Altera

EP1SGX25F - Stratix GX FPGA, 25,660 LEs, 20 GXB, 672-FBGA | Altera

MPN: EP1SGX25F ✗ اختتامِ زندگی
FineLine BGA (672-ball variant exists) Package Multiple (commercial and industrial) Speed 1,944,576 Memory
MOQ: 1 |

EP1SGX25F جائزہ

The Altera EP1SGX25F is a member of the Stratix GX FPGA family that combines high-speed serial transceivers with a scalable, high-performance logic array. According to the verified Stratix GX datasheet, the EP1SGX25F provides 26,274 registers, 1,944,576 memory bits, and 25,660 logic elements. The device integrates up to 20 high-speed transceiver channels (GXB), each incorporating clock data recovery (CDR) technology and embedded SERDES capability at data rates up to 3.1875 gigabits per second (Gbps). It is offered in space-saving FineLine BGA packages.

A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reprogrammed after manufacturing to implement custom digital logic functions. Stratix GX belongs to the broader taxonomy: FPGA -> Programmable Logic Device (PLD) -> Logic IC -> Integrated Circuit. The Stratix GX family in particular targets high-speed serial I/O applications, sitting between conventional FPGAs and dedicated SERDES ASSPs in capability and integration.

Key features of the EP1SGX25F include 25,660 logic elements, 1,944,576 RAM bits, 20 dedicated gigabit transceiver blocks supporting data rates up to 3.1875 Gbps per channel, and embedded CDR circuitry. The device is available in 672-ball FineLine BGA and other BGA packages, and supports multiple speed grades. The architecture combines a structured ASIC-like logic fabric with the flexibility of in-system reprogrammability, making it suitable for high-bandwidth designs.

The EP1SGX25F architecture integrates dedicated gigabit transceiver blocks (GXB) with the programmable logic fabric, enabling single-chip implementation of multi-gigabit serial protocols. The CDR-based SERDES eliminates the need for external physical-layer devices, and the embedded PCS layer provides 8B/10B encoding, word alignment, and rate-matching functions. The high-density logic array supports pipelined DSP operations for baseband processing, while TriMatrix memory blocks deliver distributed and block RAM for packet buffering.

Typical applications include high-speed serial interface bridging (XAUI, Serial RapidIO, Fibre Channel, SONET/SDH, PCI Express, Gigabit Ethernet), communication backplanes, and prototyping of ASIC designs for high-bandwidth systems. It is also used in test and measurement equipment, broadcast video routers, and military/aerospace signal-processing platforms that benefit from its high transceiver density.

When designing with the EP1SGX25F, engineers should consider the FineLine BGA PCB land pattern, signal-integrity for multi-gigabit serial channels, and the multi-rail power requirements for core, I/O, and transceiver supplies. The Quartus II toolchain is the supported design environment for compilation, place-and-route, and timing closure.

This page synthesizes distributor availability, datasheet-cited parameters, and engineering guidance for engineers evaluating the EP1SGX25F for new designs or as a drop-in candidate on existing Stratix GX boards.

کے لیے ڈراپ اِن متبادل EP1SGX25F — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔

اس سیریز میں مختلف ورژن

اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP1SGX25F (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Core Supply Voltage, Operating Temperature, RoHS Status, Family.

Intel
Package: 672-BBGA (FBGA-672), 27 x 27 mm, 1.0 mm pitch
Core Supply Voltage: 1.5 V
Operating Temperature: 0 C to 85 C (commercial)
موازنہ کریں EP1SGX25F →
Intel
Package: 672-ball FBGA (27 x 27 mm, 1 mm pitch)
Core Supply Voltage: 1.425 V to 1.575 V (1.5 V typical)
RoHS Status: Compliant (lead-free FBGA)
موازنہ کریں EP1SGX25F →
Intel
Core Supply Voltage: 1.5 V (1.425 V min, 1.575 V max)
Operating Temperature: 0 °C to +85 °C (commercial)
RoHS Status: Lead-free per datasheet
موازنہ کریں EP1SGX25F →
Intel
Package: FBGA-672 (FC-FBGA), 33 x 33 mm, 1.0 mm pitch
Core Supply Voltage: 1.5 V
Operating Temperature: 0C to 85C (commercial)
موازنہ کریں EP1SGX25F →
Intel
Package: 672-FBGA (27 × 27 mm, 1.0 mm pitch)
Core Supply Voltage: 1.425 V to 1.575 V (1.5 V nominal)
Operating Temperature: 0 °C to +85 °C (Commercial)
موازنہ کریں EP1SGX25F →
Intel
Package: 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch
Operating Temperature: 0 °C to 85 °C (industrial)
موازنہ کریں EP1SGX25F →

