapasok Surface mount
Supplier Packaging Tape and reel

Gabay sa Pin Configuration ng LPC1830FET100Y 100 balls

Pin configuration para sa LPC1830FET100Y (100 balls package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.

Pinout diagram ng 100 balls package para sa LPC1830FET100Y

Wala ng detalyadong pinout data na magagamit para sa LPC1830FET100Y.

Sumangguni sa datasheet para sa buong pin configuration.

Tipikal na mga Gamit

LPC1830FET100Y ay nararapat para sa 6 aplikasyons: Industrial Ethernet Controller, USB-to-CAN Gateway, Networked Data Logger, USB-to-Serial Adapter, Industrial Automation Module, Test and Measurement Controller.

🏭

Industrial Ethernet Controller

The LPC1830FET100Y fits industrial Ethernet controller designs because its 180 MHz ARM Cortex-M3 core provides processing capacity for protocol handling, while the integrated Ethernet controller supports network communication without requiring the MCU itself to act as the physical transceiver. The 200 kB of SRAM can hold protocol state, buffers, and application data. The device also includes two high-speed USB controllers and CAN 2.0B, allowing a single embedded controller to coordinate local diagnostics and field-bus tasks. In a production design, an external Ethernet PHY, 2.5 V or 3.3 V-compatible supply rails, and the manufacturer-recommended 100-TFBGA layout are required. Controlled-impedance traces and local decoupling are particularly important because Ethernet signal integrity and supply disturbance can affect the 180 MHz processing path.

🔧

USB-to-CAN Gateway

The LPC1830FET100Y is appropriate for a USB-to-CAN gateway because it combines two high-speed USB controllers, a CAN 2.0B controller, and a 180 MHz Cortex-M3 processor. Firmware can bridge USB traffic to an industrial CAN network, maintain protocol buffers, and provide diagnostic status through the available GPIO. Its 200 kB of SRAM offers useful working memory for message queues and gateway state, although the ROMless configuration still requires external boot flash. The implementation needs a USB connector and appropriate USB transceiver or controller circuitry, a CAN transceiver such as the MC3487 family, galvanic-isolation options where required, and careful separation between high-speed USB routing and slower protected CAN interfaces.

🖥️

Networked Data Logger

The LPC1830FET100Y suits a networked data logger because it combines 200 kB of SRAM, a 180 MHz processor, Ethernet, two high-speed USB interfaces, and a dedicated SPI Flash Interface. The SPI Flash Interface can support access to compatible external serial storage, while Ethernet or USB provides a path for transferring records to a host. The ROMless architecture allows firmware and boot code to reside in external memory, but image deployment and recovery procedures must be designed explicitly. For reliable logging behavior, use buffered writes, wear-aware storage management, and a verified power-loss strategy. The 100-TFBGA footprint also calls for assembly capability and careful decoupling around the MCU supply balls.

🔧

USB-to-Serial Adapter

The LPC1830FET100Y can implement a high-performance USB-to-serial adapter because it includes two high-speed USB controllers and a 180 MHz Cortex-M3 core. One USB interface can expose the adapter to a host, while the other can support device or OTG roles, depending on the board implementation. The processor has 200 kB of SRAM for buffering and protocol handling, and the ROMless architecture supports a compact external-memory design. An RS-232 transceiver such as the SP232 family is appropriate for legacy serial ports, while USB connector, protection, and ESD requirements must be handled separately. Firmware should include flow control, baud-rate handling, and robust enumeration behavior, and the high-speed USB traces should use a layout that minimizes skew and radiation.

🏭

Industrial Automation Module

The LPC1830FET100Y fits an industrial automation module that must combine real-time control with multiple communications paths. Its Cortex-M3 core operates up to 180 MHz, its State Configurable Timers support adaptable timing functions, and its GPIO interfaces can drive sensors, relays, and actuators. Ethernet, CAN 2.0B, and USB enable supervisory communication, configuration, and diagnostics. With 200 kB of SRAM, the controller can support protocol stacks and working buffers without external SRAM. A practical implementation should use an external CAN transceiver, isolated interfaces for long cable runs, hardware watchdog support, and careful reset and boot design. Because the MCU is ROMless, production programming and field-update procedures must be included in the system architecture.

