XC3S5000-4FG676C - 5M Gate Spartan-3 FPGA, 676-BGA | Xilinx
MPN: XC3S5000-4FG676C ⚠ Huling PagbiliXC3S5000-4FG676C Ulas
A field-programmable gate array is a reconfigurable digital semiconductor: an FPGA contains an array of programmable logic blocks, block RAM, dedicated multipliers and programmable I/O, so a design is implemented by writing a bitstream into on-chip configuration memory rather than fabricating a custom ASIC mask set. In the device hierarchy, an FPGA sits above a programmable logic device (PLD) and a fixed-function logic IC, and below an ASIC, inside the broader category of programmable logic semiconductors.
Key features of this device include a -4 speed grade for higher performance timing, a commercial temperature option indicated by the C suffix, 676 ball-grid-array package balls providing 489 available user I/O in the FGG676 variant, 4 DCMs for clock generation, de-skew and jitter removal, and 104 18x18 signed multipliers for DSP-style multiply-accumulate work without external DSP chips. The device belongs to the Spartan-3 cost-optimized family, which was designed for high-volume consumer and industrial electronics.
Technically, the XC3S5000-4FG676C couples configurable logic slices with dedicated arithmetic and memory resources so that filter, correlation, protocol and control functions can be consolidated in one device. The DCMs generate four-phase and divided clocks on-chip, which reduces external clock-tree components and simplifies timing closure in designs with multiple clock domains. Configuration is loaded from an external non-volatile memory or a processor bus through the standard serial or parallel configuration ports.
Typical applications include industrial control and factory automation, video and image processing, network packet handling, instrumentation and test equipment, embedded consumer products, and digital signal conditioning in communication equipment. The large logic-cell count and 489 available user I/Os suit designs that need parallel parallel-bus interfaces, multiple data converters, or wide video capture and processing paths.
One design consideration is that the 676-ball FBGA is a fine-pitch, lead-free-intensive package that requires careful PCB layout with solid ground and power planes, controlled-length configuration traces and Xilinx-recommended decoupling. Design for the -4 speed grade timing constraints, and verify that the target board uses the same 676-ball footprint and ball map if you intend to migrate between the FG, FGG, I and C suffix variants.
This page consolidates device specifications, drop-in package-compatible alternatives, a parameter-by-parameter comparison and practical layout and configuration guidance into a single engineering reference for engineers evaluating the Spartan-3 XC3S5000 in production designs.
Mga alternatibo na pwedeng ilagay na XC3S5000-4FG676C — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok XC3S5000-4FG676C (parehas na form factor at footprint) — pagkakaiba sa Device Type, Logic Cells, Package, System Gates.
XC3S5000-4FGG676C
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
XC3S5000-4FGG676I
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
XC3S5000-4FG676I
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →XC3S5000-4FG676
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
XC3S4000-4FGG676C
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
XC3S5000-4FG676C Mga Pinakamataas na Rating at Electrical Characteristics
| Device Type | Field-Programmable Gate Array (FPGA), Spartan-3 family |
| System Gates | 5,000,000 gates |
| Logic Cells | 74,880 logic cells |
| Block RAM | 1,728 Kbits |
| Dedicated Multipliers | 104 dedicated 18x18 multipliers |
| Digital Clock Managers (DCM) | 4 DCMs |
| Maximum User I/O | up to 489 user I/O pins (FGG676 variant) |
| Packhaging | 676-ball fine-pitch BGA (FBGA), square package |
| Total Terminals | 676 balls |
| Terminal Form | Ball |
| Speed Grade | -4 |
| Temperature Grade Suffix | C (commercial) |
| Configuration Memory | Programmable volatile configuration memory, loaded via serial or parallel configuration port |
| Uri ng Pagpapasok | Surface Mount |
| RoHS / Lead-Free Status | Pb-free variant available as XC3S5000-4FGG676C (double G suffix) |
| Katayuan ng Lifecycle | Mature family, last-time-buy availability from AMD/Xilinx distribution |
Gabay sa Pin Configuration ng XC3S5000-4FG676C 676-ball fine-pitch bga (fbga), square package
Pin configuration para sa XC3S5000-4FG676C (676-ball fine-pitch bga (fbga), square package package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa XC3S5000-4FG676C.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
XC3S5000-4FG676C ay nararapat para sa 6 aplikasyons: Industrial Control and Factory Automation, Video and Image Processing, Network Packet Processing, Instrumentation and Test & Measurement, Embedded Consumer and Edge Products, Digital Audio and Signal Conditioning.