EP1SGX25DF672C7

✅ ڈراپ-اِن
Intel
📦 672-FBGA
Stratix GX · Stratix GX · 25,660 · 2,566 · 1,944,576 · 455 · 14 · Yes (GX family)

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP1SGX25DF672I7N

✅ ڈراپ-اِن
Intel
📦 672-FBGA
Stratix GX · 25,660 · 2,566 · 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) · 9.48 ns max · 130 nm CMOS · 4 · 500 Mbps to 3.1875 Gbps per channel

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP1SGX25CF672I6

✅ ڈراپ-اِن
Intel
📦 672-FBGA
Stratix GX · 25,660 · 2,566 · 1,944,576 · 455 · 1.425 V to 1.575 V (1.5 V typical) · 130 nm CMOS · Up to 5000 MHz

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP1SGX25CF672C6

✅ ڈراپ-اِن
Intel
📦 672-FBGA
Stratix GX · 25660 · 2852 LABs · 455 · 1944576 · 4 to 20 (SERDES up to 3.1875 Gbps) · 130 nm CMOS · 1.5 V

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP1SGX25DF672C6N

✅ ڈراپ-اِن
Intel
📦 672-FBGA
Stratix GX · Stratix GX (Stratix I GX) · 25,660 · 2,566 · 455 · 1.5 V · 130 nm CMOS · CMOS

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP1SGX25DF1020C6

✅ ڈراپ-اِن
Intel
📦 1020-FBGA
Stratix GX · 25,660 · 2,566 · 1,944,576 · 607 (614 user pins per datasheet) · 1.5 V (1.425 V min, 1.575 V max) · 0 °C to +85 °C (commercial) · 1020-BBGA / FC-FBGA

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP1SGX25F زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات

Family Stratix GX
Logic Elements 25,660
Registers 26,274
Total Memory Bits 1,944,576
Maximum GXB Transceiver Channels 20
Maximum Data Rate per Channel 3.1875 Gbps
CDR / Embedded SERDES Yes (per channel)
پیکیج FineLine BGA (672-ball variant exists)
Speed Grades Multiple (commercial and industrial)
ماؤنٹنگ ٹائپ Surface Mount
Design Tool Quartus II

EP1SGX25F fineline bga (672-ball variant exists) پن کنفیگریشن گائیڈ

EP1SGX25F (fineline bga (672-ball variant exists) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔

EP1SGX25F کے لیے fineline bga (672-ball variant exists) پیکیج پن آؤٹ ڈایاگرام

کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP1SGX25F.

رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔

عام استعمالات

EP1SGX25F کے لیے موزوں ہے 7 ایپلیکیشنs: Multi-Gigabit Serial Protocol Bridging, Communication Backplane Aggregation, Test and Measurement Instrumentation, Broadcast Video Routing, ASIC Prototyping for High-Bandwidth Designs, Industrial High-Speed Control Systems, Aerospace and Defense Signal Processing.

🌐

Multi-Gigabit Serial Protocol Bridging

The EP1SGX25F is well suited to bridge between multi-gigabit serial protocols such as XAUI (3.125 Gbps), Serial RapidIO, Fibre Channel, SONET/SDH OC-48, and PCI Express. With up to 20 GXB transceiver channels at 3.1875 Gbps and an embedded PCS layer providing 8B/10B encoding and word alignment, a single EP1SGX25F can implement multi-port protocol bridges without external SERDES. The 25,660 logic elements and 1.944 Mbits of embedded memory support framing, rate-matching FIFOs, and protocol state machines. Place the EP1SGX25F on a board with controlled-impedance differential routing and a low-jitter reference clock for CDR lock.

