XC7A75T-1CS324I - 75,520-LE Artix-7 FPGA | AMD | Industrial
MPN: XC7A75T-1CS324I ✓ AktifXC7A75T-1CS324I Genel Bakış
An FPGA is a semiconductor whose digital behavior is defined after manufacture by loading a configuration bitstream. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel processing, control logic, interfaces, and signal-processing pipelines in one integrated device. The Artix-7 family targets cost-sensitive embedded systems where programmable logic, processing throughput, and compact integration are more important than the very high performance associated with larger FPGA families.
The verified listing identifies 75,520 logic elements, a 210 mm² die, 3,870,720 embedded-memory bits, a 324-LFBGA package, and a ball-terminal package format. Other technical details—including logic-cell composition, block-RAM and DSP counts, I/O counts, transceiver quantities, voltage rails, power consumption, and performance timing—were not included in the supplied excerpts and therefore require confirmation from AMD’s complete Artix-7 documentation.
Typical uses for this device include industrial automation, motor and motion control, sensor acquisition, communications, embedded vision, test equipment, and digital signal processing. Parallel datapaths can accelerate filtering, control loops, protocol handling, and sensor fusion, while block RAM supports local buffering and DSP resources can implement fixed-point or floating-point arithmetic. A final design must still verify the exact Artix-7 resource mix, transceiver requirements, pin constraints, and timing against the selected board revision.
A critical design step is assigning every external signal to the correct 324-ball package ball and obtaining the matching package pinout file before schematic capture. Designers should also verify configuration memory connections, bank supply voltages, decoupling, clocking, transceiver usage, and thermal performance. A bitstream compiled for the exact MPN should be validated on the intended hardware before production.
This page consolidates the verified distributor identity, package information, sourcing links, comparison framework, and engineering cautions. It deliberately does not infer missing electrical or resource details, allowing engineers to distinguish confirmed facts from parameters that still require manufacturer-document review.
Drop-in alternatifler için XC7A75T-1CS324I — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller XC7A75T-1CS324I (aynı form faktörü ve ayağa oturma) — farklı olan Mounting Type, Package, Speed Grade, Temperature Grade.
XC7A75T-1CSG324I
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
XC7A75T-2CSG324I
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →XC7A75T-1CSG324I
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
XC7A75T-L1CSG324I
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
XC7A75T-1CS324I
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →XC7A75T-1CS324I Maksimum Değerlendirmeler & Elektriksel Özellikler
| Product Type | Artix-7 Field Programmable Gate Array (FPGA) IC |
| Logic Elements | 75,520 |
| Embedded Memory | 3,870,720 bits |
| Die Size | 210 mm² |
| Paket | 324-LFBGA, CSPBGA |
| Package Family | LFBGA |
| Total Terminals | 324 balls |
| Terminal Form | Ball |
| Package Shape | Square |
| Device Family | Artix-7 |
| Speed Grade | -1 grade |
| Temperature Grade | Industrial |
| Product Category | Programmable Logic Device (CPLDs/FPGAs) |
| Montaj Türü | Surface-mount BGA |
XC7A75T-1CS324I square Pin Yapısı Kılavuzu
XC7A75T-1CS324I (square paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: XC7A75T-1CS324I.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
XC7A75T-1CS324I için uygundur 6 uygulamas: Industrial Automation and PLC Control, Motor Control and Motion Systems, Sensor Acquisition and Signal Fusion, Industrial and Embedded Communications, Test and Measurement Equipment, Embedded Vision and Image Processing.
Industrial Automation and PLC Control
The XC7A75T-1CS324I fits parallel industrial-control logic because its verified 75,520 logic elements can host multiple control tasks, state machines, interlocks, and communication handling in one Artix-7 FPGA. The industrial temperature-grade ordering identity is useful for equipment exposed to variable factory conditions. Place the device beside isolation and transceiver circuitry, then partition control and safety functions so timing remains deterministic. Before schematic approval, verify the exact bank voltages, available user I/O, industrial temperature limits, and CS324 pin assignments from AMD documentation; those details are not quantified in the supplied excerpts.
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Motor Control and Motion Systems
The AMD XC7A75T-1CS324I is suitable for deterministic motor-control pipelines that combine current sampling, position capture, fault handling, and command generation. Its verified 75,520 logic elements provide substantial configurable logic capacity for parallel control loops, while the Artix-7 device family is associated with embedded signal processing. Use separate clocking and synchronization for control and protection paths, and keep high-current switching circuitry outside the FPGA. Exact DSP capacity, pin timing, I/O standards, and operating-temperature limits must be confirmed before claiming a specific loop rate or control resolution.
