EPM7128AET1100-7 vs EPM7128AETC100-10N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EPM7128AET1100-7 tarafından Intel ve EPM7128AETC100-10N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Intel
EPM7128AETC100-10N - MAX 7000AE 128-Macrocell CPLD | Intel | TQFP-100
EPM7128AETC100-10N ObsoleteÖzellik Karşılaştırması
| Parametre | EPM7128AET1100-7 | EPM7128AETC100-10N |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Son Alış Zamanı | Obsolete |
| Family | MAX 7000A (MAX 7000AE) | MAX 7000AE |
| Device Type | CPLD (Complex Programmable Logic Device) | CPLD (Complex Programmable Logic Device) |
| Macrocells | 128 | 128 |
| Usable Gates | 2,500 | 2500 |
| User I/O Pins | 84 | — |
| Logic Elements / LABs | [DATA_NEEDED: LAB count for 7128A] | — |
| Speed Grade | -7 (5 ns pin-to-pin) | -10 |
| Supply Voltage VCC | 5.0 V (typical) | — |
| I/O Voltage Tolerance | 3.3 V / 5.0 V | — |
| İşletim Sıcaklığı | -40C to +85C (industrial) | 0C to +70C (commercial) |
| Paket | TQFP-100 | TQFP-100 |
| Configuration Memory | EEPROM (non-volatile, instant-on) | — |
| Programming Interface | IEEE 1149.1 JTAG / ByteBlaster | — |
| Montaj Türü | Surface Mount | Surface Mount |
| MSL Seviyesi | 3 (168 hours, per JEDEC J-STD-020) | — |
| RoHS Durumu | ROHS3 Compliant | — |
| Lead-Free | Yes | — |
| Process Technology | CMOS, EEPROM-based | CMOS EEPROM |
| Series | — | EPM7128AE |
| Logic Array Blocks | — | 16 |
| User I/Os | — | 84 |
| Supply Voltage (Core) | — | 3.3 V |
| I/O Tolerance | — | 5.0 V tolerant |
| Pin-to-Pin Delay (tPD) | — | 10 ns |
| Maximum Frequency | — | [DATA_NEEDED: maximum toggle frequency] |
| Programming | — | JTAG (IEEE 1149.1) ISP / EEPROM |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Architecture | — | Multiple Array MatriX (MAX) - 2nd generation |
| PCI Compliance | — | Yes (33 MHz, -10 grade per PCI SIG 2.2) |