⚡

Test and Measurement Controller

The LPC1830FET100Y can serve as the control processor in a compact test-and-measurement instrument because its 180 MHz performance supports responsive acquisition orchestration and the 200 kB of SRAM accommodates buffers and control state. The two high-speed USB controllers provide useful paths for high-bandwidth data transfer to a test host, while Ethernet supports remote control and LAN-based instrumentation. The SPI Flash Interface is useful for booting from compatible external flash and may also serve data-storage duties. Designers should partition timing-critical acquisition functions from noncritical USB or network activity, use controlled-impedance routing for high-speed interfaces, and validate grounding and decoupling around the 100-ball BGA. Production firmware needs a reliable update mechanism because no internal program ROM is specified.

What are the key specifications of LPC1830FET100Y that engineers should know?
The LPC1830FET100Y is a 32-bit ARM Cortex-M3 microcontroller that operates up to 180 MHz and includes 200 kB of SRAM in a 100-ball TFBGA package. Its verified connectivity features include Ethernet, two high-speed USB controllers with Host, OTG, and Device support, CAN 2.0B, a SPI Flash Interface, and two State Configurable Timers. According to the NXP LPC1830FET100 product information, the device is ROMless and supports 2.5 V or 3.3 V operation.
What is the operating voltage of LPC1830FET100Y?
The LPC1830FET100Y supports 2.5 V and 3.3 V operation. According to the verified NXP product information and distributor specifications, this is a ROMless Cortex-M3 microcontroller intended for embedded systems requiring external boot memory. The selected supply level must also be compatible with the external flash, Ethernet PHY, USB transceiver, CAN transceiver, and other connected circuitry because the MCU voltage does not independently determine the voltage tolerance of the complete interface subsystem.
How much memory does LPC1830FET100Y have?
The LPC1830FET100Y contains 200 kB of SRAM and has no on-chip program memory. According to the NXP LPC1830FET100 product page, the MCU is ROMless, so a suitable external boot memory device is required. The dedicated SPI Flash Interface can be used to access compatible serial flash, but the selected flash device, interface mode, address capacity, and boot configuration must be validated against the complete system design.
Does LPC1830FET100Y support Ethernet, USB, and CAN?
Yes, the LPC1830FET100Y includes Ethernet, two high-speed USB controllers, and a CAN 2.0B controller. The NXP product information identifies USB Host, OTG, and Device operation, while the verified family description identifies Ethernet and CAN connectivity. These controllers make the MCU suitable for gateways and industrial controllers, although external Ethernet PHYs, USB transceivers where required, and CAN transceivers are normally needed to connect the MCU to physical networks.
Where can I download the LPC1830FET100 datasheet PDF?
The official LPC1830FET100 datasheet can be obtained through the NXP product page linked as the datasheet URL, with the family documentation also available through the verified NXP LPC1830FET100 product resources. The manufacturer documentation is the preferred source for the complete 100-ball pinout, electrical limits, boot configuration, clock tree, peripheral behavior, and PCB recommendations. Distributor-hosted copies should be checked against NXP for the latest document revision.
Where can I find the LPC1830FET100Y pinout?
The LPC1830FET100Y pinout is documented in the manufacturer LPC1830FET100 datasheet because the device uses a 100-ball TFBGA package. The verified product information confirms the TFBGA-100 format and 9 x 9 mm body size but does not provide a complete verified ball map in the supplied excerpts. Consequently, no ball assignments are reproduced here; use the official NXP pinout and land-pattern drawings before laying out or assembling the PCB.
Where can I buy LPC1830FET100Y online?
The LPC1830FET100Y can be ordered from the verified NXP, DigiKey, and Mouser product pages, with DigiKey also showing a buy-now message in the retrieved listing. The part is offered in tape-and-reel packaging according to the verified distributor data. Exact stock, lead time, and transaction price can change by region and quantity, so request a current quotation before committing a production BOM. XAIPART prices were not present in the supplied records.
What is the price of LPC1830FET100Y?
The verified LPC1830FET100Y records confirm distributor availability and access to pricing, but they do not expose a numeric unit price. Therefore, the current price cannot be stated without inventing a value. As of 2026-10-30, the verified DigiKey and Mouser listings are the appropriate references for a live quote, and the XAIPART tier fields remain null until verified transaction pricing is supplied. Bulk quantities can receive distributor pricing, but the actual breaks must be confirmed directly.
