EPM9560WC208-15 - 560-Macrocell EE PLD, 117.6 MHz | Altera
MPN: EPM9560WC208-15 ✗ Son Kullanım ZamanıEPM9560WC208-15 Genel Bakış
A Programmable Logic Device (PLD) is a digital integrated circuit whose logic function is defined by the user after manufacture, sitting in the broader hierarchy: PLD -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The MAX 9000 series pioneered high-density EE PLDs using EEPROM configuration cells, allowing in-system reprogrammability without an external configuration memory. This places the EPM9560 in a distinct class between simple PAL/GAL devices and full FPGAs, offering predictable timing, deterministic pin-to-pin delays, and high usable-gate counts.
Key differentiating specifications include 560 macrocells (the largest in the MAX 9000 family), 149 usable user I/O pins (3.3 V/5 V tolerant), 35 LABs providing structured logic fabric, and 117.6 MHz maximum internal frequency. The 208-pin CQFP package provides hermetic ceramic packaging suited for harsh thermal and mechanical environments, with a 0.50 mm pitch suitable for surface mounting on standard PCB land patterns. Programming is performed via the JTAG-compliant IEEE Std 1149.1 boundary-scan interface using the Altera MAX+PLUS II or Quartus development toolchains.
Typical applications include industrial control logic, telecom interface glue logic, MIL/Aerospace systems requiring hermetic ceramic packaging, military-grade replacement of discrete TTL/CMOS logic, and legacy 5 V system glue logic. The wide 3.3 V/5 V I/O compatibility simplifies migration from 5 V ASICs to programmable equivalents without level shifters.
When designing with the EPM9560WC208-15, account for the ceramic CQFP package thermal behavior, which is markedly better than plastic QFP packages and well-suited for extended-temperature applications. Use the MAX+PLUS II baseline and fitter to verify pin assignments and timing closure before committing to the layout. Note that Altera has formally discontinued the 208-pin CQFP package and recommends the form-fit-function equivalent 208-pin RQFP variants for new designs.
Drop-in alternatifler için EPM9560WC208-15 — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EPM9560WC208-15 (aynı form faktörü ve ayağa oturma) — farklı olan Device Type, Package, Speed Grade, Process Technology, Supply Voltage.
EPM9560RC208-15
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EPM9560RC208-15N
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EPM9560RC208-15C
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EPM9560WC208
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EPM9560RC208-20
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EPM9560WC208-15C
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EPM9560WC208-15 Maksimum Değerlendirmeler & Elektriksel Özellikler
| Family | MAX 9000 |
| Device Type | EE PLD (Electrically Erasable Programmable Logic Device) |
| Technology | CMOS |
| Macrocells | 560 |
| Logic Array Blocks (LABs) | 35 |
| Flip-Flops | 772 |
| User I/O Pins (max) | 149 |
| Azami Saat Hızı | 117.6 MHz |
| Propagation Delay (tPD) | 16.6 ns |
| Speed Grade | -15 |
| Supply Voltage - I/O | 3.3 V or 5.0 V (configurable) |
| Paket | 208-pin CQFP (Ceramic Quad Flat Pack) |
| Terminal Pitch | 0.50 mm |
| Montaj Türü | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1 boundary scan) |
| RoHS Durumu | RoHS3 Compliant (per third-party listings) |
EPM9560WC208-15 208-pin cqfp (ceramic quad flat pack) Pin Yapısı Kılavuzu
EPM9560WC208-15 (208-pin cqfp (ceramic quad flat pack) paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EPM9560WC208-15.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EPM9560WC208-15 için uygundur 6 uygulamas: Industrial Control Logic Replacement, Military and Aerospace Avionics, Telecom Interface Glue Logic, Legacy 5V ASIC Replacement, Test and Measurement Instrumentation, Medical Imaging and Diagnostics.
