APA300-FGG144 - 300K-Gate Flash FPGA | Microchip
MPN: APA300-FGG144 ✓ AktifAPA300-FGG144 Genel Bakış
An FPGA is a semiconductor device whose digital logic, interconnect, and I/O functions are configured after fabrication. Within the programmable-logic hierarchy, the APA300 belongs to the ProASICPLUS family of Flash FPGAs and the broader field-programmable logic and semiconductor categories. Flash configuration stores the programmed logic state in the device itself, eliminating a separate configuration PROM while allowing the design to be reprogrammed during development, production, or field updates.
The APA300-FGG144 combines 300,000 system gates with 8,192 logic cells and 100 user I/O. The listed 180 MHz performance makes the device suitable for control logic, embedded processing peripherals, communications interfaces, and general-purpose digital logic consolidation. Its 2.5 V and 3.3 V supply options support conventional mixed-signal system environments, while its 144-LBGA package provides substantially more connection density than a leaded or small-outline package.
The ProASICPLUS architecture provides configurable logic blocks, programmable interconnect resources, dedicated I/O, and Flash-based configuration memory. This combination allows one physical FPGA design to support multiple logic configurations without relying on an external configuration memory device. Programming can be performed during manufacturing or after deployment when the system includes an appropriate programming interface, although the complete programming workflow remains implementation-specific.
Typical uses include industrial control and factory automation, communications equipment, instrumentation, embedded avionics subsystems, and compact control platforms requiring nonvolatile FPGA configuration. The 100-I/O count is particularly useful for parallel buses, status and control signals, memory interfaces, and multi-channel digital acquisition systems. Applications requiring more logic density, dedicated hardware multipliers, higher I/O count, or a larger package should be compared against other ProASICPLUS devices before the design is released.
PCB implementation must account for the 1 mm ball pitch and the 144-LBGA land pattern specified by the package documentation. Power and ground distribution should provide low-impedance paths for both 2.5 V and 3.3 V supply requirements. Signal-integrity and power-integrity reviews should be based on the actual edge rates, I/O standards, external memory interfaces, and board stack-up rather than on device clock frequency alone.
This product page combines the manufacturer device description, package information, ordering variants, and practical selection guidance to support schematic capture, PCB layout, sourcing, and drop-in replacement assessment. It also distinguishes the standard APA300-FGG144 from temperature-qualified APA300-FGG144I and APA300-FGG144A variants while keeping package and logic-resource differences explicit.
Drop-in alternatifler için APA300-FGG144 — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller APA300-FGG144 (aynı form faktörü ve ayağa oturma) — farklı olan Package, System Gates, AEC-Q100 Qualification, Configuration Memory, Device Type.
APA300-FGG144I
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
APA300-FGG144A
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
APA300-FG144
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →APA300-FG144I
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →APA300-FG144M
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
APA300-FGG144 Maksimum Değerlendirmeler & Elektriksel Özellikler
| Device Type | ProASICPLUS Flash FPGA |
| System Gates | 300,000 gates |
| Logic Cells | 8,192 cells |
| Maximum Frequency | 180 MHz |
| User I/O | 100 I/O |
| Configuration Memory | Flash nonvolatile memory |
| Process Technology | 0.22 µm CMOS |
| Besleme Gerilimi | 2.5 V or 3.3 V |
| Paket | 144-LBGA (FGG144) |
| Package Body Size | 13 mm × 13 mm |
| Ball Pitch | 1 mm |
| Block RAM | 72 Kb |
| Montaj Türü | Surface mount |
| RoHS Durumu | Compliant |
| AEC-Q100 Qualification | Not qualified for APA300-FGG144 |
APA300-FGG144 13 mm × 13 mm Pin Yapısı Kılavuzu
APA300-FGG144 (13 mm × 13 mm paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: APA300-FGG144.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
APA300-FGG144 için uygundur 6 uygulamas: Industrial Control and Factory Automation, Communications Interface Consolidation, Data Acquisition and Instrumentation, Avionics and Mission Subsystems, Embedded Security and Access Control, Smart Sensor and IoT Edge Control.
Industrial Control and Factory Automation
The APA300-FGG144 fits centralized machine-control logic where a single programmable device must consolidate sequencing, state management, diagnostics, and communication interfaces. Its 300,000 system gates and 8,192 logic cells provide substantial capacity for finite-state machines, counters, interlocks, and protocol handling, while 100 I/O support parallel sensor, actuator, and bus connections. Flash-based configuration keeps the programmed design nonvolatile without requiring a separate configuration PROM. In factory equipment, the 144-LBGA package reduces board area compared with a leaded package, but the 1 mm ball pitch demands careful fanout, inspection, and assembly planning.