What is the lead time for LPC1830FET100Y?
The exact lead time for LPC1830FET100Y is not specified in the supplied records. The DigiKey search result states that the part ships today, which indicates current listing availability at retrieval time, but it does not establish a guaranteed lead time for every quantity or every order date. As of 2026-10-30, engineers should request a scheduled delivery commitment from NXP or the authorized distributor for production quantities rather than relying on the general listing message.
Is LPC1830FET100Y in stock?
The verified DigiKey result states that LPC1830FET100Y can be bought and ships today, indicating distributor-listed availability when the page was retrieved on 2026-10-30. This does not guarantee a fixed quantity at all times, particularly for scheduled production builds. Mouser, NXP, and Octopart also provide product or inventory links. Confirm the requested quantity, date code, package form, and country-specific logistics before treating the part as reserved stock.
What can replace LPC1830FET100Y?
No verified pin-to-pin drop-in replacement for the LPC1830FET100Y was identified in the supplied cross-reference results. The available records mention the same-device ordering code LPC1830FET100,551 and larger-memory LPC1830 variants, but the former is not an engineering substitute and the latter may use a different package. According to the verified NXP product page, replacement evaluation must therefore cover the 100-ball TFBGA footprint, 180 MHz operation, 200 kB SRAM, Ethernet, USB, CAN, and boot requirements.
What is the best drop-in replacement for LPC1830FET100Y?
No drop-in replacement is established by the verified data, so engineers should not substitute a candidate without a manufacturer-approved pin and peripheral comparison. The required replacement must retain the 100-ball TFBGA footprint and preserve the LPC1830FET100Y's 180 MHz Cortex-M3 performance, 200 kB SRAM, Ethernet, dual high-speed USB, CAN 2.0B, SPI Flash Interface, State Configurable Timer, and ROMless boot architecture. The cross-reference searches returned lookup tools rather than verified equivalent MPNs.
LPC1830FET100Y vs LPC1830FET256K - which is better for an industrial design?
The LPC1830FET100Y is the better verified choice when its 200 kB SRAM and 100-TFBGA package satisfy the design, while LPC1830FET256K may be considered only after its package, flash, memory, peripheral, and pin details are verified. The supplied comparison result describes similar primary performance but does not establish a pin-compatible drop-in relationship. According to the verified NXP information, the target includes 180 MHz operation, Ethernet, USB, CAN, SPIFI, and State Configurable Timers.
When should I choose LPC1830FET100Y over another Cortex-M3 microcontroller?
Choose the LPC1830FET100Y when a design specifically benefits from its combination of 180 MHz Cortex-M3 performance, 200 kB SRAM, Ethernet, two high-speed USB controllers, CAN 2.0B, SPI Flash Interface, and State Configurable Timers. The verified NXP information positions it as a cost-effective high-performance MCU for connected equipment. However, its ROMless architecture requires external boot memory, and its 100-ball TFBGA assembly demands advanced PCB and manufacturing capability.
Is LPC1830FET100Y suitable for industrial Ethernet and USB gateway designs?
The LPC1830FET100Y is suitable for industrial Ethernet and USB gateway designs because the verified NXP product information identifies 180 MHz operation, Ethernet, two high-speed USB controllers, 200 kB SRAM, and CAN 2.0B. The MCU can coordinate protocol conversion, device management, and real-time control. External PHYs and transceivers are still required, and the ROMless design must include boot flash, power sequencing, controlled-impedance routing, and industrial-temperature qualification for the finished system.

Impormasyon ng Talumpati sa Engineering for LPC1830FET100Y — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.

Paunawang Hanapin

Choose the LPC1830FET100Y when the design needs a 180 MHz ARM Cortex-M3 MCU with 200 kB of SRAM, Ethernet, two high-speed USB controllers, CAN 2.0B, a SPI Flash Interface, and State Configurable Timers in a 100-TFBGA package. It is particularly attractive for connected industrial controllers, gateways, data loggers, and test equipment where several communication paths must share one processor. The trade-offs are the ROMless requirement for external boot memory, the need for advanced BGA PCB and assembly capability, and the use of external PHYs or transceivers for physical network connectivity. Do not select a substitute solely because it has a similar Cortex-M3 core: no verified drop-in alternative was found, and any migration must preserve the exact ball map, memory architecture, boot process, peripheral behavior, and high-speed interface requirements.