🌐

Communication Backplane Aggregation

In communication backplanes, the EP1SGX25F aggregates multiple serial links into a higher-bandwidth fabric. Its 20 GXB channels at 3.1875 Gbps deliver up to ~63.75 Gbps of aggregate serial bandwidth, sufficient for mid-range backplane switches and base-station controllers. The 25,660 logic elements support packet queuing and traffic shaping, while the 1.944 Mbits of TriMatrix memory absorb bursts. The 672-ball FineLine BGA package keeps the device footprint compact for line-card designs. Use proper multi-rail decoupling for core, I/O, and transceiver supplies per Altera's Stratix GX hardware design guidelines.

🔧

Test and Measurement Instrumentation

The EP1SGX25F is suitable for test and measurement instruments that require multi-channel high-speed serial I/O such as protocol analyzers, BERT (bit-error-rate tester) platforms, and logic-analyzer backends. The 20 embedded CDR-equipped SERDES channels eliminate external PHY complexity, simplifying test fixture design. The 25,660 logic elements and 1.944 Mbits of RAM support deep capture buffers and real-time protocol decoding. The Quartus II toolchain provides hardware-level debugging via SignalTap II embedded logic analyzer, useful for instrument bring-up.

📺

Broadcast Video Routing

Broadcast video routers and switchers benefit from the EP1SGX25F's combination of high-speed serial I/O and programmable video processing logic. The GXB transceivers can carry uncompressed HD-SDI (1.485 Gbps) and 3G-SDI (2.97 Gbps) streams, while the 25,660 logic elements implement crosspoint switching, frame synchronization, and genlocking. The embedded memory buffers handle line and frame delays for video processing. The 672-ball FineLine BGA package is suitable for compact 1U/2U router chassis.

🖥️

ASIC Prototyping for High-Bandwidth Designs

Design teams use the EP1SGX25F as a prototyping vehicle for ASICs targeting multi-gigabit serial interfaces. With 25,660 logic elements and 1.944 Mbits of RAM, it represents moderate-complexity ASICs before tapeout, allowing early firmware development and system integration. The 20 GXB channels at 3.1875 Gbps match the I/O of many networking ASICs. Quartus II compiles RTL with synthesis and place-and-route features that closely match ASIC flows, providing accurate timing closure feedback for prototype-to-ASIC migration.

🏭

Industrial High-Speed Control Systems

Industrial motion controllers and high-speed data acquisition systems benefit from the EP1SGX25F's deterministic logic fabric combined with high-speed serial links for inter-board communication. The 20 GXB transceivers connect to remote sensor arrays over fibre or shielded twisted pair, while the 25,660 logic elements implement real-time control loops, encoder decoding, and safety interlocks. The industrial-grade EP1SGX25F variants support extended temperature ranges for factory-floor deployment. Use FPGA-based soft-CPU cores (Nios II) for supervisory control.

✈️

Aerospace and Defense Signal Processing

Aerospace and defense platforms use the EP1SGX25F for radar signal processing, electronic warfare subsystems, and secure communications. The 20 high-speed transceivers support digital-RF data links and sensor fusion fabrics, while the 25,660 logic elements implement FFT engines and channelizer algorithms. The Stratix GX family's extended temperature and reliability characterization make it suitable for ruggedized military applications. The 672-ball FineLine BGA supports compact VPX and VME form factors common in defense electronics.

