XC7A75T-1CS324I - 75,520-LE Artix-7 FPGA | AMD | Industrial
MPN: XC7A75T-1CS324I ✓ Hoạt độngXC7A75T-1CS324I Tóm tắt
An FPGA is a semiconductor whose digital behavior is defined after manufacture by loading a configuration bitstream. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel processing, control logic, interfaces, and signal-processing pipelines in one integrated device. The Artix-7 family targets cost-sensitive embedded systems where programmable logic, processing throughput, and compact integration are more important than the very high performance associated with larger FPGA families.
The verified listing identifies 75,520 logic elements, a 210 mm² die, 3,870,720 embedded-memory bits, a 324-LFBGA package, and a ball-terminal package format. Other technical details—including logic-cell composition, block-RAM and DSP counts, I/O counts, transceiver quantities, voltage rails, power consumption, and performance timing—were not included in the supplied excerpts and therefore require confirmation from AMD’s complete Artix-7 documentation.
Typical uses for this device include industrial automation, motor and motion control, sensor acquisition, communications, embedded vision, test equipment, and digital signal processing. Parallel datapaths can accelerate filtering, control loops, protocol handling, and sensor fusion, while block RAM supports local buffering and DSP resources can implement fixed-point or floating-point arithmetic. A final design must still verify the exact Artix-7 resource mix, transceiver requirements, pin constraints, and timing against the selected board revision.
A critical design step is assigning every external signal to the correct 324-ball package ball and obtaining the matching package pinout file before schematic capture. Designers should also verify configuration memory connections, bank supply voltages, decoupling, clocking, transceiver usage, and thermal performance. A bitstream compiled for the exact MPN should be validated on the intended hardware before production.
This page consolidates the verified distributor identity, package information, sourcing links, comparison framework, and engineering cautions. It deliberately does not infer missing electrical or resource details, allowing engineers to distinguish confirmed facts from parameters that still require manufacturer-document review.
Bộ thay thế dễ dàng lắp đặt cho XC7A75T-1CS324I — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với XC7A75T-1CS324I (cùng hình factor và footprint) — khác nhau ở Mounting Type, Package, Speed Grade, Temperature Grade.
XC7A75T-1CSG324I
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
XC7A75T-2CSG324I
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →XC7A75T-1CSG324I
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
XC7A75T-L1CSG324I
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
XC7A75T-1CS324I
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →XC7A75T-1CS324I Tỷ lệ tối đa & tính chất điện
| Product Type | Artix-7 Field Programmable Gate Array (FPGA) IC |
| Logic Elements | 75,520 |
| Embedded Memory | 3,870,720 bits |
| Die Size | 210 mm² |
| Hộp | 324-LFBGA, CSPBGA |
| Package Family | LFBGA |
| Total Terminals | 324 balls |
| Terminal Form | Ball |
| Package Shape | Square |
| Device Family | Artix-7 |
| Speed Grade | -1 grade |
| Temperature Grade | Industrial |
| Product Category | Programmable Logic Device (CPLDs/FPGAs) |
| Kiểu lắp đặt | Surface-mount BGA |
Hướng dẫn cấu hình chân XC7A75T-1CS324I square
Cấu hình chân cho XC7A75T-1CS324I (square gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho XC7A75T-1CS324I.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
XC7A75T-1CS324I phù hợp cho 6 Áp dụngs: Industrial Automation and PLC Control, Motor Control and Motion Systems, Sensor Acquisition and Signal Fusion, Industrial and Embedded Communications, Test and Measurement Equipment, Embedded Vision and Image Processing.
Industrial Automation and PLC Control
The XC7A75T-1CS324I fits parallel industrial-control logic because its verified 75,520 logic elements can host multiple control tasks, state machines, interlocks, and communication handling in one Artix-7 FPGA. The industrial temperature-grade ordering identity is useful for equipment exposed to variable factory conditions. Place the device beside isolation and transceiver circuitry, then partition control and safety functions so timing remains deterministic. Before schematic approval, verify the exact bank voltages, available user I/O, industrial temperature limits, and CS324 pin assignments from AMD documentation; those details are not quantified in the supplied excerpts.
Được đề xuất
Motor Control and Motion Systems
The AMD XC7A75T-1CS324I is suitable for deterministic motor-control pipelines that combine current sampling, position capture, fault handling, and command generation. Its verified 75,520 logic elements provide substantial configurable logic capacity for parallel control loops, while the Artix-7 device family is associated with embedded signal processing. Use separate clocking and synchronization for control and protection paths, and keep high-current switching circuitry outside the FPGA. Exact DSP capacity, pin timing, I/O standards, and operating-temperature limits must be confirmed before claiming a specific loop rate or control resolution.
