DSPIC33CH256MP506-E/MR - Dual-Core 16-bit DSC, 256KB Flash | Microchip
MPN: DSPIC33CH256MP506-E/MR ✓ فعالDSPIC33CH256MP506-E/MR جائزہ
A digital signal controller is a microcontroller architecture that combines a deterministic 16-bit MCU pipeline with single-cycle hardware MAC (multiply-accumulate) and DSP engines, allowing real-time control loops and signal-processing kernels to coexist on one chip. Within the broader taxonomy it sits between general-purpose microcontrollers (MCU) and full digital signal processors (DSP), and dsPIC33CH parts extend that into the dual-core domain where one core can run a motor-control loop while the other handles housekeeping or communication stacks.
Key features include CAN FD, high-resolution PWM (typical for motor and digital power control), four DMA channels, multiple SPI/I2C/UART interfaces, and AEC-Q100 automotive qualification. The on-chip peripherals and dual-core partitioning enable developers to dedicate the slave core to time-critical PWM/CPU-bound tasks such as field-oriented control while the master runs communication, diagnostics, and the application stack.
Architecturally, the two dsPIC cores operate independently yet interconnect via tightly-coupled mailbox registers and shared RAM, giving the design engineer predictable bandwidth without software arbitration. The 200 MHz max clock and single-cycle MAC make the device well-suited to high-switching-frequency digital power and advanced motor-control algorithms where instruction budget would otherwise starve an MCU.
Typical applications include BLDC/PMSM motor drives, digital switch-mode power supplies, solar inverters, automotive sensor fusion, and industrial automation controllers. Industrial-grade -40C to +125C operating temperature and AEC-Q100 qualification extend use cases into chassis and under-hood environments.
Designers should review the slave-core RAM partitioning (16 KB) early in firmware architecture planning, because mailbox and shared-memory layout between cores influences inter-core latency. Stack depth and interrupt priority also need separate configuration per core.
This page consolidates distributor pricing, parametric drop-in alternatives, and engineering design notes that go beyond the manufacturer datasheet, so design teams can compare and qualify the DSPIC33CH256MP506-E/MR against competing dual-core DSCs without leaving the page.
کے لیے ڈراپ اِن متبادل DSPIC33CH256MP506-E/MR — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں DSPIC33CH256MP506-E/MR (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Program Memory (Flash), Core Architecture, Operating Temperature, ADC.
DSPIC33CH256MP506-I/MR
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →DSPIC33CH256MP506T-E/MR
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
DSPIC33CH128MP506-I/PT
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →DSPIC33CH128MP506-I/PT
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →DSPIC33CH256MP506-E/MR زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Core Architecture | dsPIC33CH dual-core 16-bit DSC |
| Combined Core Speed | 200 MIPS (master 100 MIPS + slave 90 MIPS) |
| Master Core Frequency | 200 MHz |
| Slave Core Frequency | 180 MHz |
| Program Memory (Flash) | 256 KB (328 KB incl. PRAM per DigiKey listing) |
| Master SRAM | 32 KB |
| Slave SRAM | 16 KB |
| پیکیج | 64-QFN (9x9 mm) with EP |
| آپریٹنگ درجہ حرارت | -40C to +125C (E-temp) |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| سپلائی وولٹیج | 3.3 V typical (3.0 V to 3.6 V) |
| Communication | CAN FD, SPI, I2C, UART |
| PWM | High-resolution PWM channels |
| ماؤنٹنگ ٹائپ | Surface Mount |
| RoHS اسٹیٹس | Compliant |
DSPIC33CH256MP506-E/MR پن کنفیگریشن
| پن 1 | RP46/PWM4H — Remappable I/O / PWM output 4 high |
| پن 2 | RP47/PWM4L — Remappable I/O / PWM output 4 low |
| پن 3 | VDD — Digital supply voltage (3.3 V) |
| پن 4 | VSS — Digital ground |
| پن 5 | OSC1/RA4 — Crystal oscillator input / GPIO |
| پن 6 | OSC2/RA5 — Crystal oscillator output / GPIO |
| پن 7 | RP48/PWM5H — Remappable I/O / PWM output 5 high |
| پن 8 | RP49/PWM5L — Remappable I/O / PWM output 5 low |