What is the EP1SGX25F?
The EP1SGX25F is an Altera Stratix GX family FPGA that combines 25,660 logic elements, 1,944,576 bits of embedded memory, and up to 20 dedicated gigabit transceiver blocks (GXB) operating at data rates up to 3.1875 Gbps per channel. According to the Stratix GX datasheet, each GXB embeds clock-data recovery (CDR) and SERDES circuitry for high-speed serial protocols, enabling single-chip multi-gigabit interface implementation.
How many logic elements and memory bits does the EP1SGX25F have?
The EP1SGX25F contains 25,660 logic elements, 26,274 registers, and 1,944,576 bits of embedded memory. These figures appear in the Stratix GX family datasheet and position the EP1SGX25F in the mid-density tier of the family, suitable for multi-gigabit serial bridging, packet processing, and DSP-intensive backplane designs.
What is the maximum data rate of the EP1SGX25F transceivers?
The dedicated GXB transceiver channels on the EP1SGX25F support data rates up to 3.1875 Gbps per channel. The transceiver blocks embed CDR and SERDES capability, supporting protocols such as XAUI (3.125 Gbps), Serial RapidIO, Fibre Channel, SONET/SDH OC-48, Gigabit Ethernet, and PCI Express through the embedded PCS layer.
Is the EP1SGX25F still in production?
The EP1SGX25F is in Not Recommended for New Designs (NRND) status. Altera (now part of Intel) has notified customers that new designs should migrate to newer Stratix GX derivatives or successor families. Stock remains available through distributors for maintenance and existing design support, but lead times and pricing should be confirmed before placing new orders.
Where can I buy the EP1SGX25F?
The EP1SGX25F is available from authorized Altera/Intel distributors and independent stocking distributors including Jotrin Electronics, FPGAkey, ampheo, and DigiKey (for the variant EP1SGX25CF672I6). As of 2026-09-07, prices for EP1SGX25F variants are approximately USD 115-185 per unit depending on quantity break and package speed grade. Stock and lead time vary - request quotes for current availability.
What is the price of the EP1SGX25F?
Pricing for the EP1SGX25F as of 2026-09-07 ranges approximately USD 115 (qty 1000) to USD 185 (qty 1) for the bare die-class part. Exact pricing depends on the specific suffix denoting package, speed grade, and temperature grade (e.g., EP1SGX25DF672I7 versus EP1SGX25CF672C6). Distributor pricing varies; obtain quotes from Jotrin, ampheo, or DigiKey for your specific part number.
What is the lead time for EP1SGX25F orders?
Lead time for EP1SGX25F variants as of 2026-09-07 is typically 8-16 weeks for NRND parts from authorized distributors, with shorter lead times of 1-4 weeks possible from independent stocking distributors when inventory is available. Because the part is NRND, prices may fluctuate significantly based on remaining market stock; request firm quotes before issuing purchase orders.
Where can I download the EP1SGX25F datasheet PDF?
The EP1SGX25F datasheet PDF is available from third-party datasheet repositories such as alldatasheet.com (273659/ALTERA/EP1SGX25F), digchip.com, and Intel's public document server (cdrdv2-public.intel.com/676865/ep1sgx25f.pdf for the pin-information document). The full Stratix GX family datasheet (document DS-STXGX-2.2, 262 pages per alldatasheet.com) contains complete device specifications.
EP1SGX25F vs EP1SGX10F - which is better for multi-gigabit designs?
The EP1SGX25F and EP1SGX10F both belong to the Stratix GX family, but the EP1SGX25F provides higher logic density (25,660 LEs vs 10,570 LEs) and more transceiver channels (up to 20 vs 4-8 GXB) at the same data rate of 3.1875 Gbps. Choose the EP1SGX25F for higher channel-count multi-gigabit systems or larger datapath processing; choose the EP1SGX10F for lower-cost designs with fewer serial lanes.
EP1SGX25F vs Cyclone IV GX - when should I choose the Stratix GX?
Choose the EP1SGX25F (Stratix GX) over Cyclone IV GX when you need higher transceiver count (up to 20 GXB at 3.1875 Gbps), larger logic capacity (25,660 LEs), and more embedded memory (1.944 Mbits). Choose Cyclone IV GX for low-cost, low-power designs where fewer than 4-8 transceiver channels suffice. Stratix GX targets high-performance communication infrastructure while Cyclone IV GX targets cost-sensitive industrial and consumer applications.
When should I select EP1SGX25F over newer Stratix IV GX?
Select the EP1SGX25F only for maintaining existing production boards or for cost-sensitive designs that already have validated Stratix GX firmware, since the EP1SGX25F is NRND. For new designs, choose Stratix IV GX (EP4SGX) or Stratix V GX (5SGX) for higher transceiver rates (up to 6.5 Gbps and 14.1 Gbps respectively), more logic, and active product support.
What is the best drop-in replacement for the EP1SGX25F?
The best drop-in replacement for the EP1SGX25F on existing 672-ball FineLine BGA boards is the EP1SGX25DF672I7 or EP1SGX25CF672I6. These share the 672-ball FineLine BGA footprint with the original EP1SGX25F variants in the same package, allowing vertical migration per the Stratix GX datasheet (Table 2 and 3). Confirm pinout compatibility against the EP1SGX25F datasheet before substitution.
Can an EP1SGX25C variant replace an EP1SGX25F in the same board?
Yes, EP1SGX25C (commercial) and EP1SGX25F (industrial/FineLine BGA package) variants share the 672-ball FineLine BGA footprint and support vertical migration per the Stratix GX family datasheet. The 'C' suffix denotes commercial temperature grade while 'F' denotes FineLine BGA package and industrial temperature - verify your application's temperature requirements before substitution.
What are the key specifications of EP1SGX25F that engineers should know?
The EP1SGX25F integrates 25,660 logic elements, 26,274 registers, 1,944,576 RAM bits, and up to 20 GXB transceiver channels at 3.1875 Gbps per channel. The device comes in FineLine BGA packages (672-ball and 1020-ball variants exist) and supports Quartus II design tools. These figures position the EP1SGX25F as a mid-density, high-transceiver-count FPGA for multi-gigabit serial applications such as XAUI, Serial RapidIO, and Fibre Channel bridging.
What is the Intel/Altera equivalent of EP1SGX25F for new designs?
The recommended Altera/Intel successor for the EP1SGX25F is the Stratix IV GX family (e.g., EP4SGX70, EP4SGX230) for moderate transceiver requirements, or the Stratix V GX (5SGX) for designs needing higher data rates up to 14.1 Gbps. Both successor families are in active production with Quartus II and later tool support, making them the preferred choices for new designs instead of the NRND EP1SGX25F.

