dsPIC33CK256MP506T-I/MR - 16-bit 100MHz DSC 256KB Flash | Microchip
MPN: DSPIC33CK256MP506T-I/MR ✓ AktifDSPIC33CK256MP506T-I/MR Genel Bakış
A digital signal controller combines the control-flow capabilities of a microcontroller with the mathematical throughput of a digital signal processor in a single chip. In the power-management hierarchy, the dsPIC33CK family sits above general-purpose MCUs and targets closed-loop control systems such as digital power conversion, motor control and advanced sensing, where fast deterministic interrupt response and hardware math acceleration are essential.
Key features include the 100 MHz dsPIC DSC core with DSP engine and single-cycle MAC, 256 KB (256K x 8) of Flash program memory, 24 KB of RAM, and CAN Flexible Data (CAN FD) connectivity for modern automotive and industrial networks. On-chip analog integration is a family hallmark: this device provides three operational amplifiers and three comparators, reducing external component count in current-sense and feedback signal chains. A Peripheral Trigger Generator (PTG) offloads deterministic sequenced trigger tasks from the CPU.
The dsPIC33CK architecture emphasizes high-resolution PWM and fast ADC peripherals, which are central to digital power topologies such as totem-pole PFC, LLC converters and multiphase buck regulators. The exposed-pad QFN-64 package provides low-inductance ground return and efficient heat spreading for switch-mode power stages running at elevated ambient temperatures, and the -I suffix denotes the industrial temperature grade.
Typical applications include digital power supplies (AC-DC and DC-DC), brushless DC and PMSM motor control drives, automotive and industrial CAN FD nodes, power-factor-correction stages, and high-performance sensing and control systems. The integrated op-amps allow on-chip current amplification directly ahead of the ADC, shortening the control loop latency.
Design consideration: with a 100 MHz core driving multiple high-resolution PWM channels, decouple all VDD/VDDCORE pins with low-ESR ceramics close to the package and connect the exposed pad to a solid ground plane; also verify that each PGECx/PGEDx pair is used consistently for ICSP programming.
This page synthesizes distributor inventory data, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single citable reference for the DSPIC33CK256MP506T-I/MR.
Drop-in alternatifler için DSPIC33CK256MP506T-I/MR — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller DSPIC33CK256MP506T-I/MR (aynı form faktörü ve ayağa oturma) — farklı olan Package, Core, Program Memory (Flash), Operating Temperature, Core Speed.
DSPIC33CK256MP506-I/MR
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →DSPIC33CK256MP506-E/MR
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →DSPIC33CK256MP506T-E/MR
✅ Yerleştirme ⚠️ Onaylanmamış Özellikler📋 Katalogda Olmayan Referans Alternatifi
DSPIC33CK128MP506-I/MR
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →DSPIC33CK128MP506-E/MR
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →DSPIC33CK256MP506T-I/MR Maksimum Değerlendirmeler & Elektriksel Özellikler
| Core | 16-bit dsPIC33CK DSC |
| Core Speed | 100 MHz |
| Flash Memory | 256 KB (256K x 8) |
| RAM | 24 KB |
| Veri Bus Genişliği | 16 bit |
| Paket | 64-QFN (9x9 mm), exposed pad |
| Pin Sayısı | 64 |
| On-chip Operational Amplifiers | 3 |
| On-chip Comparators | 3 |
| CAN Interface | CAN FD (Flexible Data) |
| Peripheral Trigger Generator (PTG) | Yes |
| High-Resolution PWM | Yes (per family datasheet) |
| Montaj Türü | Surface Mount |
| Temperature Grade | -I (Industrial, -40C to +85C) |
| RoHS Durumu | Compliant |
DSPIC33CK256MP506T-I/MR 64-qfn (9x9 mm), exposed pad Pin Yapısı Kılavuzu
DSPIC33CK256MP506T-I/MR (64-qfn (9x9 mm), exposed pad paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: DSPIC33CK256MP506T-I/MR.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
DSPIC33CK256MP506T-I/MR için uygundur 6 uygulamas: Digital Power Supplies (AC-DC / DC-DC), BLDC / PMSM Motor Control Drives, Automotive and Industrial CAN FD Nodes, Power Factor Correction (PFC) Stages, Advanced Sensing and Control Systems, Embedded Control in Industrial Automation.