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Communications Interface Consolidation
APA300-FGG144 can consolidate parallel data paths, framing logic, buffering, and supervisory functions in communications equipment. The available 100 I/O are useful for data buses and control interfaces, while the 300,000-system-gate ProASICPLUS resource set can implement protocol state machines and timing functions without multiple programmable-logic devices. Its Flash configuration supports a self-contained nonvolatile design and permits controlled reprogramming during production or maintenance. Designers should determine actual I/O standards and interface timing from the Microchip datasheet, then budget routing and series-resistance features for the board-level signal rates rather than relying on the 180-MHz device performance figure.
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Data Acquisition and Instrumentation
The APA300-FGG144 is appropriate for instrumentation that requires deterministic digital control alongside parallel data capture. Its 8,192 configurable logic cells can implement channel sequencing, trigger logic, sample counters, and data-formatting pipelines, while 100 I/O provide substantial parallel connectivity to converters, memories, and status interfaces. A maximum frequency of 180 MHz supports clocked logic operating below that device-level limit after timing closure. The 144-LBGA package helps achieve compact instrument boards, although its 1 mm pitch requires dense routing and careful separation of sensitive analog inputs from digital switching activity.
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Avionics and Mission Subsystems
APA300-FGG144 can be evaluated for compact avionics or mission subsystems requiring programmable logic with nonvolatile configuration. The 300,000-system-gate architecture is sufficient for bus arbitration, redundant monitoring, sequencing, and supervisory functions, while Flash technology avoids a separate configuration-promotion step. The APA300-FGG144A variant provides the documented automotive temperature option extending to 125°C at the junction and may be more suitable for severe environmental screening than the standard ordering code. Actual qualification for an airborne or military design requires review of the complete device documentation, screening records, reliability requirements, and the applicable certification process.
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Embedded Security and Access Control
The APA300-FGG144 can implement dedicated protocol, credential-processing, and monitoring logic in security-related embedded systems. Its programmable architecture permits a fixed device footprint to support multiple field configurations, while nonvolatile Flash configuration retains the programmed state through power loss. The 100 I/O can accommodate bus activity, card-reader interfaces, status indicators, and supervisory signals, and the 8,192 logic cells can support state machines or parallel cryptographic control paths. Security implementations should add external tamper controls, secure provisioning, and appropriate data-storage protection; the FPGA's reprogrammability alone should not be treated as a complete security boundary.
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Smart Sensor and IoT Edge Control
APA300-FGG144 can serve as deterministic edge-control logic for a sensor hub or IoT gateway that coordinates multiple low-speed sensors and local actuators. Its 300,000 system gates allow filtering, protocol conversion, event counting, and local state-machine functions to be consolidated, while 100 I/O supports parallel sensor and interface connections. Nonvolatile Flash configuration is useful in unattended equipment because the logic configuration survives power removal. For a compact wireless product, the FPGA should be placed alongside the radio and power subsystem without routing high-speed switching nodes through sensitive analog areas. Mechanical assembly and inspection must also account for the 1 mm pitch of the 144-LBGA package.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: APA300-FGG144 — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | APA300-FGG144I | APA300-FGG144A | APA300-FG144 | APA300-FG144I | APA300-FG144M |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
Ana Farklılayıcılar
- Nonvolatile Flash configuration (karşılaştırma:APA300-FG144)
- Documented industrial temperature option (karşılaştırma:APA300-FGG144)
- Documented extended-temperature ordering option (karşılaştırma:APA300-FGG144I)
Tasarım Notları
Create the PCB land pattern from the Microchip FGG144 package drawing rather than from a generic 144-LBGA footprint. The documented package uses a 1 mm ball pitch and a 13 mm by 13 mm body, leaving little routing space between adjacent balls. Review escape routing, component clearance, solder-mask definitions, and assembly access before layout is released.
Partition the 2.5 V and 3.3 V supplies according to the Microchip pin-description table and place local high-frequency bypass capacitors next to their associated supply balls. Route each power plane or net as a low-impedance distribution path and keep high-current return currents close to their corresponding supply connections. Validate the final network against the device's recommended decoupling and operating-current requirements.
Assign I/O standards and edge rates from the actual external interfaces rather than assuming every signal can operate at the device's 180 MHz maximum frequency. Include series termination where the connected receiver, board topology, and timing analysis require it. Maintain return paths beneath high-speed routes, separate sensitive analog inputs from digital activity, and perform post-layout signal-integrity checks on the highest-rate interfaces.
Do not substitute APA300-FGG144, APA300-FGG144I, APA300-FGG144A, APA300-FG144, APA300-FG144I, or APA300-FG144M based only on the 144-ball package description. Check the exact ordering table, pin names, package dimensions, temperature grade, device identification, and qualification requirements. Flash configuration makes programming convenient, but it does not remove the need for programming-tool and power-up-sequence validation.
Uyumluluk Bilgisi
RoHS compliance is stated for the APA300-FGG144 family device. The standard APA300-FGG144 is not identified as an AEC-Q100-qualified automotive option; APA300-FGG144A is the documented automotive-temperature ordering variant. REACH, lead-free, halogen-free, and conflict-minerals status are not stated for the exact target MPN.