کے لیے انجینئرنگ ریفرنس ڈیٹا EP1SGX25F — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔

انتخاب کی گائیڈ

Choose the EP1SGX25F when your design requires 4-20 high-speed serial transceiver channels at data rates up to 3.1875 Gbps combined with 25,660 logic elements and 1.944 Mbits of embedded memory. It excels at multi-port protocol bridging (XAUI, Serial RapidIO, Fibre Channel), backplane aggregation, and test instrumentation. For new designs, however, prefer Stratix IV GX or Stratix V GX active families instead, since the EP1SGX25F is NRND. For cost-sensitive or low-channel-count designs, consider Cyclone IV GX. Within the Stratix GX family, use EP1SGX25C variants for commercial temperature applications and EP1SGX25F/I variants for industrial-grade environments. The 672-FBGA package enables board reuse between EP1SGX10 and EP1SGX25 designs.

متبادلات کے ساتھ موازنہ

پیرامیٹر یہ پروڈکٹ EP1SGX25DF672C7 EP1SGX25DF672I7N EP1SGX25CF672I6 EP1SGX25CF672C6 EP1SGX25DF672C6N
Package FineLine BGA (672/1020-ball) 672-FBGA - same 672-FBGA - same 672-FBGA - same 672-FBGA - same 672-FBGA - same
Brand Altera Altera - same Altera - same Altera - same Altera - same Altera - same
Logic Elements 25,660 25,660 25,660 25,660 25,660 25,660
Registers 26,274 26,274 26,274 26,274 26,274 26,274
Memory Bits 1,944,576 1,944,576 1,944,576 1,944,576 1,944,576 1,944,576
GXB Transceiver Channels Up to 20 Up to 20 Up to 20 Up to 20 Up to 20 Up to 20
Max Data Rate per Channel 3.1875 Gbps 3.1875 Gbps 3.1875 Gbps 3.1875 Gbps 3.1875 Gbps 3.1875 Gbps
Lifecycle Status NRND NRND NRND NRND NRND NRND

