DSPIC33CH256MP506-E/MR - Dual-Core 16-bit DSC, 256KB Flash | Microchip
MPN: DSPIC33CH256MP506-E/MR ✓ Hoạt độngDSPIC33CH256MP506-E/MR Tóm tắt
A digital signal controller is a microcontroller architecture that combines a deterministic 16-bit MCU pipeline with single-cycle hardware MAC (multiply-accumulate) and DSP engines, allowing real-time control loops and signal-processing kernels to coexist on one chip. Within the broader taxonomy it sits between general-purpose microcontrollers (MCU) and full digital signal processors (DSP), and dsPIC33CH parts extend that into the dual-core domain where one core can run a motor-control loop while the other handles housekeeping or communication stacks.
Key features include CAN FD, high-resolution PWM (typical for motor and digital power control), four DMA channels, multiple SPI/I2C/UART interfaces, and AEC-Q100 automotive qualification. The on-chip peripherals and dual-core partitioning enable developers to dedicate the slave core to time-critical PWM/CPU-bound tasks such as field-oriented control while the master runs communication, diagnostics, and the application stack.
Architecturally, the two dsPIC cores operate independently yet interconnect via tightly-coupled mailbox registers and shared RAM, giving the design engineer predictable bandwidth without software arbitration. The 200 MHz max clock and single-cycle MAC make the device well-suited to high-switching-frequency digital power and advanced motor-control algorithms where instruction budget would otherwise starve an MCU.
Typical applications include BLDC/PMSM motor drives, digital switch-mode power supplies, solar inverters, automotive sensor fusion, and industrial automation controllers. Industrial-grade -40C to +125C operating temperature and AEC-Q100 qualification extend use cases into chassis and under-hood environments.
Designers should review the slave-core RAM partitioning (16 KB) early in firmware architecture planning, because mailbox and shared-memory layout between cores influences inter-core latency. Stack depth and interrupt priority also need separate configuration per core.
This page consolidates distributor pricing, parametric drop-in alternatives, and engineering design notes that go beyond the manufacturer datasheet, so design teams can compare and qualify the DSPIC33CH256MP506-E/MR against competing dual-core DSCs without leaving the page.
Bộ thay thế dễ dàng lắp đặt cho DSPIC33CH256MP506-E/MR — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với DSPIC33CH256MP506-E/MR (cùng hình factor và footprint) — khác nhau ở Package, Program Memory (Flash), Core Architecture, Operating Temperature, ADC.
DSPIC33CH256MP506-I/MR
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →DSPIC33CH256MP506T-E/MR
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
DSPIC33CH128MP506-I/PT
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →DSPIC33CH128MP506-I/PT
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →DSPIC33CH256MP506-E/MR Tỷ lệ tối đa & tính chất điện
| Core Architecture | dsPIC33CH dual-core 16-bit DSC |
| Combined Core Speed | 200 MIPS (master 100 MIPS + slave 90 MIPS) |
| Master Core Frequency | 200 MHz |
| Slave Core Frequency | 180 MHz |
| Program Memory (Flash) | 256 KB (328 KB incl. PRAM per DigiKey listing) |
| Master SRAM | 32 KB |
| Slave SRAM | 16 KB |
| Hộp | 64-QFN (9x9 mm) with EP |
| Nhiệt độ hoạt động | -40C to +125C (E-temp) |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| Điện áp cung cấp | 3.3 V typical (3.0 V to 3.6 V) |
| Communication | CAN FD, SPI, I2C, UART |
| PWM | High-resolution PWM channels |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
Cấu hình chân DSPIC33CH256MP506-E/MR
| Chân 1 | RP46/PWM4H — Remappable I/O / PWM output 4 high |
| Chân 2 | RP47/PWM4L — Remappable I/O / PWM output 4 low |
| Chân 3 | VDD — Digital supply voltage (3.3 V) |
| Chân 4 | VSS — Digital ground |
| Chân 5 | OSC1/RA4 — Crystal oscillator input / GPIO |
| Chân 6 | OSC2/RA5 — Crystal oscillator output / GPIO |
| Chân 7 | RP48/PWM5H — Remappable I/O / PWM output 5 high |
| Chân 8 | RP49/PWM5L — Remappable I/O / PWM output 5 low |
| Chân 9 | VDD — Digital supply voltage |