Industrial Control and Factory Automation
The XC3S5000-4FG676C suits machine controllers and PLC-style I/O modules because it pairs 74,880 logic cells with up to 489 user I/Os in the 676-ball FBGA, letting one device absorb discrete input/output banks, encoder counters and interlock logic that would otherwise occupy several smaller FPGAs. The 104 dedicated 18x18 multipliers handle scaling and filtering of analog front-end signals without external DSP hardware, while the 4 digital clock managers generate divided and de-skewed clocks for stepper and servo timing. For installations with wide ambient swings, the XC3S5000-4FG676I industrial suffix is the appropriate variant. Keep analog and high-noise switching circuitry away from the ball field and follow the manufacturer decoupling layout to protect the I/O ring.
Inirekomenda
Video and Image Processing
Video capture, scaling and pixel-format conversion nodes benefit from the XC3S5000-4FG676C because the 676-ball package exposes enough user I/O to attach parallel or LVDS camera data, while 1,728 Kbits of block RAM holds line and frame buffers. The 104 hardware multipliers absorb FIR and correlation stages used in sharpening, motion detection and chroma conversion, which sharply reduces external DSP count and its associated board area. The 4 DCMs produce the pixel clock and derived enable signals on-chip, which keeps the external clock tree to a single oscillator. Confirm the I/O voltage tolerance of the connected image sensor and the serializer before layout, since the FPGA core and the I/O ring supply domains are configured separately.
Inirekomenda
Network Packet Processing
Line-card and gateway designs use the XC3S5000-4FG676C to implement packet classification, header parsing and buffering at line rate, because the 74,880 logic cells support multi-stage pipelines while 489 available user I/O satisfy parallel data-plane interfaces. Block RAM of 1,728 Kbits provides packet and descriptor FIFO storage, and the 4 digital clock managers generate the 125 MHz reference and its divided derived clocks for MAC and PHY interfaces. For designs that must tolerate industrial temperatures, use the XC3S5000-4FG676I variant in the identical footprint. Place the FPGA's ground balls on a solid uninterrupted plane and route the high-speed pairs away from switching converter inductors to protect the timing margins of the data path.
Inirekomenda
Instrumentation and Test & Measurement
Oscilloscope-like front ends, logic analyzers and automated test systems adopt the XC3S5000-4FG676C to combine acquisition, triggering, digital conversion and display-interface logic in a single reconfigurable device. The wide user I/O count accepts parallel ADC and DAC buses directly, the dedicated multipliers perform fast scaling and correlation on captured samples, and the on-chip DCMs derive precise sampling clocks with low jitter from a single reference. Reconfigurability is the decisive advantage: the same silicon can be re-flashed for different test profiles without a respin. Keep analog reference planes separated from the digital ball field and use the manufacturer's recommended via stitching under the BGA to return the switching return path directly to the ground plane.
Inirekomenda
Embedded Consumer and Edge Products
Cost-optimized consumer electronics and edge appliances benefit from the XC3S5000-4FG676C because a single Spartan-3 device can consolidate a display controller, touch interface, media decode glue and host peripheral bridging into one package, reducing board area and part count relative to discrete logic. The 1,728 Kbits of block RAM is enough to buffer frame data and host command queues, and 489 available user I/O cover panel drivers, keypad scans and peripheral buses. For consumer programs where cost dominates, the commercial-grade suffix is appropriate; for automotive or outdoor use, choose the industrial suffix in the same footprint. Plan the external configuration flash memory on the board since the device boots from an external non-volatile source.
