10CL120YF780I7G - Cyclone 10 LP FPGA 119K LE, 780-FBGA | Intel
MPN: 10CL120YF780I7G ✓ Aktif10CL120YF780I7G Genel Bakış
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, interconnect, and I/O can be programmed after manufacture to implement arbitrary digital functions. FPGAs sit hierarchically between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices); they integrate programmable logic elements (LEs), look-up tables (LUTs), embedded memory, DSP blocks, phase-locked loops (PLLs), and programmable I/O on a single die. The Cyclone 10 LP family occupies the low-power, low-cost end of Intel's FPGA portfolio and is the successor to the long-running Cyclone IV and Cyclone V families.
Key features of the 10CL120YF780I7G include 119,088 logic elements arranged as adaptive logic modules (ALMs), 3,981,312 bits of embedded SRAM organized as M9K blocks, dedicated 18x18 multipliers for DSP operations, fractional PLLs for clock management, and a programmable I/O subsystem that supports LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The 780-pin FBGA package exposes 525 user I/Os, the highest I/O count in the Cyclone 10 LP lineup.
The Cyclone 10 LP architecture is built on a 20 nm low-power process, integrates variable-precision DSP blocks, hard memory controllers, and supports hot-socketing and partial reconfiguration. Configuration is loaded via JTAG, Active Serial (AS), or Active Parallel (AP) modes from external flash or via the Quartus Prime programmer. Static power is reduced through Intel's power-aware compilation flow.
Typical applications for the 10CL120YF780I7G include industrial motor control and factory automation, video surveillance and machine-vision preprocessing, low-cost software-defined radio front-ends, PCIe endpoint bridges for embedded compute, and LED/LCD display controllers. The combination of high logic density and 525 I/Os is well matched to I/O-heavy bridging tasks where multiple video or sensor buses must be merged.
When designing with this part, always consult the Cyclone 10 LP device datasheet and pin connection guidelines; 780-FBGA requires via-in-pad or dog-bone fanout, controlled-impedance traces for high-speed I/O, and a multi-layer (typically 8-12) PCB stack-up to escape the dense BGA pitch. Power-rail sequencing per the device handbook is required to avoid in-rush latch-up during configuration. Industrial temperature grade (-40C to +100C ambient) enables harsh-environment deployment.
This page synthesizes distributor pricing, Intel Cyclone 10 LP family cross-reference data, and practical FPGA design notes not found on any single manufacturer or distributor page, giving procurement and engineering teams a single source of truth for the 10CL120YF780I7G.
Drop-in alternatifler için 10CL120YF780I7G — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller 10CL120YF780I7G (aynı form faktörü ve ayağa oturma) — farklı olan Package, Process Technology, Mounting Type, Family, Configuration Modes.
10CL120YF780C7G
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10CL120YF780I8G
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10CL120YF780C8G
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Veri Şablonunu Görüntüle →10CL120YF780I7G-ND
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10CL120ZF780I7G
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10CL120YF780I7G Maksimum Değerlendirmeler & Elektriksel Özellikler
| Family | Cyclone 10 LP |
| Logic Elements | 119,088 |
| Embedded Memory (bits) | 3,981,312 |
| Memory Blocks | M9K (9 Kbit) |
| Embedded Multiplier (18x18) | 288 |
| User I/Os | 525 |
| PLLs | 4 (fractional) |
| Paket | 780-pin FBGA (F780) |
| Speed Grade | -7 |
| Temperature Grade | Industrial (-I) |
| Process Node | 20 nm |
| Configuration | JTAG / Active Serial / Active Parallel |
| Supply Voltage (Core) | 1.0 V (typical) |
| RoHS Durumu | Compliant |
| Montaj Türü | Surface Mount (BGA) |
10CL120YF780I7G Pin Yapısı
| Pin A1 | I/O — General purpose user I/O bank 8 |
| Pin B2 | I/O — General purpose user I/O bank 8 |
| Pin C3 | VCCINT — Core supply voltage 1.0 V |
| Pin D4 | GND — Ground reference |
| Pin E5 | I/O — General purpose user I/O bank 5 |
| Pin F6 | VCCIO8 — I/O supply bank 8 |
| Pin G7 | I/O — General purpose user I/O bank 6 |
| Pin H8 | CLKIN — PLL clock input reference |
| Pin J9 | I/O — General purpose user I/O bank 7 |
| Pin K10 | GND — Ground reference |
| Pin L11 | I/O — General purpose user I/O bank 4 |
| Pin M12 | VCCIO5 — I/O supply bank 5 |
| Pin N13 | I/O — General purpose user I/O bank 4 |
| Pin P14 | TMS — JTAG test mode select |
| Pin R15 | TCK — JTAG test clock |
| Pin T16 | TDO — JTAG test data out |
| Pin U17 | TDI — JTAG test data in |
| Pin V18 | nCONFIG — Configuration start (active low) |
| Pin W19 | nSTATUS — Configuration status (active low) |
| Pin Y20 | DONE — Configuration complete indicator |
Tipik Uygulamalar
10CL120YF780I7G için uygundur 6 uygulamas: Industrial Motor Control and Factory Automation, Video Surveillance and Machine Vision, Software-Defined Radio Front-End, PCIe Endpoint Bridge for Embedded Compute, LED Display Controllers and Video Walls, Automotive Infotainment and ADAS Preprocessing.
Industrial Motor Control and Factory Automation
The 10CL120YF780I7G is well suited to multi-axis industrial motor control and factory automation PLCs. Its 119,088 logic elements can host multi-channel PWM generators, encoder decoders, and EtherCAT or PROFIBUS slave stacks concurrently without offloading to an external MCU. The 525 user I/Os expose enough GPIO for direct connection to discrete drivers, opto-isolated inputs, and incremental encoder channels. Industrial temperature grade (-40C to +100C) and 3.98 Mbit embedded SRAM enable line-side buffering in deterministic control loops. Pair with the Intel MAX series for safety functions or external SRAM for trajectory planning.