Digital Power Supplies (AC-DC / DC-DC)
The dsPIC33CK256MP506T-I/MR fits digital power conversion because its 100 MHz core closes current-mode control loops with ample cycle margin, and its high-resolution PWM delivers the sub-nanosecond duty-cycle granularity required by LLC, totem-pole PFC and multiphase buck topologies. The three integrated op-amps amplify shunt-resistor current signals directly ahead of the ADC, cutting external component count and loop latency in fast feedback paths. In a typical AC-DC design the DSC samples input/output voltages and inductor current each switching cycle, computes the control law in the DSP engine, and updates the PWM comparators deterministically. Unlike a fixed-frequency analog controller, firmware enables adaptive burst mode, frequency dithering for EMI, and full telemetry over the CAN FD or UART link. The exposed-pad 64-QFN (9x9 mm) package spreads heat from the digital section while remaining compatible with compact power-supply PCBs, and the -I industrial temperature grade covers typical PSU ambient environments.
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BLDC / PMSM Motor Control Drives
Field-oriented control of brushless DC and permanent-magnet synchronous motors demands fast, deterministic math and precise PWM, and the dsPIC33CK256MP506T-I/MR delivers both: the 100 MHz dsPIC DSC core executes FOC current loops at high rates using its single-cycle MAC DSP engine, while high-resolution PWM phases drive the three-phase inverter with minimal dead-time distortion. The on-chip three op-amps condition low-side or inline shunt currents into the ADC without external amplifiers, and three comparators provide hardware overcurrent trip that shuts off PWM outputs in microseconds, independent of software. Firmware resident in the 256 KB Flash accommodates sensorless observers, field-weakening and communication stacks simultaneously. The 64-pin QFN exposes sufficient PWM, ADC and quadrature-encoder-interface pins for a complete drive, and the CAN FD module integrates the controller into industrial networked drives. The industrial -I temperature grade suits enclosed motor-drive environments from -40C to +85C ambient.
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Automotive and Industrial CAN FD Nodes
The integrated CAN Flexible Data module makes the dsPIC33CK256MP506T-I/MR a strong candidate for networked sensing and control nodes that must move larger payloads or higher bit rates than classical CAN allows. CAN FD extends data frames to 64 bytes and supports a faster arbitration/data-phase bit-rate switch, and the DSC hardware module handles this without CPU bit-timing overhead. In an industrial automation node, the 100 MHz core runs local control tasks while CAN FD streams diagnostics, parameter sets and firmware-update frames over the network. The 256 KB Flash stores dual-bank firmware for field upgrades, and the 24 KB RAM buffers network traffic alongside control state. Paired with a CAN FD transceiver, the node achieves the robust differential signaling the CAN standard is known for. Note that the standard -I part is not automotive AEC-Q100 qualified; select a Q-variant of the family for in-vehicle applications and verify qualification status in the Microchip product selector.
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Power Factor Correction (PFC) Stages
Average-current-mode power factor correction benefits directly from this DSC's architecture: the fast ADC samples rectified line voltage and inductor current near the switching frequency, the DSP engine computes the PFC control law, and high-resolution PWM updates the boost switch duty cycle with fine granularity that reduces input-current distortion at light load. The dsPIC33CK256MP506T-I/MR runs the PFC loop and housekeeping (inrush control, brown-out detection, surge counters) on one chip, with the PTG peripheral triggering ADC conversions on precisely sequenced PWM events - keeping sample timing jitter-free without CPU intervention. Firmware flexibility allows switching between boost, totem-pole and interleaved PFC variants on the same PCB. Because PFC stages operate hot, the exposed-pad 64-QFN layout should be tied to generous copper area; junction temperature must be kept within the -I grade limits by estimating dissipation from core frequency and peripheral activity per the family datasheet power equations.
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Advanced Sensing and Control Systems
High-performance sensing nodes use the dsPIC33CK256MP506T-I/MR where raw MCU analog front ends fall short: three on-chip op-amps provide gain stages for bridge, shunt or photodiode signals, and the fast ADC digitizes them synchronously with PTG-triggered sampling that eliminates software timing jitter. The DSP engine then applies FIR/IIR filtering and FFT analysis in real time at 100 MHz. Typical deployments include impedance measurement, vibration monitoring and precision actuator control, where the 256 KB Flash holds calibration tables, compensation firmware and communication stacks simultaneously. Results and setpoints travel over CAN FD, UART or SPI to a supervisory controller, making the DSC a smart satellite in larger automation architectures. The 64-pin QFN provides enough GPIO to drive local relays, indicators and debug interfaces, while the industrial temperature rating and RoHS-compliant package suit factory-floor installations. Designers should place analog traces away from PWM routing to preserve the signal chain's noise performance.