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Sensor Acquisition and Signal Fusion
The XC7A75T-1CS324I can consolidate multiple sensor inputs, calibration tables, filtering, and event logic when a design benefits from parallel programmable datapaths. Its verified 3,870,720 embedded-memory bits are relevant for capture buffers and working storage, although block-RAM organization and maximum interfaces are not included in the supplied data. Engineers should map ADC, clock, trigger, and digital I/O signals directly from the CS324 package file, then implement timing constraints and calibration storage in the AMD toolchain. Verify simultaneous I/O performance and memory bandwidth during architecture exploration.
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Industrial and Embedded Communications
The XC7A75T-1CS324I can implement protocol engines, packet filters, test patterns, and interface bridging in parallel programmable logic. That flexibility is useful when equipment combines industrial Ethernet, serial communication, and real-time control functions. Select transceivers according to the actual electrical layer, isolate external cabling, and constrain receive and transmit paths for the required data rate. The supplied results do not state the device's transceiver count or supported high-speed protocols, so a communications claim should not assume dedicated SerDes resources without checking the complete Artix-7 device table.
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Test and Measurement Equipment
The Artix-7 FPGA architecture is suited to programmable test systems because independent logic, memory, and arithmetic blocks can execute acquisition, sequencing, pattern generation, and analysis concurrently. The XC7A75T-1CS324I provides a verified 75,520 logic elements and a compact 324-ball BGA option for advanced instruments. Engineers should reserve clocks and serial links carefully, establish deterministic triggers, and isolate analog front ends from high-speed digital return currents. Exact I/O, DSP, RAM, and timing resources must be obtained from the manufacturer data before committing to channel count, sample rate, or waveform bandwidth.
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Embedded Vision and Image Processing
The XC7A75T-1CS324I can support parallel image pipelines, pixel classification, line buffering, and interface timing because Artix-7 devices combine programmable logic with embedded resources. The verified logic-element count is substantial for cost-sensitive embedded processing, but it is not a substitute for a complete resource count. Engineers must select a compatible image sensor interface, define frame and line timing, and use DDR memory only after checking the available memory interfaces and controller architecture. Validate timing closure, bandwidth, and thermal performance with the intended image format and clock frequencies.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: XC7A75T-1CS324I — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | XC7A75T-1CSG324I | XC7A75T-2CSG324I | XC7A75T-L1CSG324I |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 324-LFBGA, CSPBGA | 324-LFBGA, CSPBGA | 324-LFBGA, CSPBGA | 324-LFBGA, CSPBGA |
| Device Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Speed Designator | -1 | -1 | -2 | L1 |
| Terminals | 324 balls | 324 balls | 324 balls | 324 balls |
Ana Farklılayıcılar
- Exact ordering identity (karşılaştırma:XC7A75T-1CSG324I)
- Verified core resource basis (karşılaştırma:XC7A75T-L1CSG324I)
- Known die and package identity (karşılaştırma:XC7A75T-2CSG324I)
Tasarım Notları
Use AMD’s official CS324 package pinout files as the authority for every BGA ball before releasing the schematic or PCB. The supplied results confirm that the package is a 324-LFBGA and identify the package-file resource, but they do not provide all 324 signal names. Cross-check power, ground, configuration, clock, bank-voltage, and user-I/O balls against the selected device speed and temperature ordering codes. Never copy a pinout from a different Artix-7 package.
Plan the complete power tree only after obtaining the manufacturer’s recommended operating conditions, rail tolerances, bank rules, and decoupling guidance. Separate core, auxiliary, and I/O supplies according to the actual design constraints, and account for startup sequencing and configuration behavior. These voltages and limits are marked as needed because the supplied excerpts identify the device but do not contain the electrical tables. Validate power sequencing and rail tolerance on hardware before timing sign-off.
A 324-ball BGA requires deliberate thermal and return-path planning. Estimate total FPGA dissipation from the selected design rather than treating the -1 speed grade as a fixed power value. Use the manufacturer thermal data for the actual package, board stack-up, airflow, and ambient conditions; no estimated junction temperature is supplied here. Keep high-current switching nodes away from sensitive inputs and preserve continuous ground planes beneath the BGA to minimize thermal resistance and return-path discontinuities.
The target is identified as CS324, while search results also use CSG324 and L1CSG324 order codes. Do not infer interchangeability from the shared 324-ball family designation. Verify the exact ordering table, package code, temperature grade, speed grade, and configuration behavior in AMD documentation. After substitution, regenerate the device-specific bitstream and rerun pinout, static timing, resource, and hardware tests; even a mechanically similar package does not prove electrical compatibility.
Uyumluluk Bilgisi
The supplied excerpts identify an industrial-temperature-grade ordering code but do not contain explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements.