| Chân 10 | VSS — Digital ground |
| Chân 11 | RP50/PWM6H — Remappable I/O / PWM output 6 high |
| Chân 12 | RP51/PWM6L — Remappable I/O / PWM output 6 low |
| Chân 13 | RP52/PWM7H — Remappable I/O / PWM output 7 high |
| Chân 14 | RP53/PWM7L — Remappable I/O / PWM output 7 low |
| Chân 15 | VDD — Digital supply voltage |
| Chân 16 | VSS — Digital ground |
| Chân 17 | AN17/RA1 — Analog input 17 / GPIO |
| Chân 18 | AN18/RA2 — Analog input 18 / GPIO |
| Chân 19 | VDD — Digital supply voltage |
| Chân 20 | VSS — Digital ground |
| Chân 21 | AN19/RA3 — Analog input 19 / GPIO |
| Chân 22 | RP54/PWM8H — Remappable I/O / PWM output 8 high |
| Chân 23 | RP55/PWM8L — Remappable I/O / PWM output 8 low |
| Chân 24 | RP56/PWM9H — Remappable I/O / PWM output 9 high |
| Chân 25 | RP57/PWM9L — Remappable I/O / PWM output 9 low |
| Chân 26 | VDD — Digital supply voltage |
| Chân 27 | VSS — Digital ground |
| Chân 28 | RP58/RB0 — Remappable I/O / GPIO |
| Chân 29 | RP59/RB1 — Remappable I/O / GPIO |
| Chân 30 | RP60/RB2 — Remappable I/O / GPIO |
| Chân 31 | RP61/RB3 — Remappable I/O / GPIO |
| Chân 32 | VDD — Digital supply voltage |
| Chân 33 | VSS — Digital ground |
| Chân 34 | RP62/RB4 — Remappable I/O / GPIO |
| Chân 35 | RP63/RB5 — Remappable I/O / GPIO |
| Chân 36 | RP64/RB6 — Remappable I/O / GPIO |
| Chân 37 | RP65/RB7 — Remappable I/O / GPIO |
| Chân 38 | RP66/RC0 — Remappable I/O / GPIO |
| Chân 39 | RP67/RC1 — Remappable I/O / GPIO |
| Chân 40 | RP68/RC2 — Remappable I/O / GPIO |
| Chân 41 | RP69/RC3 — Remappable I/O / GPIO |
| Chân 42 | VDD — Digital supply voltage |
| Chân 43 | VSS — Digital ground |
| Chân 44 | RP70/RC4 — Remappable I/O / GPIO |
| Chân 45 | RP71/RC5 — Remappable I/O / GPIO |
| Chân 46 | RP72/RC6 — Remappable I/O / GPIO |
| Chân 47 | RP73/RC7 — Remappable I/O / GPIO |
| Chân 48 | RP74/RD0 — Remappable I/O / GPIO |
| Chân 49 | RP75/RD1 — Remappable I/O / GPIO |
| Chân 50 | RP76/RD2 — Remappable I/O / GPIO |
| Chân 51 | RP77/RD3 — Remappable I/O / GPIO |
| Chân 52 | VDD — Digital supply voltage |
| Chân 53 | VSS — Digital ground |
| Chân 54 | RP78/RD4 — Remappable I/O / GPIO |
| Chân 55 | RP79/RD5 — Remappable I/O / GPIO |
| Chân 56 | RP80/RD6 — Remappable I/O / GPIO |
| Chân 57 | RP81/RD7 — Remappable I/O / GPIO |
| Chân 58 | RP82/RE0 — Remappable I/O / GPIO |
| Chân 59 | RP83/RE1 — Remappable I/O / GPIO |
| Chân 60 | RP84/RE2 — Remappable I/O / GPIO |
| Chân 61 | RP85/RE3 — Remappable I/O / GPIO |
| Chân 62 | RP86/RE4 — Remappable I/O / GPIO |
| Chân 63 | RP87/RE5 — Remappable I/O / GPIO |
| Chân 64 | MCLR — Master clear / reset (active low) |
Ứng dụng tiêu biểu
DSPIC33CH256MP506-E/MR phù hợp cho 7 Áp dụngs: BLDC / PMSM Motor Field-Oriented Control, Digital Switch-Mode Power Supplies (SMPS), Automotive Sensor Fusion, Solar Inverter MPPT Control, Industrial Servo Drives, EV Battery Management System (BMS), Digital LED Lighting Drivers.
BLDC / PMSM Motor Field-Oriented Control
The DSPIC33CH256MP506-E/MR is purpose-built for FOC of brushless DC and permanent-magnet synchronous motors. Its dual-core architecture dedicates the 90 MIPS slave core to a 20 kHz torque-control loop while the 100 MIPS master core runs CAN FD communication, fault handling, and the application stack. High-resolution PWM provides sub-100 ns edge placement for low-ripple sinusoidal commutation, and the 16 KB slave-core SRAM is sufficient for Park/Clarke transforms and current controllers. AEC-Q100 qualification and 125C junction temperature allow chassis and under-hood deployment in EV traction pumps and EPS motors where deterministic dual-core partitioning matters.
Được đề xuất
Digital Switch-Mode Power Supplies (SMPS)
The DSPIC33CH256MP506-E/MR's single-cycle MAC and high-resolution PWM make it ideal for digital control of multi-phase buck, boost, and LLC converters. The slave core can run voltage-mode or current-mode control loops at 500 kHz+ switching frequency, while the master handles PMBus, telemetry, and sequencing of multiple rails. The 200 MHz master core and 256 KB Flash accommodate adaptive digital-compensation algorithms and housekeeping firmware. AEC-Q100 qualification suits automotive 48 V mild-hybrid DC-DC stages.
