M1AFS250-2FGG256I vs M1AFS250-1FGG256I Karşılaştırma

Ayrıntılı yan yana karşılaştırma M1AFS250-2FGG256I tarafından Microchip Technology ve M1AFS250-1FGG256I tarafından Microchip TechnologyAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

Microchip Technology
M1AFS250-2FGG256I M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip

M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip

M1AFS250-2FGG256I ✓ Aktif
Microchip Technology
M1AFS250-1FGG256I M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I ✓ Aktif

Özellik Karşılaştırması

Parametre M1AFS250-2FGG256I M1AFS250-1FGG256I
Marka Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Yaşam Döngüsü Durumu Aktif Aktif
Family Actel Fusion (Mixed-Signal FPGA) —
System Gates 250000 gates 250,000 gates
Registers (DFFs) 36864 —
User I/Os 114 —
Embedded Processor ARM Cortex-M1 —
Configuration Technology Flash-based, nonvolatile —
Process Technology 130 nm, 7-layer metal CMOS —
System Performance Up to 350 MHz —
Speed Grade -2 —
Core Supply Voltage 1.5 V —
Paket 256-ball FBGA (FGG256) —
Montaj Türü Surface Mount —
İşletim Sıcaklığı -40C to +85C (industrial, I grade) —
Security 128-bit Flash lock, AES decryption 128-bit flash-based lock, AES decryption
Power-Up Behavior Live at Power-Up (LAPU) —
RoHS Durumu Compliant (FGG = Pb-free balls) [DATA_NEEDED: RoHS status]
Moisture Sensitivity Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Series — M1AFS250 (Fusion)
Logic Cells — 6144
Total SRAM/Flip-Flop Bits (DigiKey listing) — 36864
Number of I/O — 114
Maximum System Frequency — 350 MHz
Processor Core — ARM Cortex-M1 (optional ARM support, M1 variant)
Technology — 130-nm, 7-layer metal, flash-based CMOS
Configuration Memory — Nonvolatile flash (Live at Power-Up, LAPU)
İşletim Besleme Gerilimi — 1.5 V
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Paket / Kas — 256-LBGA (FBGA), 1.00 mm ball pitch
Montaj Stili — SMD/SMT
Packaging — Tray
Mixed-Signal Features — Configurable analog, flash memory blocks, clock generation and management

Dökümanlar & Kaynaklar

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