XC6SLX25-3FTG256I - 24K Spartan-6 LX FPGA | AMD
MPN: XC6SLX25-3FTG256I ✓ AktifXC6SLX25-3FTG256I Genel Bakış
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and I/O behavior can be configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, block RAM, programmable I/O, clocking resources, and dedicated fabric interconnect. Compared with application-specific standard products, an FPGA permits hardware revisions and functional adaptation without changing the physical PCB.
The Spartan-6 LX device provides 24,051 logic elements organized as 3,758 adaptive logic modules, together with 936 Kbit of embedded memory. Its 186 user I/Os support connections to external memory, communications transceivers, sensors, displays, and general-purpose control logic. The programmable architecture is useful for parallel data acquisition, protocol conversion, image processing, embedded control, and configurable interface systems where parallel hardware implementation can reduce system complexity.
The XC6SLX25-3FTG256I uses 45 nm CMOS fabrication and is identified as operating from 1.2 V in the family comparison material. Its programmable logic fabric supports parallel processing, state-machine implementation, data filtering, and fixed-function accelerator designs. The -3 designation identifies a higher-performance speed grade, while FTG256 identifies the package configuration used by this ordering code.
Typical applications include industrial control and automation, communications infrastructure, test and measurement equipment, video and image processing, embedded storage systems, and sensor-processing platforms. A design can use internal block RAM for buffering, programmable I/O for external interfaces, and dedicated clock resources for synchronizing data across parallel processing paths.
PCB implementation requires careful attention to the fine-pitch BGA footprint, power and ground distribution, decoupling, and high-speed routing. Use the AMD Spartan-6 package pinout files to assign every ball, verify voltage domains, and confirm boundary-scan or configuration access requirements before releasing the PCB layout.
This product page combines device specifications, package details, lifecycle and sourcing information, compatible alternatives, comparison parameters, and practical FPGA design guidance. It is intended to help engineers identify the correct Spartan-6 LX device and plan a controlled, pin-compatible redesign without relying on incomplete distributor summaries.
Drop-in alternatifler için XC6SLX25-3FTG256I — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller XC6SLX25-3FTG256I (aynı form faktörü ve ayağa oturma) — farklı olan Package, Speed Grade, Logic Cells, Device Type, RoHS Status.
XC6SLX25-2FTG256I
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →XC6SLX25-2FTG256C
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
XC6SLX25-3FT256I
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →XC6SLX25-3FTG256I Maksimum Değerlendirmeler & Elektriksel Özellikler
| Device Type | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Elements | 24,051 LE |
| Adaptive Logic Modules | 3,758 ALM |
| Embedded Memory | 936 Kbit |
| User I/O | 186 I/O |
| Internal Frequency | 500 MHz |
| Speed Grade | -3 |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| İşletim Sıcaklığı | 0°C to 85°C |
| Paket | 256-LBGA |
| Package Dimensions | 15 mm × 15 mm |
| Package Pitch | 0.80 mm |
| Montaj Türü | Surface Mount |
| Lead-Free Status | Lead Free |
XC6SLX25-3FTG256I 0.80 mm Pin Yapısı Kılavuzu
XC6SLX25-3FTG256I (0.80 mm paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: XC6SLX25-3FTG256I.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
XC6SLX25-3FTG256I için uygundur 6 uygulamas: Industrial Control and Automation, Data Acquisition and Signal Processing, Communications Interface Conversion, Video and Image Preprocessing, Test and Measurement Equipment, Embedded Storage Controller.
Industrial Control and Automation
The XC6SLX25-3FTG256I fits industrial controllers that must combine multiple deterministic interfaces with adaptable logic. Its 24,051 logic elements can implement state machines, protocol handling, timing functions, and control logic in parallel, while 186 I/Os provide connections to sensors, actuators, and field-bus transceivers. The 0°C-to-85°C operating range suits industrial ambient conditions when the enclosure and thermal design meet system requirements. Compared with a fixed microcontroller, the FPGA allows control algorithms and interface timing to be revised through a new bitstream. Designers should partition functions into clocked logic domains, constrain all timing paths, and use the AMD Spartan-6 package files to verify every ball before fabrication.
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Data Acquisition and Signal Processing
The XC6SLX25-3FTG256I is suitable for parallel data-acquisition systems that perform filtering, decimation, correlation, or thresholding directly in programmable logic. The 24,051 logic elements and 936 Kbit of embedded memory allow multiple processing pipelines and controlled sample buffering to coexist within one FPGA. Its 186 I/Os can connect converters, memory devices, and synchronization interfaces. Using a -3 speed-grade device may improve timing margin over a -2 alternative in the same FTG256 package. For implementation, define acquisition and processing clocks separately, constrain input timing relative to those clocks, and register pipeline outputs to prevent combinational paths from becoming hidden timing bottlenecks.