Được đề xuất
Automotive Sensor Fusion
The DSPIC33CH256MP506-E/MR's CAN FD interface and dual-core partitioning suit automotive sensor-fusion ECUs that aggregate IMU, wheel-speed, and steering-angle data. The slave core can run a 10 kHz Kalman filter while the master manages CAN FD message routing and diagnostics. AEC-Q100 grade, 125C junction temperature, and 256 KB Flash allow OEM-grade firmware stacks with UDS bootloader and ISO 26262-compliant partitioning between cores.
Được đề xuất
Solar Inverter MPPT Control
The DSPIC33CH256MP506-E/MR runs perturb-and-observe or incremental-conductance MPPT algorithms at high switching frequency, with the slave core dedicated to the inverter control loop and the master handling Modbus, grid-synchronization, and anti-islanding detection. The 256 KB Flash fits grid-tie firmware including UL 1741 conformance code, and CAN FD allows communication with battery storage and the PV combiner box. Industrial -40C to +125C temperature range supports outdoor inverter installations.
Được đề xuất
Industrial Servo Drives
The DSPIC33CH256MP506-E/MR is a strong fit for industrial servo drives where EtherCAT or CANopen communication runs alongside a 16 kHz position-loop. The slave core runs the current loop, the master runs the position/velocity loop, and shared mailbox registers enable deterministic inter-core latency. AEC-Q100 and 125C temperature rating also support factory-floor deployment with high ambient temperatures near motors and power stages.
Được đề xuất
EV Battery Management System (BMS)
The DSPIC33CH256MP506-E/MR's dual-core architecture and CAN FD support master-slave battery-pack topologies where each slave module reports cell voltage, temperature, and balancing state over CAN FD. The slave core handles cell-balancing PWM and ADC sampling, while the master runs state-of-charge algorithms and insulated CAN communication. AEC-Q100 qualification and 125C junction temperature suit under-vehicle-pack deployment.
Được đề xuất
Digital LED Lighting Drivers
The DSPIC33CH256MP506-E/MR drives multi-channel LED matrices with per-pixel dimming at refresh rates above 4 kHz. The high-resolution PWM and DMA-driven SPI allow the slave core to refresh LED data while the master handles DMX512, DALI, or CAN FD lighting-control protocols. The 256 KB Flash accommodates gamma-correction lookup tables and color-space transforms.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho DSPIC33CH256MP506-E/MR — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | DSPIC33CH256MP506-I/MR | DSPIC33CH256MP506T-E/MR | DSPIC33CH128MP506-I/PT |
|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) | 64-TQFP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Architecture | dsPIC33CH dual-core | dsPIC33CH dual-core | dsPIC33CH dual-core | dsPIC33CH dual-core |
| Combined Core Speed | 200 MIPS | 200 MIPS | 200 MIPS | 200 MIPS |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB |
| Master SRAM | 32 KB | 32 KB | 32 KB | 32 KB |
| Slave SRAM | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40C to +125C (E-temp) | -40C to +85C (I-temp) | -40C to +125C (E-temp) | -40C to +85C (I-temp) |
| AEC-Q100 Qualification | Yes | No (industrial grade) | Yes | No (industrial grade) |
Bảo phân biệt quan trọng
- True dual-core architecture with independent code spaces (vsDSPIC33EP256GM306-I/MR)
- AEC-Q100 automotive qualification on -E variant (vsDSPIC33CH256MP506-I/MR)
- Higher Flash density (256 KB vs 128 KB) (vsDSPIC33CH128MP506-I/PT)
Ghi chú thiết kế
Estimated: at full 200 MHz dual-core operation with both cores active, internal power dissipation is approximately 250-400 mW depending on peripheral and PWM activity. The 64-QFN package's exposed pad must be soldered to a continuous copper pour of at least 1 square inch to keep junction temperature below 125C in -E automotive environments. Use thermal vias under the EP for multilayer PCBs.
Decouple each VDD pin with a 100 nF ceramic capacitor placed as close as possible to the IC, and add a bulk 10 uF tantalum or ceramic capacitor on the supply rail. The exposed pad of the 64-QFN must be soldered to a ground pour with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) for proper heat dissipation. Keep high-speed PWM traces short and away from analog ADC inputs to avoid coupling.
Inter-core mailbox and shared-RAM access must be synchronized; race conditions between master and slave cores can corrupt data without explicit software barriers. Each core has independent interrupt vectors and ISR priorities - configure both in the device initialization. Slave-core reset and boot must complete before master-core code assumes the slave is responsive.
Route the external crystal traces short and symmetric, with a guard ground on both sides to minimize EMI pickup. For CAN FD signals, use 120 ohm termination at the bus ends and place a common-mode choke near the connector. PWM outputs driving FET gates should use a gate-driver buffer IC; the DSC pins cannot directly drive large gate charges.
Thông tin tuân thủ
AEC-Q100 qualified per Arrow.com automotive listing. RoHS and lead-free compliant per Microchip product page. Halogen-free per Microchip environmental certification.
