A3PE3000-2FG484 vs A3PE3000-FG484 Karşılaştırma

Ayrıntılı yan yana karşılaştırma A3PE3000-2FG484 tarafından Microchip Technology ve A3PE3000-FG484 tarafından Microchip TechnologyAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

Microchip Technology
A3PE3000-2FG484 A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip

A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip

A3PE3000-2FG484 ✓ Aktif
Microchip Technology
A3PE3000-FG484 A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip

A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip

A3PE3000-FG484 ✓ Aktif

Özellik Karşılaştırması

Parametre A3PE3000-2FG484 A3PE3000-FG484
Marka Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Yaşam Döngüsü Durumu Aktif Aktif
Family ProASIC3E Flash FPGAs ProASIC3E Flash FPGA
System Gates 3,000,000 3000000
Logic Cells (DFF-equivalent) 75,264 —
VersaTiles 75,264 —
User I/O 341 341
Embedded SRAM 516,096 bits —
Core Voltage 1.5 V 1.5 V
Technology 130 nm CMOS flash process —
Maximum System Performance 310 MHz —
Speed Grade -2 —
Configuration Non-volatile Flash (single-chip, instant-on) —
Soft ARM Support Yes (optional Cortex-M1 soft core) —
Paket 484-ball FBGA (FG484) 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height
Montaj Türü Surface Mount Surface Mount
Operating Temperature (commercial) 0C to +85C —
RoHS Durumu Non-G suffix (standard package); G-suffix variants are RoHS-compliant G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info)
I/O Standards Voltage-referenced I/O supported (VREF per minibank) —
Logic Cells (DFEs) — 75264
System Frequency — 231 MHz
Process Technology — 130 nm flash CMOS
Configuration Memory — On-chip flash (non-volatile, single-chip)
Soft CPU Support — Optional soft ARM support
Differential I/O Standards — LVDS, LVPECL
Footprint Compatibility — FG256 and FG484 footprint-compatible
Packaging — Tray
İşletim Sıcaklığı — [DATA_NEEDED: operating temperature range]
Embedded Memory — [DATA_NEEDED: embedded block RAM capacity]

Dökümanlar & Kaynaklar

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