EP2A15F672I8 - APEX II 600K Gate FPGA, 672-FBGA | Altera
MPN: EP2A15F672I8 ⚠ آخری بار خریداریEP2A15F672I8 جائزہ
A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic, interconnect, and I/O behavior are configured by the user after manufacture via a configuration bitstream stored in SRAM or antifuse. APEX II sits in the historical Altera device hierarchy as APEX II -> APEX -> PLD -> programmable logic device -> semiconductor, and as a Look-Up Table (LUT)-based coarse-grained FPGA it sits alongside structured-ASIC predecessors and contemporary CPLDs at the high-density end of programmable logic.
Key features of the EP2A15F672I8 include 492 user I/O pins (LVTTL/LVCMOS compatible), MultiVolt I/O support, embedded system blocks (ESBs) for dual-port RAM and FIFO, embedded array blocks (EABs), up to 416 Kbits of embedded memory, and dedicated clock management circuits (PLL-like clockLock/clockBoost circuitry in the APEX II architecture). Per-pin and per-bank I/O standards are software-configurable via the Quartus design tool.
Typical applications include high-speed communications line cards, telecom backplane interfaces, DSP co-processing engines, industrial control and machine-vision front-ends, and PCI/PCI-X system interconnect bridging. Designers select this device when they need high logic density combined with up to 1 Gbps LVDS-style I/O capability (the APEX II platform advertises up to 1 gigabit-per-second serial I/O bandwidth).
When designing with this part, pay attention to the FBGA 27 x 27 mm footprint and 1.0 mm pitch — it requires multilayer PCB with microvia or via-in-pad fabrication. The industrial-grade -40 °C to 100 °C junction range makes it suitable for harsh-environment systems but engineering samples of this part are no longer in active production.
کے لیے ڈراپ اِن متبادل EP2A15F672I8 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP2A15F672I8 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Operating Temperature, Process Technology, Speed Grade, Embedded Memory.
EP2A15F672C9N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A15F672C9
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A15F672C7N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A15F672C7
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A15F672C7AA
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A15F672I8 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | APEX II |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Metal Layers | Up to 8 |
| Typical Gates | 600 K |
| Logic Elements / Cells | 16,640 |
| User I/Os | 492 |
| Embedded Memory | 416 Kbits |
| Maximum Internal Frequency | 435 MHz |
| Propagation Delay (typ.) | 1.94 ns |
| Core Supply Voltage | 1.5 V (1.425 V – 1.575 V) |
| Supply Voltage Range | 1.425 V to 1.575 V |
| آپریٹنگ درجہ حرارت | -40 °C to +100 °C (TJ, industrial) |
| پیکیج | 672-FBGA, FCBGA, 27 x 27 mm, 1.0 mm pitch |
| ماؤنٹنگ ٹائپ | Surface Mount (BGA) |
| I/O Standards | LVTTL, LVCMOS, LVDS, MultiVolt I/O |
EP2A15F672I8 پن کنفیگریشن
| پن A1 | I/O — User I/O bank 1 (MultiVolt) |
| پن A2 | I/O — User I/O bank 1 (MultiVolt) |
| پن B1 | VCCIO_1 — I/O bank 1 supply (1.8 V / 2.5 V / 3.3 V) |
| پن B2 | GND — Ground |
| پن C1 | I/O — User I/O bank 1 |
| پن C2 | I/O — User I/O bank 1 |
| پن D1 | VCCINT — Core supply 1.5 V |
| پن D2 | GND — Ground |
| پن E1 | I/O — User I/O bank 2 |
| پن E2 | I/O — User I/O bank 2 |
| پن F1 | VCCIO_2 — I/O bank 2 supply |
| پن F2 | GND — Ground |
| پن G1 | I/O — User I/O bank 3 |
| پن G2 | I/O — User I/O bank 3 |
| پن H1 | I/O — User I/O bank 3 |
| پن H2 | I/O — User I/O bank 3 |
| پن J1 | VCCIO_3 — I/O bank 3 supply |
| پن J2 | GND — Ground |
| پن K1 | I/O — User I/O bank 4 |
| پن K2 | TCK — JTAG test clock |
| پن L1 | TMS — JTAG test mode select |
| پن L2 | TDI — JTAG test data in |
| پن M1 | TDO — JTAG test data out |
| پن M2 | nCONFIG — Configuration control (active low) |
| پن N1 | nSTATUS — Configuration status (active low) |
| پن N2 | CONF_DONE — Configuration done (open-drain) |
| پن P1 | DCLK — Configuration clock |
| پن P2 | DATA0 — Configuration data bit 0 |
| پن R1 | MSEL0 — Configuration mode select 0 |
| پن R2 | MSEL1 — Configuration mode select 1 |
عام استعمالات
EP2A15F672I8 کے لیے موزوں ہے 6 ایپلیکیشنs: Telecom Line-Card Aggregation, DSP Co-Processing Engine, Industrial Machine-Vision Front-End, PCI / PCI-X Bridge / Endpoint, Legacy Defense / Avionics Backplane Interface, Test & Measurement Instrumentation Backbone.