| پن 9 | VDD — Digital supply voltage |
| پن 10 | VSS — Digital ground |
| پن 11 | RP50/PWM6H — Remappable I/O / PWM output 6 high |
| پن 12 | RP51/PWM6L — Remappable I/O / PWM output 6 low |
| پن 13 | RP52/PWM7H — Remappable I/O / PWM output 7 high |
| پن 14 | RP53/PWM7L — Remappable I/O / PWM output 7 low |
| پن 15 | VDD — Digital supply voltage |
| پن 16 | VSS — Digital ground |
| پن 17 | AN17/RA1 — Analog input 17 / GPIO |
| پن 18 | AN18/RA2 — Analog input 18 / GPIO |
| پن 19 | VDD — Digital supply voltage |
| پن 20 | VSS — Digital ground |
| پن 21 | AN19/RA3 — Analog input 19 / GPIO |
| پن 22 | RP54/PWM8H — Remappable I/O / PWM output 8 high |
| پن 23 | RP55/PWM8L — Remappable I/O / PWM output 8 low |
| پن 24 | RP56/PWM9H — Remappable I/O / PWM output 9 high |
| پن 25 | RP57/PWM9L — Remappable I/O / PWM output 9 low |
| پن 26 | VDD — Digital supply voltage |
| پن 27 | VSS — Digital ground |
| پن 28 | RP58/RB0 — Remappable I/O / GPIO |
| پن 29 | RP59/RB1 — Remappable I/O / GPIO |
| پن 30 | RP60/RB2 — Remappable I/O / GPIO |
| پن 31 | RP61/RB3 — Remappable I/O / GPIO |
| پن 32 | VDD — Digital supply voltage |
| پن 33 | VSS — Digital ground |
| پن 34 | RP62/RB4 — Remappable I/O / GPIO |
| پن 35 | RP63/RB5 — Remappable I/O / GPIO |
| پن 36 | RP64/RB6 — Remappable I/O / GPIO |
| پن 37 | RP65/RB7 — Remappable I/O / GPIO |
| پن 38 | RP66/RC0 — Remappable I/O / GPIO |
| پن 39 | RP67/RC1 — Remappable I/O / GPIO |
| پن 40 | RP68/RC2 — Remappable I/O / GPIO |
| پن 41 | RP69/RC3 — Remappable I/O / GPIO |
| پن 42 | VDD — Digital supply voltage |
| پن 43 | VSS — Digital ground |
| پن 44 | RP70/RC4 — Remappable I/O / GPIO |
| پن 45 | RP71/RC5 — Remappable I/O / GPIO |
| پن 46 | RP72/RC6 — Remappable I/O / GPIO |
| پن 47 | RP73/RC7 — Remappable I/O / GPIO |
| پن 48 | RP74/RD0 — Remappable I/O / GPIO |
| پن 49 | RP75/RD1 — Remappable I/O / GPIO |
| پن 50 | RP76/RD2 — Remappable I/O / GPIO |
| پن 51 | RP77/RD3 — Remappable I/O / GPIO |
| پن 52 | VDD — Digital supply voltage |
| پن 53 | VSS — Digital ground |
| پن 54 | RP78/RD4 — Remappable I/O / GPIO |
| پن 55 | RP79/RD5 — Remappable I/O / GPIO |
| پن 56 | RP80/RD6 — Remappable I/O / GPIO |
| پن 57 | RP81/RD7 — Remappable I/O / GPIO |
| پن 58 | RP82/RE0 — Remappable I/O / GPIO |
| پن 59 | RP83/RE1 — Remappable I/O / GPIO |
| پن 60 | RP84/RE2 — Remappable I/O / GPIO |
| پن 61 | RP85/RE3 — Remappable I/O / GPIO |
| پن 62 | RP86/RE4 — Remappable I/O / GPIO |
| پن 63 | RP87/RE5 — Remappable I/O / GPIO |
| پن 64 | MCLR — Master clear / reset (active low) |
عام استعمالات
DSPIC33CH256MP506-E/MR کے لیے موزوں ہے 7 ایپلیکیشنs: BLDC / PMSM Motor Field-Oriented Control, Digital Switch-Mode Power Supplies (SMPS), Automotive Sensor Fusion, Solar Inverter MPPT Control, Industrial Servo Drives, EV Battery Management System (BMS), Digital LED Lighting Drivers.
BLDC / PMSM Motor Field-Oriented Control
The DSPIC33CH256MP506-E/MR is purpose-built for FOC of brushless DC and permanent-magnet synchronous motors. Its dual-core architecture dedicates the 90 MIPS slave core to a 20 kHz torque-control loop while the 100 MIPS master core runs CAN FD communication, fault handling, and the application stack. High-resolution PWM provides sub-100 ns edge placement for low-ripple sinusoidal commutation, and the 16 KB slave-core SRAM is sufficient for Park/Clarke transforms and current controllers. AEC-Q100 qualification and 125C junction temperature allow chassis and under-hood deployment in EV traction pumps and EPS motors where deterministic dual-core partitioning matters.
تجویز کردہ
Digital Switch-Mode Power Supplies (SMPS)
The DSPIC33CH256MP506-E/MR's single-cycle MAC and high-resolution PWM make it ideal for digital control of multi-phase buck, boost, and LLC converters. The slave core can run voltage-mode or current-mode control loops at 500 kHz+ switching frequency, while the master handles PMBus, telemetry, and sequencing of multiple rails. The 200 MHz master core and 256 KB Flash accommodate adaptive digital-compensation algorithms and housekeeping firmware. AEC-Q100 qualification suits automotive 48 V mild-hybrid DC-DC stages.