Được đề xuất
Sensor Acquisition and Signal Fusion
The XC7A75T-1CS324I can consolidate multiple sensor inputs, calibration tables, filtering, and event logic when a design benefits from parallel programmable datapaths. Its verified 3,870,720 embedded-memory bits are relevant for capture buffers and working storage, although block-RAM organization and maximum interfaces are not included in the supplied data. Engineers should map ADC, clock, trigger, and digital I/O signals directly from the CS324 package file, then implement timing constraints and calibration storage in the AMD toolchain. Verify simultaneous I/O performance and memory bandwidth during architecture exploration.
Được đề xuất
Industrial and Embedded Communications
The XC7A75T-1CS324I can implement protocol engines, packet filters, test patterns, and interface bridging in parallel programmable logic. That flexibility is useful when equipment combines industrial Ethernet, serial communication, and real-time control functions. Select transceivers according to the actual electrical layer, isolate external cabling, and constrain receive and transmit paths for the required data rate. The supplied results do not state the device's transceiver count or supported high-speed protocols, so a communications claim should not assume dedicated SerDes resources without checking the complete Artix-7 device table.
Được đề xuất
Test and Measurement Equipment
The Artix-7 FPGA architecture is suited to programmable test systems because independent logic, memory, and arithmetic blocks can execute acquisition, sequencing, pattern generation, and analysis concurrently. The XC7A75T-1CS324I provides a verified 75,520 logic elements and a compact 324-ball BGA option for advanced instruments. Engineers should reserve clocks and serial links carefully, establish deterministic triggers, and isolate analog front ends from high-speed digital return currents. Exact I/O, DSP, RAM, and timing resources must be obtained from the manufacturer data before committing to channel count, sample rate, or waveform bandwidth.
Được đề xuất
Embedded Vision and Image Processing
The XC7A75T-1CS324I can support parallel image pipelines, pixel classification, line buffering, and interface timing because Artix-7 devices combine programmable logic with embedded resources. The verified logic-element count is substantial for cost-sensitive embedded processing, but it is not a substitute for a complete resource count. Engineers must select a compatible image sensor interface, define frame and line timing, and use DDR memory only after checking the available memory interfaces and controller architecture. Validate timing closure, bandwidth, and thermal performance with the intended image format and clock frequencies.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho XC7A75T-1CS324I — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | XC7A75T-1CSG324I | XC7A75T-2CSG324I | XC7A75T-L1CSG324I |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 324-LFBGA, CSPBGA | 324-LFBGA, CSPBGA | 324-LFBGA, CSPBGA | 324-LFBGA, CSPBGA |
| Device Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Speed Designator | -1 | -1 | -2 | L1 |
| Terminals | 324 balls | 324 balls | 324 balls | 324 balls |
Bảo phân biệt quan trọng
- Exact ordering identity (vsXC7A75T-1CSG324I)
- Verified core resource basis (vsXC7A75T-L1CSG324I)
- Known die and package identity (vsXC7A75T-2CSG324I)
Ghi chú thiết kế
Use AMD’s official CS324 package pinout files as the authority for every BGA ball before releasing the schematic or PCB. The supplied results confirm that the package is a 324-LFBGA and identify the package-file resource, but they do not provide all 324 signal names. Cross-check power, ground, configuration, clock, bank-voltage, and user-I/O balls against the selected device speed and temperature ordering codes. Never copy a pinout from a different Artix-7 package.
Plan the complete power tree only after obtaining the manufacturer’s recommended operating conditions, rail tolerances, bank rules, and decoupling guidance. Separate core, auxiliary, and I/O supplies according to the actual design constraints, and account for startup sequencing and configuration behavior. These voltages and limits are marked as needed because the supplied excerpts identify the device but do not contain the electrical tables. Validate power sequencing and rail tolerance on hardware before timing sign-off.
A 324-ball BGA requires deliberate thermal and return-path planning. Estimate total FPGA dissipation from the selected design rather than treating the -1 speed grade as a fixed power value. Use the manufacturer thermal data for the actual package, board stack-up, airflow, and ambient conditions; no estimated junction temperature is supplied here. Keep high-current switching nodes away from sensitive inputs and preserve continuous ground planes beneath the BGA to minimize thermal resistance and return-path discontinuities.
The target is identified as CS324, while search results also use CSG324 and L1CSG324 order codes. Do not infer interchangeability from the shared 324-ball family designation. Verify the exact ordering table, package code, temperature grade, speed grade, and configuration behavior in AMD documentation. After substitution, regenerate the device-specific bitstream and rerun pinout, static timing, resource, and hardware tests; even a mechanically similar package does not prove electrical compatibility.
Thông tin tuân thủ
The supplied excerpts identify an industrial-temperature-grade ordering code but do not contain explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements.
