XC3S5000-4FG676I - 5M-Gate Spartan-3 FPGA | Xilinx
MPN: XC3S5000-4FG676I ✗ End of LifeXC3S5000-4FG676I Overview
A field-programmable gate array is a semiconductor whose digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy: FPGA → field-programmable gate array → programmable logic device → semiconductor. Instead of implementing a fixed function with hardwired gates, the Spartan-3 architecture combines configurable logic blocks with programmable interconnect. This makes the device suitable for parallel processing, protocol bridging, control logic, signal acquisition, and embedded systems whose algorithms may evolve after design release.
The XC3S5000-4FG676I provides 5 million system gates and 74,880 logic cells, with up to 489 I/O available through the 676-ball package. Its 630 MHz maximum clock supports demanding timing designs, while the 90 nm fabrication process and 1.2 V supply characterize this generation of programmable logic. The broad I/O count allows systems to connect substantial external memory, data converters, communications transceivers, and industrial interfaces without an external interface controller.
Spartan-3 devices use configurable logic blocks, programmable routing resources, dedicated multipliers, block RAM, digital clock management, and programmable I/O blocks. The -4 designation identifies the performance grade, FG676 identifies the package configuration, and I identifies the industrial temperature option. Exact pin functions, differential-I/O capabilities, supported standards, and configuration requirements must be checked against the device pinout and the AMD/Xilinx DS099 family documentation before layout or firmware implementation.
Typical applications include industrial control, telecommunications line-card and interface logic, high-speed data acquisition, digital signal processing, embedded video processing, storage controllers, and test-and-measurement equipment. The large logic capacity allows parallel datapaths and multi-channel processing, while the high I/O count supports memory-heavy and multi-interface designs. The 630 MHz ceiling provides substantial timing headroom for clocked pipelines, provided timing constraints, clocking, and physical implementation meet the design targets.
A critical design consideration is that FPGA migration depends on exact package balls, configuration pins, supply sequencing, bank voltages, and supported I/O standards. A device with the same gate count is not automatically interchangeable unless its package ballout and electrical constraints are verified. Use the AMD/Xilinx DS099 Spartan-3 FPGA Family data sheet for the authoritative pin and parameter definitions, and validate the selected board configuration with the final bitstream and timing analysis.
This product page consolidates the verified device identity, core resource figures, package information, design constraints, application guidance, and a validated same-package alternative candidate. It also distinguishes documented parameters from attributes that still require device-specific review, helping engineers identify whether the XC3S5000-4FG676I fits a legacy design before committing to sourcing or board rework.
Drop-in alternatives for XC3S5000-4FG676I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC3S5000-4FG676I (same form factor and footprint) — differing in Device Type, Logic Cells, Package, System Gates.
XC3S5000-4FGG676I
✅ Drop-In📋 Reference alternative (not in catalog)
XC3S5000-4FG676I Maximum Ratings & Electrical Characteristics
| Device Type | Spartan-3 Field Programmable Gate Array (FPGA) |
| System Gates | 5 million gates |
| Logic Cells | 74,880 cells |
| Maximum Clock Frequency | 630 MHz |
| User I/O | 489 I/O |
| Fabrication Technology | 90 nm |
| Core Supply Voltage | 1.2 V |
| Operating Supply Voltage Range | 1.14 V to 1.26 V |
| Junction Temperature Range | -40°C to +100°C |
| Package | 676-pin FBGA, 27 mm × 27 mm |
| Device Family | Spartan-3 |
| Performance Grade | -4 |
| Temperature Grade | Industrial |
| Mounting Type | Surface mount |
XC3S5000-4FG676I 676-pin fbga, 27 mm × 27 mm Pin Configuration Guide
Pin configuration for XC3S5000-4FG676I (676-pin fbga, 27 mm × 27 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC3S5000-4FG676I.
Refer to the datasheet for full pin configuration.
Typical Applications
XC3S5000-4FG676I is suitable for 6 applications: Industrial Control and Automation, Telecommunications Interface Logic, Data Acquisition and Signal Processing, High-Speed Storage and Memory Controller, Test and Measurement Equipment, Embedded Video and Image Processing.
Industrial Control and Automation
The XC3S5000-4FG676I fits industrial controllers that combine sequencing, communications, signal conditioning, and real-time decision logic. Its 74,880 logic cells provide substantial parallel-processing capacity, while up to 489 I/O connect sensors, actuators, counters, and field-bus transceivers. The 630 MHz maximum clock supports pipelined control paths, and the industrial junction-temperature range of -40°C to +100°C supports equipment deployed in temperature-controlled industrial enclosures. Design the I/O banks around field-side voltage requirements, isolate external interfaces, and validate timing for the worst-case control latency.
Recommended
Telecommunications Interface Logic
The XC3S5000-4FG676I is suitable for telecommunications equipment requiring parallel packet processing, channel-control logic, and multiple board-level interfaces. Its high-density logic fabric can implement protocol engines, buffers, schedulers, and test paths, while 489 I/O accommodate memory, backplane transceivers, and status signals. The 630 MHz clock rating supports high-rate synchronous processing, but the design must establish deterministic clock domains and confirm that every external interface uses a supported I/O standard. Careful bank planning is essential for mixed legacy and modern voltage domains.