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Communications Interface Conversion
The XC6SLX25-3FTG256I can bridge parallel and serial interface formats by combining programmable I/O, dedicated clocking resources, logic fabric, and block RAM in one device. Its 186 I/Os are useful for parallel buses, while its 24,051 logic elements can implement framing, CRC generation, buffering, and protocol state machines. The 500 MHz internal frequency figure provides a basis for clock-domain planning, but actual interface rates depend on the selected I/O standard, timing constraints, and board routing. For reliable implementation, use clock buffers for high-fanout nets, constrain source-synchronous interfaces, and keep high-speed and sensitive analog-adjacent return paths appropriately separated on the PCB.
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Video and Image Preprocessing
The XC6SLX25-3FTG256I supports parallel image preprocessing, such as pixel formatting, thresholding, line buffering, and region-of-interest detection. The 936 Kbit of embedded memory provides dedicated storage for line or small-frame buffers, while 24,051 logic elements can sustain multiple parallel pixel pipelines. Its 186 I/Os allow connection to image sensors, parallel capture devices, and downstream processors without relying on a narrow external memory interface for every operation. The -3 speed grade can provide additional timing margin over a -2 device when pixel-clock rates are high. Designers should register sensor outputs immediately, constrain the pixel clock domain, and confirm the selected I/O standard against the camera or sensor electrical specification.
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Test and Measurement Equipment
The XC6SLX25-3FTG256I is useful in programmable test equipment, automated test systems, and instrumentation requiring concurrent pattern generation, acquisition, and result processing. Its 24,051 logic elements can host multiple test channels, timing checks, and control sequences, while 936 Kbit of block RAM supports captured samples and expected-result tables. The 186 I/Os can interface with DUTs, drivers, and capture hardware. The -3 grade is appropriate where high clock rates and narrow timing margins make the lower-speed -2 grade unsuitable. For predictable results, separate DUT clocks from internal processing logic, apply calibrated timing constraints, and review implemented timing reports rather than relying only on estimated logic utilization.
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Embedded Storage Controller
The XC6SLX25-3FTG256I can act as a dedicated storage-control and buffer-management device when a system needs programmable access sequencing, error checking, or data rearrangement. The device combines 936 Kbit of embedded memory with 24,051 logic elements, enabling parallel caches, FIFO structures, ECC functions, and command processors within the same FPGA. Its 186 I/Os are suitable for connecting memory components and control signals. Because external memory timing can be sensitive, the design must use defined input and output registers, constrain memory-interface paths, and verify byte-group alignment and voltage compatibility. The -3 speed grade offers additional margin for demanding parallel interfaces, while a -2 alternative may suffice for lower-rate storage workloads.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: XC6SLX25-3FTG256I — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | XC6SLX25-2FTG256I | XC6SLX25-2FTG256C | XC6SLX25-3FT256I |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | FTG256 | FTG256 | FTG256 | FTG256 |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3 | -2 | -2 | -3 |
| Logic Elements | 24,051 LE | 24,051 LE | 24,051 LE | 24,051 LE |
| Adaptive Logic Modules | 3,758 ALM | 3,758 ALM | 3,758 ALM | 3,758 ALM |
| Embedded Memory | 936 Kbit | 936 Kbit | 936 Kbit | 936 Kbit |
| User I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
Ana Farklılayıcılar
- Higher -3 speed grade within the Spartan-6 LX family (karşılaştırma:XC6SLX25-2FTG256I)
- Industrial 0°C-to-85°C operating range (karşılaştırma:XC6SLX25-2FTG256C)
- Identical core resource capacity for controlled timing-only substitution (karşılaştırma:XC6SLX25-2FTG256I)
Tasarım Notları
Use the AMD Spartan-6 package-device pinout files as the authoritative source for FTG256 ball assignment. Verify configuration pins, voltage domains, grounds, and any dedicated pins before symbol creation. The package is a 0.80 mm-pitch BGA on a 15 mm × 15 mm footprint, so pad and paste geometry, solder-mask definition, via-in-pad policy, and assembly capability should be reviewed with the PCB manufacturer before release.
Decouple each supply domain close to its associated package balls and provide low-impedance planes for ground and core currents. Keep the 1.2 V core rail and any auxiliary I/O supplies on separate filtering paths where their noise requirements differ. Place bulk energy storage at the board level, but do not rely on it as a substitute for local high-frequency decoupling. Validate steady-state and transient currents against the selected speed grade and design utilization.
Create explicit clock-domain constraints and use dedicated clock-capability resources for high-fanout clock nets. Register external inputs before consuming them in fabric logic, and add output registers for timing-critical paths. For source-synchronous interfaces, constrain input and output delays using the actual external-device timing and board budget rather than applying unverified delays. Review post-route timing at the intended operating speed and inspect clock skew.
Do not treat an FTG256 package match as proof that every product speed grade is an interchangeable drop-in. The -3 target, -2 alternatives, and alternate temperature suffixes have different timing and environmental requirements. Generate a new implementation and bitstream for the exact selected MPN, recompile all constraints, and confirm configuration behavior. Also verify that any firmware or boot configuration tied to the original device remains compatible with the replacement.
Uyumluluk Bilgisi
The component specification identifies the package as lead free. RoHS, REACH, halogen-free, and conflict-minerals status are not stated in the target MPN records.