Ikabit sa Mga Alternatibo

Parametro Ito ang Producto
Package TFBGA-100, 9 x 9 mm
Brand NXP
Processor Core ARM Cortex-M3
Maximum Frequency 180 MHz
Internal SRAM 200 kB
Program Memory ROMless
Supply Voltage 2.5 V or 3.3 V
Connectivity Ethernet, 2 high-speed USB controllers, CAN 2.0B

Pangunahing mga Pagkakaiba

  • Combines network and high-speed USB connectivity in one Cortex-M3 controller (kumpara saA basic 32-bit microcontroller without integrated Ethernet and USB)
  • Provides substantial internal SRAM for a ROMless embedded design (kumpara saA low-memory Cortex-M3 microcontroller)
  • Supports external serial flash through a dedicated interface (kumpara saA microcontroller limited to conventional external memory interfaces)

Talaan ng Disenyo

Design the PCB around the manufacturer-recommended 100-ball TFBGA land pattern rather than adapting a TQFP footprint. Provide a controlled via-in-pad or via-beneath-ball strategy where the package and assembly process permit it, and preserve sufficient solder mask and copper definition for reliable ball attachment. The 9 x 9 mm body concentrates many I/O and power balls beneath a compact area, so escape-routing congestion should be evaluated before placement of memory, PHY, and transceiver circuits.

Route both supply domains to the MCU through low-impedance planes and place the manufacturer-recommended decoupling capacitors adjacent to the relevant power balls. The LPC1830FET100Y supports 2.5 V or 3.3 V operation, so the selected voltage must be coordinated with the external flash, Ethernet PHY, USB interface, and CAN transceiver. Separate noisy digital activity from analog sensing areas, and use test points that allow supply ripple and sequencing to be checked without disturbing the high-speed signal paths.

Apply controlled-impedance routing and careful reference-plane continuity to Ethernet and high-speed USB interfaces. Keep the external PHY, transceiver, and connector paths short, minimize stubs, and avoid splitting power or ground planes beneath signal pairs. Although the MCU operates up to 180 MHz, its external interfaces have their own edge-rate and impedance requirements. Validate the final stack-up with the fabricator and test completed assemblies for eye quality, skew, and susceptibility to adjacent switching noise.

Do not treat this ROMless MCU as a self-bootable device. The system must include compatible external boot memory, a valid initial image, and a defined boot configuration. Also confirm the exact 100-ball pin map, exposed thermal and supply-ball assignments, and assembly requirements from the current NXP datasheet rather than inferring them from a generic BGA drawing. Confirming the Y ordering code, reel form, temperature grade, and lifecycle status during procurement prevents last-minute assembly and sourcing issues.

Impormasyon ng Pagsunod sa Kautusan

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Walang Lead
Unknown
Walang Halogen
Unknown
Mga Conflict Mineral
Unknown

The supplied verified excerpts identify the device and its technical features but do not provide explicit compliance declarations. No RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status has been inferred.

Kaugnay na Hanapin

LPC1830FET100Y LPC1830FET100Y datasheet NXP LPC1830FET100Y LPC1830FET100Y 180MHz Cortex-M3 LPC1830FET100Y 200kB SRAM LPC1830FET100 TFBGA-100 LPC1830FET100Y Ethernet USB CAN microcontroller LPC1830FET100Y pinout LPC1830FET100Y drop-in replacement LPC1830FET100Y price LPC1830FET100Y buy online LPC1830FET100Y industrial gateway

Mga kaugnay na Mga Komponente at mga Tuntunin

NXP LPC1830FET100Y LPC1830FET100 LPC1830FET256K ARM Cortex-M3 microcontroller embedded processor semiconductor 200 kB SRAM ROMless architecture Ethernet controller High-Speed USB 2.0 CAN 2.0B SPI Flash Interface State Configurable Timer TFBGA-100 BGA package family surface-mount technology 180 MHz 2.5 V 3.3 V industrial Ethernet USB gateway CAN network
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