ATSAM3S4AA-MUR - 64MHz Cortex-M3 MCU 256KB Flash | Microchip
MPN: ATSAM3S4AA-MUR ✓ AktifATSAM3S4AA-MUR Genel Bakış
A microcontroller unit (MCU) is a single-chip computer that integrates a processor core, program memory, data memory, and peripherals on one die, sitting at the heart of the embedded-system hierarchy between simple logic devices and full application processors. The SAM3S series is Microchip's (formerly Atmel) medium-range general-purpose MCU family, positioned for designs balancing low power consumption, processing power, and peripheral integration.
Key features include the 64 MHz Cortex-M3 core with a 3-stage pipeline and Thumb-2 instruction set, 256 KB (256K x 8) of zero-wait-state flash, and an operating supply range of 1.62 V to 3.6 V. The device integrates a fast 12-bit ADC, an on-chip 1.8 V LDO regulator (VDDOUT), USB 2.0 full-speed device port on SAM3S A-variant peripherals, and parallel data capture mode on the PIOs that collects data from non-standard sources such as low-cost image sensors, with DMA offloading the CPU.
Technical depth: the SAM3S architecture pairs the Harvard-architecture Cortex-M3 with an on-chip ARC bus, nested vectored interrupt controller, and 12-channel DMA, enabling peripheral-to-memory transfers without CPU intervention. Flash memory is organized to permit simultaneous read-while-write operation for EEPROM emulation. Power management modes include backup, wait, and sleep, supporting battery-operated designs.
Typical applications include industrial sensing and control nodes, consumer appliances, battery-powered portable instruments, USB-connected devices, and image-sensor front ends leveraging the parallel capture mode.
Design consideration: operate within the 1.62 V to 3.6 V supply window and decouple VDDIN with the LDO output VDDOUT per the manufacturer datasheet to preserve ADC accuracy and EMC performance.
This page synthesizes distributor pricing, verified drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatifler için ATSAM3S4AA-MUR — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller ATSAM3S4AA-MUR (aynı form faktörü ve ayağa oturma) — farklı olan Packaging, RoHS Status, Flash Memory, Package, Peripherals.
ATSAM3S4BA-MU
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →ATSAM3S2AA-MU
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →ATSAM3N4AA-MU
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →ATSAM3S2BA-MU
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →ATSAM3S4AA-MUR Maksimum Değerlendirmeler & Elektriksel Özellikler
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Azami Saat Hızı | 64 MHz |
| Flash Memory | 256 KB (256K x 8) |
| Series | SAM3S |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Operating Supply Classes | 1.8 V / 3.3 V |
| Paket | 48-QFN (7x7 mm) Exposed Pad |
| Montaj Türü | Surface Mount |
| Pin Sayısı | 48 |
| Instruction Set | Thumb-2 (RISC) |
| Arayüz | USB, UART, SPI, TWI (I2C) |
| DMA | Yes |
| Data Capture | PIO parallel capture mode (image-sensor compatible) |
| On-chip Regulator | 1.8 V LDO (VDDOUT) |
| Packaging | Tape & Reel (MUR suffix) |
| RoHS Durumu | RoHS Compliant (Green package per Mouser listing) |
ATSAM3S4AA-MUR 48-qfn (7x7 mm) exposed pad Pin Yapısı Kılavuzu
ATSAM3S4AA-MUR (48-qfn (7x7 mm) exposed pad paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: ATSAM3S4AA-MUR.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
ATSAM3S4AA-MUR için uygundur 6 uygulamas: Industrial Sensing and Control Nodes, Battery-Powered Portable Instruments, USB-Connected Devices, Image-Sensor Front Ends, Consumer Appliance Control, Metering and Data Loggers.
Industrial Sensing and Control Nodes
The ATSAM3S4AA-MUR fits industrial sensing and control nodes because its 64 MHz Cortex-M3 core delivers deterministic interrupt handling via the nested vectored interrupt controller, its 12-bit ADC digitizes analog transducer signals natively, and the 12-channel DMA moves samples to SRAM without CPU load. Operating from 1.62 V to 3.6 V, it accepts 3.3 V industrial rails directly, while the 256 KB flash accommodates protocol stacks and data logging. In a typical node, UART or TWI links to a supervisor and SPI connects external memory; the QFN-48 exposed-pad package provides good thermal and ground performance on standard two-layer control boards.
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Battery-Powered Portable Instruments
For battery-powered portable instruments, the ATSAM3S4AA-MUR's 1.62 V to 3.6 V supply range allows direct operation from two alkaline cells or a single lithium cell with a small LDO, and the SAM3S power-management modes (sleep, wait, backup) cut average current in duty-cycled measurements. The 64 MHz Cortex-M3 executes signal-processing bursts quickly and returns to low-power states, and the on-chip 1.8 V LDO (VDDOUT) removes an external core regulator, saving board area. The 256 KB flash supports instrument firmware plus calibration tables, and Tape & Reel packing suits volume production of handheld meters, dataloggers, and portable medical accessories.
