MPC8241TVR200D - PowerQUICC II 200MHz Host Processor | NXP
MPN: MPC8241TVR200D ✗ Tapus ng BuhayMPC8241TVR200D Ulas
An integrated host processor is a system-on-chip (SoC) variant that combines a microprocessor core with chipset-style peripherals (memory controller, I/O bridges) typically implemented as separate devices on industrial motherboards. The MPC82xx PowerQUICC II line sits between a bare MPU and a full SoC; it provides deterministic embedded performance with embedded DRAM support and a dedicated PCI interface for connecting standard PCI peripherals. This category hierarchy (MPU -> integrated host processor -> embedded SoC -> semiconductor) matters for engineers designing cost- and space-constrained embedded systems where a full SoC is overkill but a bare MPU plus discrete peripherals wastes board area.
Key features include a 200 MHz PowerPC 603e core (0.25 micron process), 1.8 V core voltage with 3.3 V I/O, integrated PCI bridge (32-bit/33 MHz), SDRAM/EDO ROM/Flash memory controller, and a peripheral logic block supporting two UARTs, I2C, and an interrupt controller. The integrated host processor reduces system chip count, board area, and power consumption while maintaining a familiar PowerPC programming model. The -40C to +105C industrial operating range supports harsh-environment deployments such as industrial control, network routers, and storage controllers.
Typical applications include embedded routers and switches, industrial automation controllers, single-board computers, printer imaging controllers, and storage area network (SAN) adapters. The PCI bridge enables connection to standard PCI peripherals while the integrated memory controller removes the need for an external northbridge. Compared to the earlier MPC860 PowerQUICC I family, the MPC8241 trades telecom-specific peripherals for a higher-performance CPU core and standard PCI connectivity.
When designing with the MPC8241, pay attention to decoupling capacitor placement around the BGA power balls and ensure the thermal pad design dissipates the typical 1.5-2.0 W core power under sustained load. The 25x25 mm BGA requires a 4-layer or 6-layer PCB with controlled-impedance routing for the DDR/SDRAM interface.
This page synthesizes distributor pricing, drop-in same-family alternatives, and design considerations not collocated on the manufacturer datasheet, enabling faster procurement and design-in decisions.
Mga alternatibo na pwedeng ilagay na MPC8241TVR200D — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok MPC8241TVR200D (parehas na form factor at footprint) — pagkakaiba sa Integrated PCI Bridge, Mounting Type, Operating Temperature, Package / Case.
MPC8241LVR200D
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →MPC8241TZQ200D
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
MPC8241TVR200D Mga Pinakamataas na Rating at Electrical Characteristics
| Core Architecture | PowerPC 603e |
| Series | MPC82xx PowerQUICC II |
| Width ng Data Bus | 32-bit |
| Core Speed | 200 MHz |
| Process Technology | 0.25 micron CMOS |
| Core Voltage | 1.8 V |
| I/O Voltage | 3.3 V |
| Number of Cores | 1 |
| Packhaging / Kaso | 357-PBGA (25 x 25 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) |
| Temperature na Operasyon | -40C to +105C |
| Integrated Peripheral | PCI bridge (32-bit/33 MHz), memory controller, UART, I2C |
| Memory Support | SDRAM, EDO DRAM, ROM, Flash |
| Packaging | Tray |
| Tindminan RoHS | RoHS compliant |
| Lead-Free Status | Lead Free |
Gabay sa Pin Configuration ng MPC8241TVR200D 357-pbga (25 x 25 mm)
Pin configuration para sa MPC8241TVR200D (357-pbga (25 x 25 mm) package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa MPC8241TVR200D.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
MPC8241TVR200D ay nararapat para sa 6 aplikasyons: Embedded Router / Switch, Industrial Automation Controller, Single-Board Computer (SBC), Printer Imaging Controller, Storage Area Network (SAN) Adapter, Legacy Network Infrastructure.
Embedded Router / Switch
The MPC8241TVR200D's integrated PowerPC 603e core at 200 MHz, combined with the on-chip PCI bridge and memory controller, makes it well-suited for embedded router and switch applications. The PCI bridge enables direct connection to PCI-based network interface cards and switch fabrics, while the integrated memory controller eliminates an external northbridge, reducing board area and BOM. The 32-bit data path handles line-rate packet processing for Fast Ethernet and basic Gigabit uplinks, and the -40C to +105C industrial temperature range supports deployment in uncontrolled-environment telecom closets. Compared to a discrete MPU plus chipset design, the MPC8241 reduces power consumption by integrating five functions into one device.
Inirekomenda
Industrial Automation Controller
For industrial automation controllers, the MPC8241TVR200D delivers the deterministic PowerPC architecture with on-board PCI expansion for I/O modules. The integrated UARTs and I2C interface connect to sensors, motor drives, and HMI panels without requiring an external Super I/O chip. Industrial -40C to +105C operation ensures reliable deployment on factory floors. The 357-PBGA package supports surface-mount assembly on standard 4-layer PCBs, and the 0.25 micron CMOS process keeps typical power dissipation around 1.5-2.0 W, simplifying thermal management in sealed enclosures.
