EPM9560WC208-15C - 560-Macrocell EE PLD | Altera MAX 9000
MPN: EPM9560WC208-15C ✗ Son Kullanım ZamanıEPM9560WC208-15C Genel Bakış
A Complex Programmable Logic Device (CPLD) is a non-volatile, instant-on logic fabric that combines multiple Programmable Logic Array (PLA)-style blocks with a centralized interconnect matrix. PLDs sit hierarchically between simple SPLDs (PAL/GAL) and high-capacity FPGAs; the MAX 9000 family specifically targets glue-logic, bus-interface, and state-machine consolidation where deterministic timing and zero-configurability-startup are critical.
Key features include 560 CMOS macrocells distributed across 35 Logic Array Blocks (LABs), 772 flip-flops, and 149 user-configurable I/O pins with 5 V tolerant inputs. The architecture is built on an SRAM-style configuration cell reloaded from on-chip EEPROM, yielding true in-system programmability through the IEEE 1149.1 JTAG interface. A typical internal counter frequency of 117.6 MHz enables fast sequencer design, while the 16.6 ns tPD supports 60 MHz synchronous glue logic.
The device is implemented in a 0.35 µm CMOS EEPROM process, providing 100 program/erase cycles and 20-year data retention per the MAX 9000 datasheet family. The I/O structure uses 3.3 V or 5 V LVCMOS/LVTTL drivers with per-pin direction, slew-rate, and pull-up configuration. MultiVolt I/O allows direct interfacing between 5 V and 3.3 V buses without external level shifters, simplifying mixed-voltage board design.
Typical applications include industrial control systems, telecommunications line-card glue logic, military and aerospace avionics (the C-grade suffix and ceramic package target harsh-temperature, high-reliability environments), and legacy bus-interface bridging. With 149 I/O pins it comfortably replaces multiple 32- and 44-macrocell PLDs and discrete TTL/MSI glue.
When designing, plan JTAG chain ordering carefully because the EE PLD shares the TAP pins with adjacent devices and the ceramic CQFP-208 footprint requires thermal relief pads under the leads to survive thermal-cycling. Programming voltages are generated internally; no external 12 V VPP is required.
This page consolidates distributor pricing, verified same-family drop-in alternatives, and ceramic-package design guidance - information not always present in the manufacturer datasheet alone.
Drop-in alternatifler için EPM9560WC208-15C — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EPM9560WC208-15C (aynı form faktörü ve ayağa oturma) — farklı olan Device Type, Package, Process Technology, Operating Temperature Grade, Propagation Delay (tPD).
EPM9560WC208-15
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EPM9560WC208
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EPM9560RC208-15C
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EPM9560RC208-15
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EPM9560RC208-20C
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EPM9560WC208-15C Maksimum Değerlendirmeler & Elektriksel Özellikler
| Device Family | MAX 9000 |
| Series | EPM9560 |
| Macrocells | 560 |
| Logic Array Blocks (LABs) | 35 |
| Flip-Flops | 772 |
| User I/O Pins | 149 |
| Besleme Gerilimi | 3.3 V or 5 V |
| Azami Saat Hızı | 117.6 MHz |
| Pin-to-Pin Propagation Delay (tPD) | 16.6 ns |
| Process Technology | 0.35 µm CMOS EEPROM |
| Paket | CQFP-208 (Ceramic Quad Flat Pack) |
| Terminal Pitch | 0.50 mm |
| Montaj Türü | Surface Mount |
| Programming Interface | IEEE 1149.1 JTAG |
| Operating Temperature Grade | C (Commercial) |
| MultiVolt I/O | Yes (3.3 V / 5 V tolerant) |
| RoHS Durumu | ROHS3 Compliant |
| Nem Hassasiyet Seviyesi (MSL) | 3 (168 Hours) |
EPM9560WC208-15C cqfp-208 (ceramic quad flat pack) Pin Yapısı Kılavuzu
EPM9560WC208-15C (cqfp-208 (ceramic quad flat pack) paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EPM9560WC208-15C.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EPM9560WC208-15C için uygundur 6 uygulamas: Industrial Control Logic Consolidation, Telecommunications Line-Card Glue Logic, Aerospace and Military Avionics, Legacy Bus-Interface Bridging, High-Reliability Medical Instrumentation, Test and Measurement Equipment.
Industrial Control Logic Consolidation
The EPM9560WC208-15C consolidates multi-chip TTL/CMOS glue logic into a single non-volatile device on industrial PLC and process-control boards. With 560 macrocells, 35 LABs, and 772 flip-flops it can absorb an entire 74-series decoder/buffer tree plus state-machine logic. The 16.6 ns tPD delivers deterministic timing for safety interlocks, and the JTAG ISP interface enables field firmware updates without removing the board. The 3.3 V/5 V MultiVolt I/O simplifies mixed-voltage interface to legacy 5 V sensors and modern 3.3 V microcontrollers.
Önerilen
Telecommunications Line-Card Glue Logic
Telecom line cards rely on fast, deterministic glue logic to bridge backplane buses, framers, and switch fabrics. The EPM9560WC208-15C's 117.6 MHz internal counter frequency and 16.6 ns tPD suit 60 MHz synchronous interfaces such as E1/T1 framers and UTOPIA-level ATM/POS paths. Its 149 user I/O pins comfortably handle address-decoding, parity generation, and bus-arbitration logic. MultiVolt I/O supports direct connection to 3.3 V framers and 5 V legacy backplanes without level shifters.