Recommended
Data Acquisition and Signal Processing
The XC3S5000-4FG676I can implement parallel data acquisition, digital filtering, correlation, demodulation, and sensor-fusion pipelines. Its 74,880 logic cells provide enough parallel resources for multichannel sampling systems, while 489 I/O simplify connections to ADCs, DACs, transducers, and memory. At a maximum clock of 630 MHz, the device can process samples through pipelined stages, provided the design accounts for converter latency, clock jitter, and data-valid timing. Use synchronous interfaces where possible and verify every input threshold and output timing specification against the selected converter.
Recommended
High-Speed Storage and Memory Controller
The XC3S5000-4FG676I fits legacy storage controllers, memory interfaces, test systems, and accelerator logic requiring both high gate density and abundant I/O. The 5 million system gates can support protocol state machines, timing generators, error handling, and buffer-management logic, while the 489 I/O provide connections to synchronous memory and parallel buses. The 630 MHz maximum clock enables demanding synchronous operation, but memory timing must be constrained and verified through static timing analysis. PCB routing must minimize skew on clock and data nets and follow the BGA escape requirements.
Recommended
Test and Measurement Equipment
The XC3S5000-4FG676I can serve as the digital control fabric in automated test equipment, waveform generators, protocol analyzers, and instrumentation front ends. Its large logic capacity supports sequencing engines, pattern generation, acquisition control, and real-time analysis, while the high I/O count connects test fixtures, memory, converters, and communication ports. The -4 grade's 630 MHz ceiling allows synchronous test pipelines to operate rapidly, provided clock uncertainty and output timing are budgeted. Separate sensitive analog and digital ground returns and use controlled impedance routing for high-speed test signals.
Recommended
Embedded Video and Image Processing
The XC3S5000-4FG676I can support legacy embedded imaging systems, pixel pipelines, frame timing, and display-interface control. Its 74,880 logic cells are suitable for parallel image filtering, color conversion, deinterlacing, and synchronization logic, while 489 I/O permit connection to video sensors, frame-buffer memory, and display controllers. The 630 MHz clock supports pipelined pixel processing when one pixel or small word is processed per cycle. Video timing, blanking intervals, clock-domain crossings, and memory bandwidth must be analyzed to prevent frame errors under worst-case conditions.
Recommended
Recommended Products Summary
Engineering reference data for XC3S5000-4FG676I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3S5000-4FGG676I |
|---|---|---|
| Package | 676-BGA | 676-BGA |
| Brand | Xilinx | Xilinx |
| Device Family | Spartan-3 | Spartan-3 |
| System Gates | 5 million gates | 5 million gates |
| Logic Cells | 74,880 cells | 74,880 cells |
| User I/O | 489 I/O | 489 I/O |
Key Differentiators
- High-density Spartan-3 resource combination (vs XC3S5000-4FGG676I)
- Documented industrial temperature identity (vs XC3S5000-4FGG676I)
- Direct legacy-board identification (vs XC3S5000-4FGG676I)
Design Notes
Treat the 676-ball FBGA as a high-pin-count escape and power-delivery problem. Follow the AMD/Xilinx package recommendations for ball pitch, via-in-pad or via geometry, plane transitions, and solder-mask conditions. Place the configuration pins and their pull-up or pull-down network exactly as specified, then route clocks and sensitive inputs away from high-current switching nodes. Do not release the layout until every power, ground, configuration, and user-I/O ball has been checked against the official package drawing.
Design the supply network around the device's 1.14 V to 1.26 V core-voltage range rather than only the nominal 1.2 V value. Verify the applicable I/O-bank voltages separately because the core rail and user rails can have different limits. Use the manufacturer power-decoupling and switching recommendations to determine capacitor placement and rail sequencing. Validate droop during startup and full I/O activity; 489 user outputs can create fast simultaneous current changes even when average core current appears modest.
Do not treat equal gate counts as proof of interchangeability. Before replacing XC3S5000-4FG676I with XC3S5000-4FGG676I, compare the complete DS099 ball table, package dimensions, configuration behavior, electrical limits, supported I/O standards, and temperature grade. Generate a pin-level difference report and recompile the design for the candidate. Existing bitstreams must never be assumed to configure a differently suffixed device without manufacturer confirmation.
Use the -4 device's 630 MHz maximum clock only as a device-level ceiling; the achievable board-level frequency depends on the selected clocking resource, I/O standard, routing distance, load, and timing constraints. Constrain all clocks, create asynchronous crossing structures for unrelated domains, and reserve memory and serial interfaces. Post-route timing analysis under the highest intended I/O activity is necessary because BGA escape routing and power-supply noise can consume timing margin.
Compliance Information
The industrial temperature designation is not an automotive qualification. RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not identified and remain unknown.