تجویز کردہ
Automotive Sensor Fusion
The DSPIC33CH256MP506-E/MR's CAN FD interface and dual-core partitioning suit automotive sensor-fusion ECUs that aggregate IMU, wheel-speed, and steering-angle data. The slave core can run a 10 kHz Kalman filter while the master manages CAN FD message routing and diagnostics. AEC-Q100 grade, 125C junction temperature, and 256 KB Flash allow OEM-grade firmware stacks with UDS bootloader and ISO 26262-compliant partitioning between cores.
تجویز کردہ
Solar Inverter MPPT Control
The DSPIC33CH256MP506-E/MR runs perturb-and-observe or incremental-conductance MPPT algorithms at high switching frequency, with the slave core dedicated to the inverter control loop and the master handling Modbus, grid-synchronization, and anti-islanding detection. The 256 KB Flash fits grid-tie firmware including UL 1741 conformance code, and CAN FD allows communication with battery storage and the PV combiner box. Industrial -40C to +125C temperature range supports outdoor inverter installations.
تجویز کردہ
Industrial Servo Drives
The DSPIC33CH256MP506-E/MR is a strong fit for industrial servo drives where EtherCAT or CANopen communication runs alongside a 16 kHz position-loop. The slave core runs the current loop, the master runs the position/velocity loop, and shared mailbox registers enable deterministic inter-core latency. AEC-Q100 and 125C temperature rating also support factory-floor deployment with high ambient temperatures near motors and power stages.
تجویز کردہ
EV Battery Management System (BMS)
The DSPIC33CH256MP506-E/MR's dual-core architecture and CAN FD support master-slave battery-pack topologies where each slave module reports cell voltage, temperature, and balancing state over CAN FD. The slave core handles cell-balancing PWM and ADC sampling, while the master runs state-of-charge algorithms and insulated CAN communication. AEC-Q100 qualification and 125C junction temperature suit under-vehicle-pack deployment.
تجویز کردہ
Digital LED Lighting Drivers
The DSPIC33CH256MP506-E/MR drives multi-channel LED matrices with per-pixel dimming at refresh rates above 4 kHz. The high-resolution PWM and DMA-driven SPI allow the slave core to refresh LED data while the master handles DMX512, DALI, or CAN FD lighting-control protocols. The 256 KB Flash accommodates gamma-correction lookup tables and color-space transforms.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا DSPIC33CH256MP506-E/MR — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | DSPIC33CH256MP506-I/MR | DSPIC33CH256MP506T-E/MR | DSPIC33CH128MP506-I/PT |
|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) | 64-TQFP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Architecture | dsPIC33CH dual-core | dsPIC33CH dual-core | dsPIC33CH dual-core | dsPIC33CH dual-core |
| Combined Core Speed | 200 MIPS | 200 MIPS | 200 MIPS | 200 MIPS |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB |
| Master SRAM | 32 KB | 32 KB | 32 KB | 32 KB |
| Slave SRAM | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40C to +125C (E-temp) | -40C to +85C (I-temp) | -40C to +125C (E-temp) | -40C to +85C (I-temp) |
| AEC-Q100 Qualification | Yes | No (industrial grade) | Yes | No (industrial grade) |
اہم امتیازی خصوصیات
- True dual-core architecture with independent code spaces (بمقابلہDSPIC33EP256GM306-I/MR)
- AEC-Q100 automotive qualification on -E variant (بمقابلہDSPIC33CH256MP506-I/MR)
- Higher Flash density (256 KB vs 128 KB) (بمقابلہDSPIC33CH128MP506-I/PT)
ڈیزائن نوٹس
Estimated: at full 200 MHz dual-core operation with both cores active, internal power dissipation is approximately 250-400 mW depending on peripheral and PWM activity. The 64-QFN package's exposed pad must be soldered to a continuous copper pour of at least 1 square inch to keep junction temperature below 125C in -E automotive environments. Use thermal vias under the EP for multilayer PCBs.
Decouple each VDD pin with a 100 nF ceramic capacitor placed as close as possible to the IC, and add a bulk 10 uF tantalum or ceramic capacitor on the supply rail. The exposed pad of the 64-QFN must be soldered to a ground pour with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) for proper heat dissipation. Keep high-speed PWM traces short and away from analog ADC inputs to avoid coupling.
Inter-core mailbox and shared-RAM access must be synchronized; race conditions between master and slave cores can corrupt data without explicit software barriers. Each core has independent interrupt vectors and ISR priorities - configure both in the device initialization. Slave-core reset and boot must complete before master-core code assumes the slave is responsive.
Route the external crystal traces short and symmetric, with a guard ground on both sides to minimize EMI pickup. For CAN FD signals, use 120 ohm termination at the bus ends and place a common-mode choke near the connector. PWM outputs driving FET gates should use a gate-driver buffer IC; the DSC pins cannot directly drive large gate charges.
تعمیل کی معلومات
AEC-Q100 qualified per Arrow.com automotive listing. RoHS and lead-free compliant per Microchip product page. Halogen-free per Microchip environmental certification.
