EP1SGX25F - Stratix GX FPGA, 25,660 LEs, 20 GXB, 672-FBGA | Altera
MPN: EP1SGX25F ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 500 | $128 | $64,000.00 |
| 1,000 | $115 | $115,000.00 |
Drop-in alternatives for EP1SGX25F — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25F Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Registers | 26,274 |
| Total Memory Bits | 1,944,576 |
| Maximum GXB Transceiver Channels | 20 |
| Maximum Data Rate per Channel | 3.1875 Gbps |
| CDR / Embedded SERDES | Yes (per channel) |
| Package | FineLine BGA (672-ball variant exists) |
| Speed Grades | Multiple (commercial and industrial) |
| Mounting Type | Surface Mount |
| Design Tool | Quartus II |
EP1SGX25F fineline bga (672-ball variant exists) Pin Configuration Guide
Complete pinout information for EP1SGX25F (fineline bga (672-ball variant exists) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25F.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25F is suitable for 7 applications: Multi-Gigabit Serial Protocol Bridging, Communication Backplane Aggregation, Test and Measurement Instrumentation, Broadcast Video Routing, ASIC Prototyping for High-Bandwidth Designs, Industrial High-Speed Control Systems, Aerospace and Defense Signal Processing.
Multi-Gigabit Serial Protocol Bridging
The EP1SGX25F is well suited to bridge between multi-gigabit serial protocols such as XAUI (3.125 Gbps), Serial RapidIO, Fibre Channel, SONET/SDH OC-48, and PCI Express. With up to 20 GXB transceiver channels at 3.1875 Gbps and an embedded PCS layer providing 8B/10B encoding and word alignment, a single EP1SGX25F can implement multi-port protocol bridges without external SERDES. The 25,660 logic elements and 1.944 Mbits of embedded memory support framing, rate-matching FIFOs, and protocol state machines. Place the EP1SGX25F on a board with controlled-impedance differential routing and a low-jitter reference clock for CDR lock.
Recommended
Communication Backplane Aggregation
In communication backplanes, the EP1SGX25F aggregates multiple serial links into a higher-bandwidth fabric. Its 20 GXB channels at 3.1875 Gbps deliver up to ~63.75 Gbps of aggregate serial bandwidth, sufficient for mid-range backplane switches and base-station controllers. The 25,660 logic elements support packet queuing and traffic shaping, while the 1.944 Mbits of TriMatrix memory absorb bursts. The 672-ball FineLine BGA package keeps the device footprint compact for line-card designs. Use proper multi-rail decoupling for core, I/O, and transceiver supplies per Altera's Stratix GX hardware design guidelines.
Recommended
Test and Measurement Instrumentation
The EP1SGX25F is suitable for test and measurement instruments that require multi-channel high-speed serial I/O such as protocol analyzers, BERT (bit-error-rate tester) platforms, and logic-analyzer backends. The 20 embedded CDR-equipped SERDES channels eliminate external PHY complexity, simplifying test fixture design. The 25,660 logic elements and 1.944 Mbits of RAM support deep capture buffers and real-time protocol decoding. The Quartus II toolchain provides hardware-level debugging via SignalTap II embedded logic analyzer, useful for instrument bring-up.
Recommended
Broadcast Video Routing
Broadcast video routers and switchers benefit from the EP1SGX25F's combination of high-speed serial I/O and programmable video processing logic. The GXB transceivers can carry uncompressed HD-SDI (1.485 Gbps) and 3G-SDI (2.97 Gbps) streams, while the 25,660 logic elements implement crosspoint switching, frame synchronization, and genlocking. The embedded memory buffers handle line and frame delays for video processing. The 672-ball FineLine BGA package is suitable for compact 1U/2U router chassis.
Recommended
ASIC Prototyping for High-Bandwidth Designs
Design teams use the EP1SGX25F as a prototyping vehicle for ASICs targeting multi-gigabit serial interfaces. With 25,660 logic elements and 1.944 Mbits of RAM, it represents moderate-complexity ASICs before tapeout, allowing early firmware development and system integration. The 20 GXB channels at 3.1875 Gbps match the I/O of many networking ASICs. Quartus II compiles RTL with synthesis and place-and-route features that closely match ASIC flows, providing accurate timing closure feedback for prototype-to-ASIC migration.