Inirekomenda
Single-Board Computer (SBC)
The MPC8241TVR200D's high level of integration - combining CPU, memory controller, PCI bridge, and basic peripherals on one die - enables compact single-board computers for embedded computing applications. System designers can build a full SBC around a single MPC8241 plus SDRAM, Flash, and a PCI Ethernet controller, achieving a small form factor suitable for medical carts, kiosks, and transportation signage. The 200 MHz core provides adequate throughput for Linux or VxWorks-based control software, while the PCI bridge allows add-in mezzanine cards for application-specific I/O.
Inirekomenda
Printer Imaging Controller
In printer imaging controllers, the MPC8241TVR200D's PCI bridge enables high-bandwidth connection to image processing ASICs and scanner modules. The 32-bit PowerPC 603e core handles page-description language (PDL) rasterization at engine speeds, while the integrated memory controller provides direct SDRAM access for image buffers. The industrial temperature range suits printer engines that run hot. PowerQUICC II's mature firmware ecosystem (VxWorks, Linux, MontaVista) accelerates time-to-market for printer OEMs building on the MPC8241 reference platform.
Inirekomenda
Storage Area Network (SAN) Adapter
The MPC8241TVR200D serves as the host processor for SAN adapters and RAID controllers, where its PCI bridge interfaces with Fibre Channel or SAS controller ASICs. The 200 MHz PowerPC 603e handles command queuing, caching algorithms, and SCSI/Fibre Channel protocol stacks, while the integrated memory controller buffers DMA transfers to system SDRAM. The reduced chip count (versus a discrete MPU plus northbridge design) lowers BOM cost for storage OEMs, and the industrial temperature rating supports deployment in enterprise server rooms.
Inirekomenda
Legacy Network Infrastructure
For maintaining legacy network infrastructure such as older routers, base-station controllers, and access multiplexers, the MPC8241TVR200D provides long-term service continuity. The part's mature firmware ecosystem and stable PowerPC architecture ensure reliable operation in deployed equipment, and NXP's NRND status (with continued supply via Rochester Electronics) supports maintenance contracts. Engineers performing field repairs can order the MPC8241TVR200D as a direct replacement for failed units without redesigning the host board, preserving multi-million-dollar network investments.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for MPC8241TVR200D — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | MPC8241LVR200D | MPC8241TZQ200D |
|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Speed | 200 MHz | 200 MHz | 200 MHz |
| Core Voltage | 1.8 V | 1.5 V (lower voltage) | 1.8 V |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C |
| Integrated PCI Bridge | Yes (32-bit / 33 MHz) | Yes (32-bit / 33 MHz) | Yes (32-bit / 33 MHz) |
| Memory Controller | SDRAM, EDO DRAM, ROM, Flash | SDRAM, EDO DRAM, ROM, Flash | SDRAM, EDO DRAM, ROM, Flash |
| Lifecycle Status | NRND (Not Recommended for New Designs) | NRND | NRND |
Pangunahing mga Pagkakaiba
- Same-family drop-in with slightly lower core voltage (kumpara saMPC8241LVR200D)
- Alternative speed-grade suffix variant (kumpara saMPC8241TZQ200D)
- Single-chip integration vs discrete chipset (kumpara saDiscrete MPU + northbridge design)
Talaan ng Disenyo
The 357-PBGA package requires a 4-layer or 6-layer PCB with via-in-pad or dog-bone fanout for the BGA balls. Place decoupling capacitors (0.1 uF X7R minimum) within 2-3 mm of every power/ground ball pair. Use a continuous ground plane on layer 2 and a power plane on layer 3 for the 1.8 V core and 3.3 V I/O rails. Maintain 50 ohm controlled impedance for the SDRAM address/data bus and 90 ohm differential impedance for PCI bus signals.
Estimated: at 200 MHz core clock and 1.8 V core supply, the MPC8241TVR200D dissipates approximately 1.5-2.0 W under sustained CPU load (input values: Vcore=1.8V, Icore~1.0A, plus I/O activity). On the 25x25 mm PBGA, the theta_JA is approximately 15-20 C/W (with proper PCB thermal vias), resulting in a 30-40C junction temperature rise above ambient at room temperature. At the upper operating temperature limit (105C junction), derate CPU activity or add active cooling in sealed enclosures. Place thermal vias under the central BGA power balls to conduct heat to the internal ground plane.
Do not confuse the MPC8241 (PowerQUICC II, integrated host processor) with the earlier MPC860 (PowerQUICC I, communications processor) - they have different peripheral sets and PCI implementations. When migrating firmware between PowerQUICC generations, verify register definitions and endian configuration. The BGA has no leads for visual inspection; design for X-ray inspection or boundary-scan test access. Ensure JTAG TCK/TMS/TDO/TDI are accessible for in-system programming and debug.
Impormasyon ng Pagsunod sa Kautusan
RoHS compliant and lead-free per NXP product page and DigiKey listing. REACH compliance status not explicitly stated in verified data. Not AEC-Q100 qualified (industrial MPU, not automotive grade). Conflict minerals reporting status should be confirmed with NXP for latest declaration.
