APA300-FGG144 - 300K-Gate Flash FPGA | Microchip
MPN： APA300-FGG144 ✓ 啟用中APA300-FGG144 概覽
An FPGA is a semiconductor device whose digital logic, interconnect, and I/O functions are configured after fabrication. Within the programmable-logic hierarchy, the APA300 belongs to the ProASICPLUS family of Flash FPGAs and the broader field-programmable logic and semiconductor categories. Flash configuration stores the programmed logic state in the device itself, eliminating a separate configuration PROM while allowing the design to be reprogrammed during development, production, or field updates.
The APA300-FGG144 combines 300,000 system gates with 8,192 logic cells and 100 user I/O. The listed 180 MHz performance makes the device suitable for control logic, embedded processing peripherals, communications interfaces, and general-purpose digital logic consolidation. Its 2.5 V and 3.3 V supply options support conventional mixed-signal system environments, while its 144-LBGA package provides substantially more connection density than a leaded or small-outline package.
The ProASICPLUS architecture provides configurable logic blocks, programmable interconnect resources, dedicated I/O, and Flash-based configuration memory. This combination allows one physical FPGA design to support multiple logic configurations without relying on an external configuration memory device. Programming can be performed during manufacturing or after deployment when the system includes an appropriate programming interface, although the complete programming workflow remains implementation-specific.
Typical uses include industrial control and factory automation, communications equipment, instrumentation, embedded avionics subsystems, and compact control platforms requiring nonvolatile FPGA configuration. The 100-I/O count is particularly useful for parallel buses, status and control signals, memory interfaces, and multi-channel digital acquisition systems. Applications requiring more logic density, dedicated hardware multipliers, higher I/O count, or a larger package should be compared against other ProASICPLUS devices before the design is released.
PCB implementation must account for the 1 mm ball pitch and the 144-LBGA land pattern specified by the package documentation. Power and ground distribution should provide low-impedance paths for both 2.5 V and 3.3 V supply requirements. Signal-integrity and power-integrity reviews should be based on the actual edge rates, I/O standards, external memory interfaces, and board stack-up rather than on device clock frequency alone.
This product page combines the manufacturer device description, package information, ordering variants, and practical selection guidance to support schematic capture, PCB layout, sourcing, and drop-in replacement assessment. It also distinguishes the standard APA300-FGG144 from temperature-qualified APA300-FGG144I and APA300-FGG144A variants while keeping package and logic-resource differences explicit.
直接替換替代品，適用於 APA300-FGG144 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： APA300-FGG144 （相同外形與佔位） — 差異在於 Package, System Gates, AEC-Q100 Qualification, Configuration Memory, Device Type.
APA300-FGG144I
✅ 直接替換📋 參考替代品（不在目錄中）
APA300-FGG144A
✅ 直接替換📋 參考替代品（不在目錄中）
APA300-FG144
✅ 直接替換聯絡詢價
查看資料表 →APA300-FG144I
✅ 直接替換聯絡詢價
查看資料表 →APA300-FG144M
✅ 直接替換📋 參考替代品（不在目錄中）
APA300-FGG144 最大額定值與電氣特性
| Device Type | ProASICPLUS Flash FPGA |
| System Gates | 300,000 gates |
| Logic Cells | 8,192 cells |
| Maximum Frequency | 180 MHz |
| User I/O | 100 I/O |
| Configuration Memory | Flash nonvolatile memory |
| Process Technology | 0.22 µm CMOS |
| 供應電壓 | 2.5 V or 3.3 V |
| 封裝 | 144-LBGA (FGG144) |
| Package Body Size | 13 mm × 13 mm |
| Ball Pitch | 1 mm |
| Block RAM | 72 Kb |
| 安裝類型 | Surface mount |
| RoHS 狀態 | Compliant |
| AEC-Q100 Qualification | Not qualified for APA300-FGG144 |
APA300-FGG144 13 mm × 13 mm 腳位配置指南
APA300-FGG144（13 mm × 13 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： APA300-FGG144.
請參閱 資料表 以查看完整腳位配置。
典型應用
APA300-FGG144 適用於 6 應用s: Industrial Control and Factory Automation, Communications Interface Consolidation, Data Acquisition and Instrumentation, Avionics and Mission Subsystems, Embedded Security and Access Control, Smart Sensor and IoT Edge Control.
Industrial Control and Factory Automation
The APA300-FGG144 fits centralized machine-control logic where a single programmable device must consolidate sequencing, state management, diagnostics, and communication interfaces. Its 300,000 system gates and 8,192 logic cells provide substantial capacity for finite-state machines, counters, interlocks, and protocol handling, while 100 I/O support parallel sensor, actuator, and bus connections. Flash-based configuration keeps the programmed design nonvolatile without requiring a separate configuration PROM. In factory equipment, the 144-LBGA package reduces board area compared with a leaded package, but the 1 mm ball pitch demands careful fanout, inspection, and assembly planning.