Recommended
Industrial High-Speed Control Systems
Industrial motion controllers and high-speed data acquisition systems benefit from the EP1SGX25F's deterministic logic fabric combined with high-speed serial links for inter-board communication. The 20 GXB transceivers connect to remote sensor arrays over fibre or shielded twisted pair, while the 25,660 logic elements implement real-time control loops, encoder decoding, and safety interlocks. The industrial-grade EP1SGX25F variants support extended temperature ranges for factory-floor deployment. Use FPGA-based soft-CPU cores (Nios II) for supervisory control.
Recommended
Aerospace and Defense Signal Processing
Aerospace and defense platforms use the EP1SGX25F for radar signal processing, electronic warfare subsystems, and secure communications. The 20 high-speed transceivers support digital-RF data links and sensor fusion fabrics, while the 25,660 logic elements implement FFT engines and channelizer algorithms. The Stratix GX family's extended temperature and reliability characterization make it suitable for ruggedized military applications. The 672-ball FineLine BGA supports compact VPX and VME form factors common in defense electronics.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25F — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF672C7 | EP1SGX25DF672I7N | EP1SGX25CF672I6 | EP1SGX25CF672C6 | EP1SGX25DF672C6N |
|---|---|---|---|---|---|---|
| Package | FineLine BGA (672/1020-ball) | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Altera | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Registers | 26,274 | 26,274 | 26,274 | 26,274 | 26,274 | 26,274 |
| Memory Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| GXB Transceiver Channels | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 |
| Max Data Rate per Channel | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps |
| Temperature Grade | [DATA_NEEDED: temperature grade] | Commercial | Industrial | Industrial | Commercial | Commercial |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Integrated 20-channel GXB transceivers at 3.1875 Gbps (vs Cyclone IV GX EP4CGX50)
- Mid-density logic and memory for protocol bridging (vs EP1SGX10F (10,570 LEs))
- Vertical migration within 672-FBGA package (vs 1020-ball EP1SGX25DF1020 variants)
Design Notes
The EP1SGX25F FineLine BGA package requires a multi-layer board with controlled-impedance differential routing for the GXB transceiver channels. Use 100-ohm differential impedance for transceiver pairs and provide a low-jitter reference clock to the CDR blocks. Decoupling must cover core, I/O, and dedicated transceiver supplies per Altera's Stratix GX hardware design guidelines. BGA break-out requires via-in-pad or dog-bone fanout with proper antipad design to maintain characteristic impedance.
Estimated: At full transceiver utilization (20 channels at 3.1875 Gbps) with high logic utilization, the EP1SGX25F may dissipate 5-10W depending on toggle rate and clock tree utilization. Provide adequate thermal relief through the BGA's thermal balls and PCB inner-plane copper pour. Estimate junction-to-ambient thermal resistance based on package and board stack-up; derate for industrial temperature applications. Use thermal vias under the BGA thermal balls to inner copper planes for heat spreading.
Do not assume vertical migration is supported between all Stratix GX speed grades - verify against Tables 2 and 3 of the Stratix GX datasheet which list supported pin-compatible migrations. The 'C' suffix denotes commercial temperature grade while 'I' denotes industrial; substituting industrial for commercial is generally safe but not vice versa. Note that EP1SGX10 and EP1SGX25 share the 672-FBGA package but pinout compatibility is documented only for specific speed grade combinations. Always validate pinout with Quartus II fitter reports before committing to a migration.
GXB transceiver channels operating at 3.1875 Gbps require careful signal-integrity management. Use stripline or microstrip routing with continuous reference planes, keep serial traces short and matched within 5 mils, and place AC-coupling capacitors close to the transmitter pins. Provide separate analog and digital ground planes connected at a single point near the EP1SGX25F's ground pins. Reference clock jitter must be below the CDR's tolerance specification (typically <1 ps RMS) for reliable lock at 3.1875 Gbps.
Compliance Information
Compliance status not present in verified web data. Stratix GX family typically complies with RoHS for newer date codes, but specific EP1SGX25F suffix variants should be verified against the manufacturer's material declaration. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC in the standard AEC sense.