Industrial Control Logic Replacement
The EPM9560WC208-15 replaces discrete TTL/CMOS logic boards in industrial automation systems, integrating up to 560 macrocells of glue logic into a single ceramic-package device. With 149 user I/O pins operating at 3.3 V or 5.0 V and 16.6 ns propagation delay, the part interfaces directly with legacy 5 V sensors, motor drivers, and PLC backplanes without level shifters. Its 117.6 MHz fMAX supports encoder decoding, PWM generation, and high-speed state machines in machine-tool and process-control retrofits. The hermetic CQFP208 package withstands factory-floor thermal cycling (-55C to +125C) far better than plastic CPLD alternatives, making it the preferred choice when extending the lifecycle of deployed industrial equipment.
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Military and Aerospace Avionics
The EPM9560WC208-15 is well suited for military and aerospace avionics because the ceramic CQFP208 package provides hermetic sealing against humidity and contaminants required for DO-254 and MIL-STD-454 compliance. Its 560 macrocells, 35 LABs, and 772 flip-flops deliver sufficient logic capacity for flight-control interfaces, sensor multiplexing, and redundant signal-path arbitration. The device's 3.3 V/5 V dual-voltage I/O simplifies integration with both legacy 5 V avionics buses and newer 3.3 V FPGA-based subsystems. JTAG-based in-system programming (IEEE 1149.1) supports field updates and BIT (built-in test) routines critical to military qualification.
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Telecom Interface Glue Logic
In telecom systems the EPM9560WC208-15 serves as high-density glue logic between T1/E1 framers, SONET/SDH mappers, and backplane transceivers, where 5 V-tolerant I/O and predictable pin-to-pin timing are essential. Its 149 usable user I/O pins and 117.6 MHz fMAX accommodate multi-channel framing, clock-data recovery, and protocol-state-machine functions in a single device. The 16.6 ns tPD ensures timing margin for backplane speeds up to ~60 MHz, while the EEPROM-based configuration enables rapid design iterations during protocol bring-up. JTAG boundary-scan integration simplifies board-level test coverage on dense telecom PCBs.
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Legacy 5V ASIC Replacement
The EPM9560WC208-15 is frequently used as a form-fit replacement for obsolete 5 V ASICs in legacy OEM systems, where re-spinning the ASIC is uneconomical but the existing PCB and surrounding logic operate at 5 V TTL/CMOS levels. Its configurable 3.3 V/5 V I/O via VCCIO, combined with 5 V-tolerant inputs, allows direct drop-in to existing 5 V board designs without level shifters or power-rail changes. The 560-macrocell capacity emulates mid-complexity gate arrays (5K-10K gates) with the added benefit of JTAG reprogrammability for design bug fixes. Per the Altera discontinuance notice, this is the canonical use case for the plastic RQFP variant on new spares.
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Test and Measurement Instrumentation
In test and measurement equipment the EPM9560WC208-15 implements custom timing generators, pattern generators, and instrument-control state machines, where deterministic 16.6 ns pin-to-pin delay and 35 LABs of structured logic enable repeatable waveform synthesis. The 772 flip-flops are well suited for parallel data-capture registers and sequencer counters, while 149 user I/O pins handle front-panel switching and rear-panel trigger routing. JTAG-based ISP allows factory calibration routines to update personality logic without opening the chassis. The ceramic CQFP package maintains timing stability over the wide thermal range encountered in laboratory environments.
