LPC1830FET100Y - 180MHz Cortex-M3 MCU | NXP | Industrial
部品番号: LPC1830FET100Y ✓ 生産中LPC1830FET100Y 概要
A microcontroller is a programmable semiconductor that integrates a processor core, memory interfaces, communication peripherals, timers, and general-purpose I/O into one compact device. The LPC1830 belongs to the Cortex-M3 embedded-processing hierarchy, where a microcontroller sits below the broader category of microprocessors and above application-specific embedded control systems. It combines deterministic real-time control with network and high-speed connectivity.
The LPC1830FET100Y provides 200 kB of SRAM and operates from 2.5 V or 3.3 V, according to the verified NXP and distributor product information. Its Ethernet controller, two high-speed USB interfaces, and CAN 2.0B controller support connected industrial, communications, and data-acquisition equipment. The dedicated SPI Flash Interface allows the MCU to access external serial flash, while the State Configurable Timer supports timing functions that can be adapted to different control tasks.
Operation up to 180 MHz provides sufficient processing performance for protocol handling, control logic, and concurrent peripheral activity. Because the device is ROMless, designers must provide suitable external boot memory and include a valid startup image in the system architecture. The 100-TFBGA package also requires careful PCB layout, with short escape routing and a ball grid that is not directly compatible with a conventional fine-pitch TQFP footprint.
Typical applications include industrial Ethernet controllers, USB-to-serial and USB-to-CAN gateways, network-connected instrumentation, embedded data loggers, and industrial automation modules. The Ethernet and USB peripherals are especially useful where a single controller must bridge embedded processing with external hosts or network equipment. CAN support also permits connection to industrial bus nodes, sensors, and actuator networks.
A primary design consideration is the 100-ball BGA assembly process. The PCB should be designed for the manufacturer-recommended land pattern, with controlled impedance routing for Ethernet and USB, local decoupling near each supply ball, and thermal-via placement beneath the device where required. Component availability, flash configuration, boot behavior, and interface timing must be validated before production release.
This product page consolidates verified manufacturer and distributor information, identifies the MCU's principal connectivity and memory features, and documents the engineering trade-offs associated with its ROMless architecture, 100-TFBGA package, and external peripheral ecosystem.
ドロップイン代替品: LPC1830FET100Y — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストLPC1830FET100Y 最大定格＆電気的特性
| Product Type | 32-bit ARM Cortex-M3 microcontroller |
| Processor Core | ARM Cortex-M3 |
| Maximum Operating Frequency | 180 MHz |
| Instruction Set Width | 32 bit |
| Internal SRAM | 200 kB |
| Program Memory | ROMless; external boot memory required |
| 動作電源電圧 | 2.5 V or 3.3 V |
| Ethernet Interface | 1 Ethernet controller |
| USB Interface | 2 high-speed USB controllers supporting Host, OTG, and Device roles |
| CAN Interface | CAN 2.0B controller |
| SPI Flash Interface | 1 configurable SPI Flash Interface |
| State Configurable Timer | 2 State Configurable Timer peripherals |
| Wake-Up Function | Wake-up function supported |
| Package Type | TFBGA-100 |
| Package Dimensions | 9 x 9 mm |
| Package Pin Count | 100 balls |
| 実装タイプ | Surface mount |
| Supplier Packaging | Tape and reel |
LPC1830FET100Y 100 balls ピン配置ガイド
LPC1830FET100Y (100 balls パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LPC1830FET100Y.
詳細は データシート をご参照ください。
主な用途
LPC1830FET100Y の用途: 6 件s: Industrial Ethernet Controller, USB-to-CAN Gateway, Networked Data Logger, USB-to-Serial Adapter, Industrial Automation Module, Test and Measurement Controller.
Industrial Ethernet Controller
The LPC1830FET100Y fits industrial Ethernet controller designs because its 180 MHz ARM Cortex-M3 core provides processing capacity for protocol handling, while the integrated Ethernet controller supports network communication without requiring the MCU itself to act as the physical transceiver. The 200 kB of SRAM can hold protocol state, buffers, and application data. The device also includes two high-speed USB controllers and CAN 2.0B, allowing a single embedded controller to coordinate local diagnostics and field-bus tasks. In a production design, an external Ethernet PHY, 2.5 V or 3.3 V-compatible supply rails, and the manufacturer-recommended 100-TFBGA layout are required. Controlled-impedance traces and local decoupling are particularly important because Ethernet signal integrity and supply disturbance can affect the 180 MHz processing path.
おすすめ
USB-to-CAN Gateway
The LPC1830FET100Y is appropriate for a USB-to-CAN gateway because it combines two high-speed USB controllers, a CAN 2.0B controller, and a 180 MHz Cortex-M3 processor. Firmware can bridge USB traffic to an industrial CAN network, maintain protocol buffers, and provide diagnostic status through the available GPIO. Its 200 kB of SRAM offers useful working memory for message queues and gateway state, although the ROMless configuration still requires external boot flash. The implementation needs a USB connector and appropriate USB transceiver or controller circuitry, a CAN transceiver such as the MC3487 family, galvanic-isolation options where required, and careful separation between high-speed USB routing and slower protected CAN interfaces.