Telecom Line-Card Aggregation
The EP2A15F672I8 is well-suited to high-density telecom line-card aggregation where 492 user I/Os and 16,640 logic cells provide plenty of state-machine and packet-classification fabric. Its 1.5 V core and MultiVolt I/O banks let designers mix 1.8 V, 2.5 V, and 3.3 V PHY interfaces on one chip without level shifters. The 672-FBGA footprint supports dense board placement alongside 10/40 Gbps PHY devices, and the device's advertised 1 Gbps serial I/O bandwidth matches legacy telecom backplanes. Plan for a 6-layer board with microvias around the 1.0 mm-pitch BGA.
تجویز کردہ
DSP Co-Processing Engine
The EP2A15F672I8's 16,640 logic elements and embedded multiplier/ESB blocks make it a competent DSP co-processor for FFT, FIR, and error-correction accelerators in software-defined radio and instrumentation. The 1.5 V core keeps dynamic power manageable even at 435 MHz internal Fmax, and the 416 Kbits of embedded memory serve as distributed line buffers. Place the device adjacent to a host DSP or PowerPC processor and use LVDS pairs for high-speed sample transfer. Watch the BGA escape routing — 1.0 mm pitch requires HDI stack-up.
تجویز کردہ
Industrial Machine-Vision Front-End
Industrial machine-vision line-scan and area-scan cameras need abundant I/O for parallel image sensors, plus enough logic for line buffers and basic preprocessing — the EP2A15F672I8 fits this role with 492 user I/Os and 16,640 cells. Its industrial -40 °C to 100 °C junction range survives factory-floor temperature swings, and the MultiVolt I/O banks accept 1.8 V CMOS image sensors and 3.3 V Camera Link drivers on the same silicon. Use the embedded system blocks (ESBs) as dual-port RAM for line buffers.
تجویز کردہ
PCI / PCI-X Bridge / Endpoint
The APEX II architecture includes dedicated on-chip PCI cores (32-bit/33 MHz PCI, 64-bit/66 MHz PCI-X) that the EP2A15F672I8 instantiates directly in fabric with full Plug-and-Play compliance. With 492 I/Os and 16,640 cells, the device can host a complete PCI-X endpoint plus custom logic for legacy peripheral bridging. Pair the FPGA with a downstream PHY or use it as a bus master on industrial backplanes. Mind the 5 V tolerance requirement of legacy PCI — confirm I/O bank VCCIO settings.
تجویز کردہ
Legacy Defense / Avionics Backplane Interface
The EP2A15F672I8 is commonly found in long-lifecycle defense and avionics systems where the industrial temperature grade and 1.5 V low-power operation are mandatory. Its 600K-gate capacity accommodates MIL-STD-1553, ARINC 429, or custom serial backplane glue logic, while 492 user I/Os handle multiple redundant data buses. Designers use Quartus II 13.0sp1 (the final supported version) for bitstream generation. Component obsolescence management is critical — most users stock last-time-buy quantities through Rochester Electronics or Heisener.