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Aerospace and Military Avionics
The ceramic CQFP-208 package and C-grade temperature rating position the EPM9560WC208-15C for avionics subsystems that demand hermetic packaging and resistance to vibration and thermal cycling. With 560 macrocells the device can implement MIL-STD-1553 bus monitor logic, ARINC 429 interface glue, and discrete signal conditioning in a single chip. JTAG boundary-scan supports board-level test per IEEE 1149.1, which is mandatory for many DO-254 design-assurance flows.
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Legacy Bus-Interface Bridging
Designers frequently need to bridge between legacy parallel buses (ISA, VME, PCI) and modern processors. The EPM9560WC208-15C's 149 I/O and 772 flip-flops handle address-latch, wait-state generation, and bus-arbitration state machines in one device. The non-volatile EEPROM configuration boots in microseconds with no external PROM, simplifying board layout. Programmable I/O standards via MultiVolt allow direct interface to 3.3 V processors and 5 V peripheral buses.
Önerilen
High-Reliability Medical Instrumentation
Medical imaging and patient-monitoring instruments demand long-life, deterministic logic with predictable boot behavior. The EPM9560WC208-15C's EEPROM-based configuration ensures instant-on with no external configuration memory, eliminating FPGA boot-PROM failure modes. Its 560 macrocells consolidate board real estate for patient-monitoring signal conditioning, while the hermetic ceramic package suits sterile-environment sterilization cycles. JTAG ISP enables in-the-field firmware upgrades for service technicians.
Önerilen
Test and Measurement Equipment
Test instruments such as oscilloscopes, logic analyzers, and protocol testers use the EPM9560WC208-15C as front-panel and backplane glue. The 117.6 MHz max frequency and 16.6 ns tPD support channel-multiplexing and trigger-arming logic at hundreds of MHz. With 149 user I/O the device can drive multiple display buses, GPIB interfaces, and front-panel key-matrix decoders from a single chip, reducing BOM and improving MTBF for the instrument.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: EPM9560WC208-15C — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EPM9560WC208-15 | EPM9560WC208 | EPM9560RC208-15C | EPM9560RC208-15 | EPM9560RC208-20C |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | CQFP-208 | CQFP-208 - same | CQFP-208 - same | CQFP-208 - same | CQFP-208 - same | CQFP-208 - same |
| Macrocells | 560 | 560 | 560 | 560 | 560 | 560 |
| Logic Array Blocks (LABs) | 35 | 35 | 35 | 35 | 35 | 35 |
| User I/O Pins | 149 | 149 | 149 | 149 | 149 | 149 |
| Propagation Delay (tPD) | 16.6 ns | 16.6 ns | 22 ns (base) | 16.6 ns | 16.6 ns | 22 ns |
| Temperature Grade | C (Commercial) | Industrial | Commercial | Commercial | Industrial | Commercial |
| Supply Voltage | 3.3 V or 5 V | 3.3 V or 5 V | 3.3 V or 5 V | 3.3 V or 5 V | 3.3 V or 5 V | 3.3 V or 5 V |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Ana Farklılayıcılar
- High density at 560 macrocells with 149 user I/O (karşılaştırma:EPM9320RC208-20)
- Commercial temperature grade with ceramic packaging (karşılaştırma:EPM9560WC208-15)
- MultiVolt I/O supports mixed 3.3 V and 5 V buses (karşılaştırma:MAX 7000AE family)
Tasarım Notları
The CQFP-208 ceramic package has higher thermal resistance than equivalent plastic QFP packages because the ceramic body dissipates heat through the leads rather than the package top. Estimated: at 1.5 W dissipation with theta_JA around 35 C/W the junction rises roughly 52 C above ambient. Provide thermal-relief lead pads and, in high-vibration environments, mechanical staking to prevent lead fatigue. Verify junction temperature under worst-case ambient for the C-grade 0 C to 70 C window.
The 0.50 mm terminal pitch on CQFP-208 requires precise SMT land-pattern design. Use NSMD (Non-Solder Mask Defined) pads with a 0.27 mm pad width and 0.15 mm solder-mask expansion for reliable reflow. Stencil aperture should be 0.25 mm x 1.6 mm with 0.10 mm thickness to avoid solder bridges. For double-sided reflow, glue the package before the second pass because the ceramic body is heavy enough to lift during the second reflow cycle.
Do not confuse the EPM9560WC208-15C with the plastic QFP version. The 'W' in WC208 denotes the ceramic windowed package for UV-erase; if your design needs JTAG-only ISP, you can use either ceramic-windowed or ceramic-hermetic variants. Mixing the ceramic CQFP-208 footprint with a plastic QFP-208 footprint will cause lead-alignment failures. Also, JTAG chain ordering matters: place the CPLD after any 5 V TAP devices because its I/O are 3.3 V/5 V tolerant but VCC must match the chain driver reference.
Uyumluluk Bilgisi
ROHS3 compliance per fpgalink.com listing. Ceramic CQFP package may use lead-bearing terminations depending on date code - confirm lead-finish code with supplier if Pb-free assembly is mandatory. REACH, halogen-free, and conflict-minerals status not disclosed in the available distributor data; request manufacturer statement of compliance for EU builds.
