MC9S12DP512MPVE vs MC9S12DP512CPV Karşılaştırma
Ayrıntılı yan yana karşılaştırma MC9S12DP512MPVE tarafından NXP Semiconductors ve MC9S12DP512CPV tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MC9S12DP512CPV - 16-Bit HCS12 MCU, 512KB Flash, 112-LQFP | NXP
MC9S12DP512CPV ✓ AktifÖzellik Karşılaştırması
| Parametre | MC9S12DP512MPVE | MC9S12DP512CPV |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Core Processor | HCS12 (CPU12), 16-bit CISC | — |
| Core Size | 16-bit | — |
| Azami Saat Hızı | 25 MHz | — |
| Program Memory Size | 512 KB (512K x 8) Flash | — |
| RAM Size | 12 KB | 12 KB (12K x 8) |
| EEPROM Size | 4 KB | — |
| Number of I/O | 91 general-purpose I/O | — |
| ADC Resolution | 10-bit | — |
| Number of ADC Channels | 16 (two 8-channel 10-bit ADCs) | — |
| Serial Interfaces | 2x SCI (asynchronous serial), IIC, SPI | — |
| Timers | 8-channel enhanced capture timer (IC/OC) | — |
| PWM Channels | 8-channel pulse-width modulator | 8 |
| Paket | 112-LQFP (20x20 mm) | — |
| Montaj Türü | Surface Mount | Surface Mount |
| Program Memory Type | FLASH (0.25 um) | — |
| İşletim Sıcaklığı | [DATA_NEEDED: operating temperature range] | -40 C to +85 C (industrial) |
| Besleme Gerilimi | [DATA_NEEDED: supply voltage range] | 5.0 V (4.5 V to 5.5 V) |
| Yaşam Döngüsü Durumu | Active | — |
| Core | — | HCS12 (16-bit) |
| Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 512 KB (512K x 8) |
| EEPROM | — | 4 KB |
| Number of I/O Lines | — | 91 |
| Paket / Kas | — | 112-LQFP (20 x 20 mm) |
| ADC | — | 2 x 8-channel, 10-bit |
| Enhanced Capture Timer | — | 8-channel 16-bit ECT |
| SCI (UART) | — | 2 |
| SPI | — | 1 |
| I2C | — | 1 |
| CAN | — | 1 x CAN 2.0 |
| Oscillator | — | Internal PLL with external crystal |
| Debug Interface | — | BDM (Background Debug Mode) |
| Process Technology | — | 0.25 um Flash |
| RoHS Durumu | — | Compliant (lead-free) |