推薦
Communications Interface Consolidation
APA300-FGG144 can consolidate parallel data paths, framing logic, buffering, and supervisory functions in communications equipment. The available 100 I/O are useful for data buses and control interfaces, while the 300,000-system-gate ProASICPLUS resource set can implement protocol state machines and timing functions without multiple programmable-logic devices. Its Flash configuration supports a self-contained nonvolatile design and permits controlled reprogramming during production or maintenance. Designers should determine actual I/O standards and interface timing from the Microchip datasheet, then budget routing and series-resistance features for the board-level signal rates rather than relying on the 180-MHz device performance figure.
推薦
Data Acquisition and Instrumentation
The APA300-FGG144 is appropriate for instrumentation that requires deterministic digital control alongside parallel data capture. Its 8,192 configurable logic cells can implement channel sequencing, trigger logic, sample counters, and data-formatting pipelines, while 100 I/O provide substantial parallel connectivity to converters, memories, and status interfaces. A maximum frequency of 180 MHz supports clocked logic operating below that device-level limit after timing closure. The 144-LBGA package helps achieve compact instrument boards, although its 1 mm pitch requires dense routing and careful separation of sensitive analog inputs from digital switching activity.
推薦
Avionics and Mission Subsystems
APA300-FGG144 can be evaluated for compact avionics or mission subsystems requiring programmable logic with nonvolatile configuration. The 300,000-system-gate architecture is sufficient for bus arbitration, redundant monitoring, sequencing, and supervisory functions, while Flash technology avoids a separate configuration-promotion step. The APA300-FGG144A variant provides the documented automotive temperature option extending to 125°C at the junction and may be more suitable for severe environmental screening than the standard ordering code. Actual qualification for an airborne or military design requires review of the complete device documentation, screening records, reliability requirements, and the applicable certification process.
推薦
Embedded Security and Access Control
The APA300-FGG144 can implement dedicated protocol, credential-processing, and monitoring logic in security-related embedded systems. Its programmable architecture permits a fixed device footprint to support multiple field configurations, while nonvolatile Flash configuration retains the programmed state through power loss. The 100 I/O can accommodate bus activity, card-reader interfaces, status indicators, and supervisory signals, and the 8,192 logic cells can support state machines or parallel cryptographic control paths. Security implementations should add external tamper controls, secure provisioning, and appropriate data-storage protection; the FPGA's reprogrammability alone should not be treated as a complete security boundary.
推薦
Smart Sensor and IoT Edge Control
APA300-FGG144 can serve as deterministic edge-control logic for a sensor hub or IoT gateway that coordinates multiple low-speed sensors and local actuators. Its 300,000 system gates allow filtering, protocol conversion, event counting, and local state-machine functions to be consolidated, while 100 I/O supports parallel sensor and interface connections. Nonvolatile Flash configuration is useful in unattended equipment because the logic configuration survives power removal. For a compact wireless product, the FPGA should be placed alongside the radio and power subsystem without routing high-speed switching nodes through sensitive analog areas. Mechanical assembly and inspection must also account for the 1 mm pitch of the 144-LBGA package.
推薦
推薦產品摘要
工程參考資料，適用於 APA300-FGG144 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | APA300-FGG144I | APA300-FGG144A | APA300-FG144 | APA300-FG144I | APA300-FG144M |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
主要差異化特點
- Nonvolatile Flash configuration (對比APA300-FG144)
- Documented industrial temperature option (對比APA300-FGG144)
- Documented extended-temperature ordering option (對比APA300-FGG144I)
設計說明
Create the PCB land pattern from the Microchip FGG144 package drawing rather than from a generic 144-LBGA footprint. The documented package uses a 1 mm ball pitch and a 13 mm by 13 mm body, leaving little routing space between adjacent balls. Review escape routing, component clearance, solder-mask definitions, and assembly access before layout is released.
Partition the 2.5 V and 3.3 V supplies according to the Microchip pin-description table and place local high-frequency bypass capacitors next to their associated supply balls. Route each power plane or net as a low-impedance distribution path and keep high-current return currents close to their corresponding supply connections. Validate the final network against the device's recommended decoupling and operating-current requirements.
Assign I/O standards and edge rates from the actual external interfaces rather than assuming every signal can operate at the device's 180 MHz maximum frequency. Include series termination where the connected receiver, board topology, and timing analysis require it. Maintain return paths beneath high-speed routes, separate sensitive analog inputs from digital activity, and perform post-layout signal-integrity checks on the highest-rate interfaces.
Do not substitute APA300-FGG144, APA300-FGG144I, APA300-FGG144A, APA300-FG144, APA300-FG144I, or APA300-FG144M based only on the 144-ball package description. Check the exact ordering table, pin names, package dimensions, temperature grade, device identification, and qualification requirements. Flash configuration makes programming convenient, but it does not remove the need for programming-tool and power-up-sequence validation.
合規資訊
RoHS compliance is stated for the APA300-FGG144 family device. The standard APA300-FGG144 is not identified as an AEC-Q100-qualified automotive option; APA300-FGG144A is the documented automotive-temperature ordering variant. REACH, lead-free, halogen-free, and conflict-minerals status are not stated for the exact target MPN.