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Embedded Control in Industrial Automation
General industrial control panels and automation sub-systems adopt the dsPIC33CK256MP506T-I/MR when a project needs both real-time DSP-grade control and rich connectivity in one 64-QFN device. The 100 MHz core handles PID loops for process variables, the CAN FD module links to PLC networks, and the Peripheral Trigger Generator automates deterministic timing sequences that would otherwise consume CPU cycles. With 256 KB of Flash, one device can host application logic, a bootloader for field firmware updates over CAN, and diagnostic logging in RAM/Flash simultaneously - avoiding an external memory chip. The three op-amps and three comparators offload analog monitoring of sensors and fault conditions. The 64-pin count supports multiple encoder inputs, HMI touch lines and safety-interlock IO typical of machinery sub-systems. For new panel designs, the pin-compatible dsPIC33CK128MP506 offers a cost-reduced variant when the firmware image is smaller, enabling a two-tier product line on a single PCB layout.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: DSPIC33CK256MP506T-I/MR — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | DSPIC33CK256MP506-I/MR | DSPIC33CK256MP506-E/MR | DSPIC33CK128MP506-I/MR | DSPIC33CK128MP506-E/MR |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB | 128 KB |
| On-chip Op-Amps / Comparators | 3 / 3 | 3 / 3 | 3 / 3 | 3 / 3 | 3 / 3 |
| CAN FD | Yes | Yes | Yes | Yes | Yes |
| Temperature Range | -40C to +85C (-I) | -40C to +85C | -40C to +125C (E) | -40C to +85C | -40C to +125C (E) |
| Typical Use Case | Digital power, motor control, CAN FD nodes (volume production, tape & reel) | Same, tray packaging for prototyping/low volume | Same plus high-ambient environments | Cost-reduced when firmware fits 128 KB | Cost-reduced high-temperature variant |
Ana Farklılayıcılar
- Maximum family Flash for complex control firmware (karşılaştırma:DSPIC33CK128MP506-I/MR)
- On-chip analog integration reduces BOM cost (karşılaştırma:External op-amp solution (e.g., discrete MCP6021 stages))
- High-temperature availability (karşılaştırma:DSPIC33CK256MP506-I/MR)
- Trade-off: not automotive qualified (karşılaştırma:dsPIC33CH dual-core family)
Tasarım Notları
Solder the exposed pad of the 64-QFN (9x9) to a ground plane through an array of thermal vias. This pad is the primary ground return for the fast switching peripherals and the main heat path; a floating or under-viadded pad causes both thermal and signal-integrity problems in digital power layouts. Place a 100 nF ceramic capacitor at every VDD pin within 2-3 mm of the pin, plus bulk 10 uF capacitance near the package, per standard Microchip dsPIC33C decoupling guidance.
The device provides multiple PGECx/PGEDx programming pin pairs. Any pair may be used for ICSP, but ICSPCLK and ICSPDAT must come from the same numbered pair (e.g., PGEC2 with PGED2) - mixing pairs from different numbers is a common bring-up failure. Route your programming header to one pair and leave it dedicated. Also, all VSS and VDD pins must be connected; do not assume unused supply pins are optional.
Keep high-resolution PWM routing short and physically separated from the op-amp and ADC analog traces. The on-chip op-amps amplify millivolt-level shunt signals; PWM switching edges couple readily into adjacent routing on dense QFN layouts. Use a solid ground reference under analog traces, filter the op-amp inputs with small RC networks at the shunt, and trigger ADC sampling from the PTG/PWM events rather than software to guarantee loop-timing determinism.
Estimated: core and peripheral dissipation scale with operating frequency and PWM/ADC activity. For a 100 MHz digital power application, budget roughly 150-250 mW for the DSC itself (verify against the family datasheet power equations for your peripheral usage) and confirm the junction stays within the -I grade limits given your PCB copper area and ambient. Extended-temperature designs should move to the -E suffix variant rather than relying on PCB cooling alone.
Uyumluluk Bilgisi
RoHS compliance per Microchip standard product offering; verify specific compliance certificates on the Microchip product page. Not AEC-Q100 qualified in this standard -I variant.