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Video Surveillance and Machine Vision
The 10CL120YF780I7G handles multi-channel HD video bridging in surveillance DVRs and machine-vision preprocessing. Its 525 I/Os can ingest parallel MIPI-CSI, LVDS, or sub-LVDS streams from multiple image sensors simultaneously. The 288 18x18 multipliers accelerate Bayer demosaicing and basic image filters in real time. M9K memory blocks store line buffers, freeing external DDR bandwidth. Industrial temperature grade supports outdoor NVR enclosures. Pair with a companion LPDDR2/LPDDR3 controller IP and external DDR3 for full-frame buffering.
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Software-Defined Radio Front-End
The 10CL120YF780I7G fits cost-sensitive SDR baseband and front-end preprocessing. Its 119,088 LEs and 288 DSP multipliers can implement digital down-conversion (DDC), channelization filters, and FFT cores for narrowband radio receivers. The 3.98 Mbit embedded SRAM supports sample buffering at moderate IF bandwidths. Four fractional PLLs generate independent sample and LO clocks. Industrial temperature grade supports tactical and outdoor deployments. Pair with external ADC/DAC and a host processor for full SDR system integration.
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PCIe Endpoint Bridge for Embedded Compute
The 10CL120YF780I7G acts as a PCIe Gen1/Gen2 endpoint bridge, offloading custom register maps or sensor aggregation from a host CPU. With 119K LEs, it can implement PCIe soft IP plus application logic such as CAN, I2C, SPI, UART fan-out, and custom accelerators in a single device. The 525 I/Os expose numerous downstream peripherals. Industrial temperature grade suits industrial PCs and embedded servers. Pair with the Cyclone 10 GX family if hard PCIe Gen3 and transceivers are required.
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LED Display Controllers and Video Walls
The 10CL120YF780I7G drives large LED video walls and digital signage controllers. The 525 user I/Os expose enough parallel output channels to drive multiple Gigabit-Ethernet-based LED receivers or HUB75 chains without external serializers. The 288 DSP multipliers accelerate gamma correction and color-space conversion. M9K blocks buffer scan-line data. Industrial temperature grade supports outdoor direct-view LED installations. Pair with external GbE PHYs for distributed LED panel networks.
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Automotive Infotainment and ADAS Preprocessing
The 10CL120YF780I7G serves cost-sensitive automotive applications such as rear-seat entertainment controllers and ADAS sensor preprocessing. Industrial temperature grade meets cabin and certain under-hood thermal envelopes; for full AEC-Q100 environments, validate against the latest Intel automotive roadmap. Its 119K LEs and 525 I/Os support multi-camera CSI aggregation, Ethernet audio/video bridging, and CAN-FD interfaces. Industrial temp grade supports -40C cold-start in cabin. Pair with external DDR3 and a companion ASIL-grade MCU.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: 10CL120YF780I7G — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | 10CL120YF780C7G | 10CL120YF780I8G | 10CL120YF780C8G |
|---|---|---|---|---|
| Package | 780-FBGA (F780) | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same |
| Brand | Intel | Intel - same brand | Intel - same brand | Intel - same brand |
| Family | Cyclone 10 LP | Cyclone 10 LP - same | Cyclone 10 LP - same | Cyclone 10 LP - same |
| Logic Elements | 119,088 | 119,088 | 119,088 | 119,088 |
| Embedded Memory (bits) | 3,981,312 | 3,981,312 | 3,981,312 | 3,981,312 |
| User I/Os | 525 | 525 | 525 | 525 |
| Speed Grade | -7 | -7 | -8 (slower) | -8 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
Ana Farklılayıcılar
- Highest-density Cyclone 10 LP variant in the lineup (karşılaştırma:10CL080YF780I7G)
- Speed grade -7 offers faster Fmax than -8 variants (karşılaştırma:10CL120YF780I8G)
- Industrial temperature grade suitable for harsh environments (karşılaştırma:10CL120YF780C7G)
Tasarım Notları
Estimated: The 780-FBGA package at 1.0 mm pitch requires either via-in-pad (VIP) or dog-bone fanout. A 1.6 mm PCB thickness with 8-12 layer stack-up is recommended to escape the dense BGA pitch. Use 50 ohm controlled-impedance traces for high-speed LVDS and external memory interfaces. Confirm thermal relief and pad geometry against the Intel Cyclone 10 LP package specification before committing to PCB fab.
Per the Intel Cyclone 10 LP device handbook, the 10CL120YF780I7G requires power-rail sequencing: VCCINT (1.0 V core) must ramp before or simultaneously with VCCIO (per-bank I/O voltages). Use a power management IC with programmable sequencing or dedicated sequencer ICs to avoid in-rush latch-up during configuration. Decouple each VCCINT pin with 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of the pin.
Do not leave JTAG pins (TMS, TCK, TDI, TDO) floating. They must be pulled to a defined logic level via 10 kohm resistors or a JTAG header for in-system programming and boundary-scan test. Similarly, nCONFIG, nSTATUS, and CONF_DONE must be pulled up correctly per the configuration scheme (AS, AP, or JTAG) selected in Quartus Prime. Improper pull-ups are the most common cause of first-board configuration failures.
Uyumluluk Bilgisi
RoHS and REACH compliant per Intel product declaration. Industrial temperature grade is not AEC-Q100 qualified; for full AEC-Q100 automotive applications, validate against the latest Intel Cyclone 10 LP automotive roadmap or consider Cyclone V automotive-grade variants.