K3KL8L80DM-JGCT vs K3KL7L70EM-MGCU Karşılaştırma
Ayrıntılı yan yana karşılaştırma K3KL8L80DM-JGCT tarafından Samsung Electronics ve K3KL7L70EM-MGCU tarafından Samsung ElectronicsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Samsung Electronics
K3KL7L70EM-MGCU - 12Gb LPDDR5X DRAM, 315-Ball FBGA | Samsung
K3KL7L70EM-MGCU ✓ AktifÖzellik Karşılaştırması
| Parametre | K3KL8L80DM-JGCT | K3KL7L70EM-MGCU |
|---|---|---|
| Marka | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Manufacturer | Samsung Electronics | Samsung Electronics |
| Product Type | LPDDR5X SDRAM | — |
| Density | 32 Gbit (4 GB) | 12 Gbit (1.5 GB) |
| Organizasyon | x32 | [DATA_NEEDED: organization x32] |
| Paket | FBGA-315 (315-ball BGA) | 315-ball FBGA |
| Veri Hızı | Up to 7500 Mbps (family up to 8.5 Gbps) | [DATA_NEEDED: data rate Mbps/pin] |
| Arayüz | LPDDR5X (JEDEC LPDDR5-compatible, low-power SDRAM) | — |
| Supply Rails | 500 mV / 900 mV / 1.05 V / 1.8 V | — |
| İşletim Sıcaklığı | -25C to +85C | [DATA_NEEDED: operating temperature range] |
| Power Efficiency | ~20-25% improvement vs LPDDR5 (family figure) | — |
| Montaj Türü | Surface Mount (BGA) | Surface Mount |
| Application Domains | Mobile, PC, automotive, on-device AI | — |
| RoHS Durumu | Compliant | [DATA_NEEDED: RoHS status] |
| VDD2/VDDQ Class | [DATA_NEEDED: exact VDD2 and VDDQ rail values for -JGCT speed grade] | — |
| Speed Grade Suffix Detail | [DATA_NEEDED: official Samsung ordering-code decode for JGCT suffix] | — |
| Package Dimensions | [DATA_NEEDED: package body dimensions in mm] | — |
| MSL Seviyesi | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: moisture sensitivity level] |
| Bellek Türü | — | LPDDR5X SDRAM |
| Speed Grade Suffix | — | -MGCU |
| Supply Voltage VDD | — | [DATA_NEEDED: VDD core voltage] |
| Supply Voltage VDDQ | — | [DATA_NEEDED: VDDQ I/O voltage] |
| Bank Architecture | — | [DATA_NEEDED: bank group count] |
| CAS Gecikme | — | [DATA_NEEDED: CAS latency] |
| Refresh | — | Self-refresh and per-bank refresh per JEDEC LPDDR5X |
| Termination | — | On-Die Termination (ODT) |