おすすめ
Networked Data Logger
The LPC1830FET100Y suits a networked data logger because it combines 200 kB of SRAM, a 180 MHz processor, Ethernet, two high-speed USB interfaces, and a dedicated SPI Flash Interface. The SPI Flash Interface can support access to compatible external serial storage, while Ethernet or USB provides a path for transferring records to a host. The ROMless architecture allows firmware and boot code to reside in external memory, but image deployment and recovery procedures must be designed explicitly. For reliable logging behavior, use buffered writes, wear-aware storage management, and a verified power-loss strategy. The 100-TFBGA footprint also calls for assembly capability and careful decoupling around the MCU supply balls.
おすすめ
USB-to-Serial Adapter
The LPC1830FET100Y can implement a high-performance USB-to-serial adapter because it includes two high-speed USB controllers and a 180 MHz Cortex-M3 core. One USB interface can expose the adapter to a host, while the other can support device or OTG roles, depending on the board implementation. The processor has 200 kB of SRAM for buffering and protocol handling, and the ROMless architecture supports a compact external-memory design. An RS-232 transceiver such as the SP232 family is appropriate for legacy serial ports, while USB connector, protection, and ESD requirements must be handled separately. Firmware should include flow control, baud-rate handling, and robust enumeration behavior, and the high-speed USB traces should use a layout that minimizes skew and radiation.
おすすめ
Industrial Automation Module
The LPC1830FET100Y fits an industrial automation module that must combine real-time control with multiple communications paths. Its Cortex-M3 core operates up to 180 MHz, its State Configurable Timers support adaptable timing functions, and its GPIO interfaces can drive sensors, relays, and actuators. Ethernet, CAN 2.0B, and USB enable supervisory communication, configuration, and diagnostics. With 200 kB of SRAM, the controller can support protocol stacks and working buffers without external SRAM. A practical implementation should use an external CAN transceiver, isolated interfaces for long cable runs, hardware watchdog support, and careful reset and boot design. Because the MCU is ROMless, production programming and field-update procedures must be included in the system architecture.
おすすめ
Test and Measurement Controller
The LPC1830FET100Y can serve as the control processor in a compact test-and-measurement instrument because its 180 MHz performance supports responsive acquisition orchestration and the 200 kB of SRAM accommodates buffers and control state. The two high-speed USB controllers provide useful paths for high-bandwidth data transfer to a test host, while Ethernet supports remote control and LAN-based instrumentation. The SPI Flash Interface is useful for booting from compatible external flash and may also serve data-storage duties. Designers should partition timing-critical acquisition functions from noncritical USB or network activity, use controlled-impedance routing for high-speed interfaces, and validate grounding and decoupling around the 100-ball BGA. Production firmware needs a reliable update mechanism because no internal program ROM is specified.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LPC1830FET100Y — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 |
|---|---|
| Package | TFBGA-100, 9 x 9 mm |
| Brand | NXP |
| Processor Core | ARM Cortex-M3 |
| Maximum Frequency | 180 MHz |
| Internal SRAM | 200 kB |
| Program Memory | ROMless |
| Supply Voltage | 2.5 V or 3.3 V |
| Connectivity | Ethernet, 2 high-speed USB controllers, CAN 2.0B |
主な差別化要因
- Combines network and high-speed USB connectivity in one Cortex-M3 controller （vs A basic 32-bit microcontroller without integrated Ethernet and USB)
- Provides substantial internal SRAM for a ROMless embedded design （vs A low-memory Cortex-M3 microcontroller)
- Supports external serial flash through a dedicated interface （vs A microcontroller limited to conventional external memory interfaces)
設計ノート
Design the PCB around the manufacturer-recommended 100-ball TFBGA land pattern rather than adapting a TQFP footprint. Provide a controlled via-in-pad or via-beneath-ball strategy where the package and assembly process permit it, and preserve sufficient solder mask and copper definition for reliable ball attachment. The 9 x 9 mm body concentrates many I/O and power balls beneath a compact area, so escape-routing congestion should be evaluated before placement of memory, PHY, and transceiver circuits.
Route both supply domains to the MCU through low-impedance planes and place the manufacturer-recommended decoupling capacitors adjacent to the relevant power balls. The LPC1830FET100Y supports 2.5 V or 3.3 V operation, so the selected voltage must be coordinated with the external flash, Ethernet PHY, USB interface, and CAN transceiver. Separate noisy digital activity from analog sensing areas, and use test points that allow supply ripple and sequencing to be checked without disturbing the high-speed signal paths.
Apply controlled-impedance routing and careful reference-plane continuity to Ethernet and high-speed USB interfaces. Keep the external PHY, transceiver, and connector paths short, minimize stubs, and avoid splitting power or ground planes beneath signal pairs. Although the MCU operates up to 180 MHz, its external interfaces have their own edge-rate and impedance requirements. Validate the final stack-up with the fabricator and test completed assemblies for eye quality, skew, and susceptibility to adjacent switching noise.
Do not treat this ROMless MCU as a self-bootable device. The system must include compatible external boot memory, a valid initial image, and a defined boot configuration. Also confirm the exact 100-ball pin map, exposed thermal and supply-ball assignments, and assembly requirements from the current NXP datasheet rather than inferring them from a generic BGA drawing. Confirming the Y ordering code, reel form, temperature grade, and lifecycle status during procurement prevents last-minute assembly and sourcing issues.
コンプライアンス情報
The supplied verified excerpts identify the device and its technical features but do not provide explicit compliance declarations. No RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status has been inferred.