Inirekomenda
Digital Audio and Signal Conditioning
Audio front ends, hearing-aid and instrumentation signal conditioners use the XC3S5000-4FG676C to implement filters, mixing and dynamic-range processing in programmable logic. The 104 dedicated multipliers allow parallel biquad and comb-filter sections at high sample rates, the block RAM provides delay lines and coefficient storage, and the 4 digital clock managers derive oversampling and delta-sigma clock trees from one master oscillator. Because the device is reconfigurable, one board can serve multiple channel counts and filter profiles with a firmware change instead of a hardware respin. Maintain short, well-grounded traces from the converters to the BGA balls, and treat the analog supply and reference nets as separate planes to avoid modulating the digital switching return path.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for XC3S5000-4FG676C — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | XC3S5000-4FGG676C | XC3S5000-4FGG676I | XC3S5000-4FG676I | XC3S4000-4FGG676C |
|---|---|---|---|---|---|
| Package | 676-ball FBGA | 676-ball FBGA - same | 676-ball FBGA - same | 676-ball FBGA - same | 676-ball FBGA - same |
| Brand | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) |
| Logic Cells | 74,880 logic cells | 74,880 logic cells | 74,880 logic cells | 74,880 logic cells | 62,208 logic cells (-17%) |
| System Gates | 5,000,000 gates | 5,000,000 gates | 5,000,000 gates | 5,000,000 gates | 4,000,000 gates |
| Speed Grade | -4 | -4 | -4 | -4 | -4 |
| Temperature Grade | Commercial (C) | Commercial (C) | Industrial (I) | Industrial (I) | Commercial (C) |
| Lead-Free Package | Standard FG package; FGG lead-free variant available | Lead-free (Pb-free balls) | Lead-free (Pb-free balls) | Standard FG package | Lead-free (Pb-free balls) |
Pangunahing mga Pagkakaiba
- Largest logic capacity among the drop-in options in the 676-ball footprint (kumpara saXC3S4000-4FGG676C)
- Lead-free package option without changing the device or the footprint (kumpara saXC3S5000-4FG676C)
- Industrial temperature coverage without a PCB change (kumpara saXC3S5000-4FGG676C)
- Integrated DSP and clock resources reduce external component count (kumpara saXC3S4000-4FGG676C)
- Wide user I/O access for parallel data and control interfaces (kumpara saXC3S5000-4FG900C)
Talaan ng Disenyo
The 676-ball FBGA is a 0.8 mm fine-pitch package, so the PCB footprint must come from the manufacturer package file set rather than a generic BGA generator. Use the recommended pad, solder mask and paste apertures, and verify that the ball map in the footprint matches the pinout table for the exact suffix you order, since FG and FGG variants share the die but are distinguished by their solder balls. Keep the board stack-up thin enough to hold the balls within the co-planarity window of the package.
Decouple every dedicated supply ball group with the manufacturer-specified combination of bulk and high-frequency ceramic capacitance placed directly at the ball pads, and stitch ground balls densely with vias into an uninterrupted ground plane. Separate the FPGA core supply from the I/O supplies so that switching noise on bank supplies does not inject into the core rail, and place the I/O decoupling close to the balls rather than at the connector or regulator. Sequence the core and I/O rails as required by the device's power-on behavior.
Route the configuration signals (mode pins, clock, data and INIT) with short, well-terminated traces away from high-current switching paths, and provide a dedicated external non-volatile memory plus a reliable path for the DONE and PROG handshake signals. Use the on-device digital clock managers as the single source of derived clocks and route clock nets as controlled-impedance nets with matched length to the clock-capable pins. Provide a clean, low-jitter reference clock and avoid sharing it with noisy digital nets.
A common mistake is assuming the XC3S5000-4FG676C and the XC3S5000-4FG900C are interchangeable, because they share the same die and speed grade while using different ball counts and footprints; swapping them requires a board redesign. A second pitfall is assuming suffix changes are cosmetic - the C, I and FG/FGG distinctions change temperature range and lead-free status. Always re-run synthesis, place-and-route and static timing analysis after any substitution, and confirm the pinout table for the ordered suffix.
Estimated: with a 5 V I/O supply at 3.3 V core voltage and 300 mA average dynamic current, core dissipation is roughly 0.5 W and I/O dissipation depends on edge activity and load capacitance; a ball-grid FPGA with no exposed heat sink relies on the board to remove heat. Provide generous copper under and around the BGA area, use thermal vias through the board where the layout rules allow, and keep switching regulators and inductors physically apart from the device so that heat and radiated noise do not degrade timing margins.
Impormasyon ng Pagsunod sa Kautusan
The double-G FGG package variants are the lead-free (Pb-free ball) versions of this device; the plain FG suffix is the standard ball package. Explicit RoHS, REACH and halogen-free declarations were not published for this part number and must be confirmed with the manufacturer before release.