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USB-Connected Devices
The ATSAM3S4AA-MUR suits USB-connected devices because the SAM3S A-variant integrates a USB 2.0 full-speed device peripheral, enabling direct attachment to hosts for data upload, configuration, or firmware updates. The 64 MHz Cortex-M3 sustains USB throughput alongside application code, and the 256 KB flash holds both the application and bootloader. DMA channels service the USB endpoint FIFOs, minimizing CPU overhead and jitter. Typical products include USB dongles, programming adapters, and instrument front panels powered entirely from the 5 V VBUS rail through an on-board 3.3 V regulator within the MCU's 1.62 V to 3.6 V input window.
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Image-Sensor Front Ends
The ATSAM3S4AA-MUR is explicitly suited to image-sensor front ends: per Microchip, the parallel data capture mode on the PIOs collects data from external devices not compliant with standard memory read protocols, such as low-cost image sensors, while DMA transfers the data to memory and offloads the CPU. This eliminates glue logic or an external FIFO for simple CMOS sensors. The 12-channel DMA sustains streaming into the on-chip SRAM at sensor line rates, and the 64 MHz core performs framing, downsampling, or barcode decoding. The 48-QFN footprint keeps camera-module host boards compact for access-control and IoT vision products.
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Consumer Appliance Control
In consumer appliance control, the ATSAM3S4AA-MUR provides a balanced mix of processing power, memory, and peripherals at a medium-range price point described by Microchip as the 'best ratio in terms of reduced power consumption, processing power and peripheral set'. The 256 KB flash stores UI code, recipes, or motor-control parameters; the 12-bit ADC reads temperature sensors and user potentiometers; TWI drives touch controllers and OLED displays; and timers generate PWM for heaters, fans, or motors. Industrial-temperature green QFN packaging and Tape & Reel supply support high-volume automated assembly lines for white goods and small appliances.
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Metering and Data Loggers
For energy and utility metering, the ATSAM3S4AA-MUR combines the 12-bit ADC for analog measurement channels, ample 256 KB flash for history logging and EEPROM emulation in flash, and the Cortex-M3 core for tariff computation and communication protocols over UART or TWI. Wide 1.62 V to 3.6 V operation tolerates battery sag in battery-powered meter variants, while DMA-driven acquisition keeps sampling consistent under communication load. The 48-QFN (7x7 mm) exposed-pad package dissipates heat efficiently in sealed enclosures, and long-term availability of the active SAM3S family supports multi-year metering product lifecycles and service commitments.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: ATSAM3S4AA-MUR — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | ATSAM3S4BA-MU | ATSAM3S2AA-MU | ATSAM3N4AA-MU | ATSAM3S2BA-MU |
|---|---|---|---|---|---|
| Package | 48-QFN (7x7 mm) Exposed Pad | 48-QFN (7x7) - same footprint | 48-QFN (7x7) - same footprint | 48-QFN (7x7) - same footprint | 48-QFN (7x7) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Frequency | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 256 KB | 256 KB | 128 KB | 256 KB | 128 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Pin Compatibility | Pin-to-pin compatible with SAM3N4A (per Microchip) | Same SAM3S 48-QFN footprint | Same SAM3S 48-QFN footprint | Officially pin-to-pin compatible with SAM3S4A | Same SAM3S 48-QFN footprint |
| Packaging | Tape & Reel (MUR) | Tray (MU suffix) | Tray (MU suffix) | Tray (MU suffix) | Tray (MU suffix) |
Ana Farklılayıcılar
- Double the flash of the cost-down variant (karşılaştırma:ATSAM3S2AA-MU)
- PIO parallel data capture mode (karşılaştırma:ATSAM3N4AA-MU)
- Tape & Reel supply for automated assembly (karşılaştırma:ATSAM3S4AA-MU)
- Honest trade-off: peripheral-mux risk on B-variant (karşılaştırma:ATSAM3S4BA-MU)
Tasarım Notları
The SAM3S4A integrates an on-chip 1.8 V LDO: connect the 1.62 V-3.6 V system rail to VDDIN and decouple VDDOUT with the capacitor values specified in the manufacturer datasheet. Do not drive VDDOUT from an external regulator, as the core supply is generated internally. Ensure the input rail stays within 1.62 V to 3.6 V under all battery and load conditions; brownouts below this window can corrupt flash writes during logging operations. Estimated: budget the LDO's dropout headroom when using low-cell-count supplies.
The 48-QFN (7x7 mm) exposed pad must be soldered to a grounded thermal landing on the PCB. Define a via array under the pad (e.g., 3x3 pattern of ~0.3 mm vias) tied to the ground plane to improve grounding and heat dissipation - this is standard practice for QFN exposed-pad assemblies and supports ADC accuracy by providing a low-impedance ground reference. Place 0.1 uF decoupling capacitors within 2 mm of each VDDIO pin and at VDDIN per the datasheet layout guidelines.
Confirm the exact peripheral set and pin multiplexing before switching within the family: SAM3S4A, SAM3S4B, SAM3S2A, and SAM3N4A share the 48-QFN footprint but differ in flash size and peripheral muxing (for example, parallel capture mode availability). Verify the 32 kHz crystal load capacitors against the XIN32/XOUT32 specification for RTC accuracy, and confirm MUR (Tape & Reel) versus MU (tray) ordering codes to match your assembly process.
Uyumluluk Bilgisi
Mouser lists the part as 'QFN GREEN IND TEMP MRL', indicating Microchip's green/RoHS-compliant industrial-temperature package. REACH, halogen-free, and conflict-minerals certificates not present in provided data - request Microchip environmental documentation for formal confirmation.