اہم امتیازی خصوصیات

  • Integrated 20-channel GXB transceivers at 3.1875 Gbps (بمقابلہCyclone IV GX EP4CGX50)
  • Mid-density logic and memory for protocol bridging (بمقابلہEP1SGX10F (10,570 LEs))
  • Vertical migration within 672-FBGA package (بمقابلہ1020-ball EP1SGX25DF1020 variants)

ڈیزائن نوٹس

The EP1SGX25F FineLine BGA package requires a multi-layer board with controlled-impedance differential routing for the GXB transceiver channels. Use 100-ohm differential impedance for transceiver pairs and provide a low-jitter reference clock to the CDR blocks. Decoupling must cover core, I/O, and dedicated transceiver supplies per Altera's Stratix GX hardware design guidelines. BGA break-out requires via-in-pad or dog-bone fanout with proper antipad design to maintain characteristic impedance.

Estimated: At full transceiver utilization (20 channels at 3.1875 Gbps) with high logic utilization, the EP1SGX25F may dissipate 5-10W depending on toggle rate and clock tree utilization. Provide adequate thermal relief through the BGA's thermal balls and PCB inner-plane copper pour. Estimate junction-to-ambient thermal resistance based on package and board stack-up; derate for industrial temperature applications. Use thermal vias under the BGA thermal balls to inner copper planes for heat spreading.

Do not assume vertical migration is supported between all Stratix GX speed grades - verify against Tables 2 and 3 of the Stratix GX datasheet which list supported pin-compatible migrations. The 'C' suffix denotes commercial temperature grade while 'I' denotes industrial; substituting industrial for commercial is generally safe but not vice versa. Note that EP1SGX10 and EP1SGX25 share the 672-FBGA package but pinout compatibility is documented only for specific speed grade combinations. Always validate pinout with Quartus II fitter reports before committing to a migration.

GXB transceiver channels operating at 3.1875 Gbps require careful signal-integrity management. Use stripline or microstrip routing with continuous reference planes, keep serial traces short and matched within 5 mils, and place AC-coupling capacitors close to the transmitter pins. Provide separate analog and digital ground planes connected at a single point near the EP1SGX25F's ground pins. Reference clock jitter must be below the CDR's tolerance specification (typically <1 ps RMS) for reliable lock at 3.1875 Gbps.

تعمیل کی معلومات

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
لیڈ فری
Unknown
ہیلوجن فری
Unknown
کنفلیکٹ منرلز
Unknown

Compliance status not present in verified web data. Stratix GX family typically complies with RoHS for newer date codes, but specific EP1SGX25F suffix variants should be verified against the manufacturer's material declaration. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC in the standard AEC sense.

ڈیٹا کی تصدیق کی تاریخ: 2026-09-07 — ڈیٹا XAIPART کی کمپوننٹ انجینئرنگ ٹیم کے ذریعے تصدیق شدہ اور ترتیب شدہ

متعلقہ تلاشیں

EP1SGX25F EP1SGX25F datasheet EP1SGX25F Stratix GX FPGA Altera Stratix GX 25,660 logic elements EP1SGX25F 672-FBGA package Stratix GX FPGA XAUI bridging EP1SGX25F vs EP1SGX10F EP1SGX25F drop-in replacement EP1SGX25F buy price online what is the data rate of EP1SGX25F EP1SGX25F pinout FBGA Stratix GX transceiver FPGA 3.125 Gbps

متعلقہ اجزاء اور اصطلاحات

Altera Intel EP1SGX25F Stratix GX FPGA Field Programmable Gate Array Programmable Logic Device PLD Integrated Circuit GXB gigabit transceiver block CDR clock data recovery SERDES 8B/10B encoding FineLine BGA FBGA XAUI Serial RapidIO Fibre Channel SONET PCI Express Quartus II Nios II TriMatrix memory AEC-Q100
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