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Medical Imaging and Diagnostics
The EPM9560WC208-15 is found in medical imaging subsystems (ultrasound beamformers, CT scanner data acquisition boards) where predictable timing and high logic density drive board consolidation. With 560 macrocells and 117.6 MHz fMAX, the device handles channel-multiplexing logic, ADC/DAC timing generators, and image-pre-processing glue logic. The dual-voltage I/O (3.3 V/5 V) bridges legacy analog front-ends and modern DSP processors without external level translation. The hermetic ceramic CQFP208 package is rated for the long product-life cycles (15-20 years) and reliability targets typical of medical equipment.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: EPM9560WC208-15 — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EPM9560RC208-15 | EPM9560RC208-15N | EPM9560RC208-15C | EPM9560WC208 | EPM9560RC208-20 | EPM9560WC208-15C |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 208-pin CQFP (Ceramic) | 208-pin RQFP (Plastic) | 208-pin RQFP (Plastic) | 208-pin RQFP (Plastic) | 208-pin CQFP (Ceramic) | 208-pin RQFP (Plastic) | 208-pin CQFP (Ceramic) |
| Macrocells | 560 | 560 | 560 | 560 | 560 | 560 | 560 |
| Propagation Delay (tPD) | 16.6 ns | 16.6 ns | 16.6 ns | 16.6 ns | 16.6 ns (typical) | 20.0 ns | 16.6 ns |
| Maximum Clock Frequency | 117.6 MHz | 117.6 MHz | 117.6 MHz | 117.6 MHz | 117.6 MHz | 100 MHz | 117.6 MHz |
| User I/O Pins | 149 | 149 | 149 | 149 | 149 | 149 | 149 |
| Speed Grade | -15 | -15 | -15N | -15C | default (unspecified) | -20 | -15C |
| Lifecycle Status | Discontinued (CQFP package) | Active (RQFP replacement) | Active | Active | Discontinued | Active | Discontinued |
Ana Farklılayıcılar
- Hermetic ceramic CQFP208 package for harsh-environment applications (karşılaştırma:EPM9560RC208-15 (plastic RQFP))
- Speed grade -15 with 16.6 ns tPD and 117.6 MHz fMAX (karşılaştırma:EPM9560RC208-20 (speed grade -20))
- Dual-voltage 3.3 V/5 V I/O without level shifters (karşılaştırma:MAX 7000 family CPLDs)
Tasarım Notları
The EPM9560WC208-15 in CQFP208 ceramic package is formally discontinued per Altera's Product Discontinuance Notice. For new designs, immediately default to the EPM9560RC208-15 (208-pin plastic RQFP) which Altera designates as form-fit-function equivalent. PCB layout must be adapted to the larger plastic package body. Do not design in the CQFP variant unless hermetic packaging is mandatory for military/aerospace qualification.
The ceramic CQFP208 package has a lower thermal resistance than the plastic RQFP equivalent, typically theta_JA around 30-35 C/W vs 40-50 C/W for plastic. Although the MAX 9000 family is CMOS with modest power dissipation (~1-2 W typical), verify junction temperature against the application ambient in sealed enclosures. Decoupling capacitors (0.1 uF ceramic + 10 uF bulk) should be placed within 5 mm of each VCC/VCCIO pin pair.
The 208-pin CQFP package uses 0.50 mm lead pitch with gull-wing leads. PCB land patterns must follow IPC-7351 guidelines with appropriate toe and heel fillets for ceramic packages, which differ slightly from plastic QFP patterns. Allocate at least 4 PCB layers with a dedicated ground plane beneath the device to control simultaneous-switching noise (SSN) on the 149 user I/O pins. JTAG TDI/TDO/TMS/TCK traces should be length-matched within 25 mm to preserve boundary-scan signal integrity.
The 3.3 V/5 V dual-voltage I/O is configured per bank via VCCIO supply pins; ensure each I/O bank receives the correct supply for the connected logic family. Mixing 3.3 V and 5 V signals within the same bank without proper VCCIO selection will damage the device. The 117.6 MHz fMAX rating assumes 25 pF load with 50 pF maximum; exceeding this derates fMAX significantly per the MAX 9000 datasheet timing derating curves.
Uyumluluk Bilgisi
Ceramic CQFP packages in the MAX 9000 family were generally manufactured before RoHS compliance was widely adopted; the plastic RQFP replacements (EPM9560RC208-15 variants) are RoHS3 compliant per third-party distributor listings. AEC-Q100 is not applicable for legacy Altera MAX 9000 commercial/military grade parts.