تجویز کردہ
Test & Measurement Instrumentation Backbone
High-end oscilloscopes, logic analyzers, and protocol testers historically used APEX II devices like the EP2A15F672I8 as the timing-and-acquisition backbone. The 16,640 logic cells host custom trigger logic and protocol decoders, while 492 I/Os parallel-drive ADC/DAC front-ends and backplane interfaces. The 435 MHz internal Fmax supports deep state-machine sequencing at full acquisition rates. The industrial temperature range suits benchtop and ATE rack environments; pair with a temperature-controlled chassis for best long-term stability.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP2A15F672I8 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP2A15F672C9N | EP2A15F672C9 | EP2A15F672C7N | EP2A15F672C7 | EP2A15F672C7AA |
|---|---|---|---|---|---|---|
| Package | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Operating Temperature | -40 °C to +100 °C (Industrial I8) | 0 °C to +85 °C (Commercial C9N) | 0 °C to +85 °C (Commercial C9) | 0 °C to +85 °C (Commercial C7N) | 0 °C to +85 °C (Commercial C7) | 0 °C to +85 °C (Commercial C7AA) |
| Speed Grade | -8 | -9 (faster) | -9 (faster) | -7 (slower) | -7 (slower) | -7 (slower) |
| Logic Cells | 16,640 | 16,640 (same die) | 16,640 (same die) | 16,640 (same die) | 16,640 (same die) | 16,640 (same die) |
| User I/Os | 492 | 492 | 492 | 492 | 492 | 492 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
اہم امتیازی خصوصیات
- Industrial temperature grade (-40 °C to +100 °C TJ) (بمقابلہEP2A15F672C9 / EP2A15F672C9N)
- Mid-tier -8 speed grade balance (بمقابلہEP2A15F672C7 (speed grade -7) and EP2A15F672C9 (speed grade -9))
- Full 672-FBGA, 492-I/O silicon populated (بمقابلہEP2A15B652C7 (652-ball BGA, fewer I/Os))
ڈیزائن نوٹس
The 672-FBGA package uses a 1.0 mm ball pitch on a 27 x 27 mm body. Escape routing requires a high-density interconnect (HDI) PCB stack-up with microvias (laser-drilled, typically 0.1 mm or smaller) or via-in-pad construction. Designers should plan a 6+ layer board with dedicated power and ground planes to deliver clean 1.5 V VCCINT and the per-bank VCCIO rails (1.8/2.5/3.3 V) without IR-drop.
The APEX II device dissipates roughly 1.5–3 W at full utilization depending on toggle rate and clock frequency. With θJA around 14–16 °C/W on a JEDEC test board for the 27 mm FBGA, junction temperature rise above ambient is approximately 25–50 °C. In a sealed industrial enclosure with 60 °C ambient, junction can approach 100 °C — keep utilization and clock rate budgeted and add thermal vias under the BGA thermal balls.
Do not assume new design starts on EP2A15F672I8 — the APEX II family is end-of-life and supported only by Quartus II 13.0sp1 (legacy). Maintain a virtual machine with the original toolchain or freeze the design and qualify through a distributor with last-time-buy inventory. For new designs, evaluate Cyclone III/IV or Cyclone V E families which provide higher logic density, lower core voltage, and active toolchain support.
Use a low-dropout regulator with sub-1% accuracy for VCCINT (1.5 V ±75 mV) to keep the device within spec — Altera recommends a 1.5 V ±5% rail. Decouple each VCCINT/VCCIO ball pair with a 0.1 µF ceramic plus a bulk 47–100 µF tantalum or polymer cap within 25 mm of the package. Add a ferrite bead on the 3.3 V supply feeding VCCIO banks to suppress switching noise.
تعمیل کی معلومات
APEX II family is mature/legacy. RoHS/REACH status was not explicitly listed in the verified distributor data; verify with manufacturer or distributor documentation before compliance-critical designs.
