EP2A15F672I8 - APEX II 600K Gate FPGA, 672-FBGA | Altera
MPN: EP2A15F672I8 ⚠ Lần mua cuốiEP2A15F672I8 Tóm tắt
A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic, interconnect, and I/O behavior are configured by the user after manufacture via a configuration bitstream stored in SRAM or antifuse. APEX II sits in the historical Altera device hierarchy as APEX II -> APEX -> PLD -> programmable logic device -> semiconductor, and as a Look-Up Table (LUT)-based coarse-grained FPGA it sits alongside structured-ASIC predecessors and contemporary CPLDs at the high-density end of programmable logic.
Key features of the EP2A15F672I8 include 492 user I/O pins (LVTTL/LVCMOS compatible), MultiVolt I/O support, embedded system blocks (ESBs) for dual-port RAM and FIFO, embedded array blocks (EABs), up to 416 Kbits of embedded memory, and dedicated clock management circuits (PLL-like clockLock/clockBoost circuitry in the APEX II architecture). Per-pin and per-bank I/O standards are software-configurable via the Quartus design tool.
Typical applications include high-speed communications line cards, telecom backplane interfaces, DSP co-processing engines, industrial control and machine-vision front-ends, and PCI/PCI-X system interconnect bridging. Designers select this device when they need high logic density combined with up to 1 Gbps LVDS-style I/O capability (the APEX II platform advertises up to 1 gigabit-per-second serial I/O bandwidth).
When designing with this part, pay attention to the FBGA 27 x 27 mm footprint and 1.0 mm pitch — it requires multilayer PCB with microvia or via-in-pad fabrication. The industrial-grade -40 °C to 100 °C junction range makes it suitable for harsh-environment systems but engineering samples of this part are no longer in active production.
Bộ thay thế dễ dàng lắp đặt cho EP2A15F672I8 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2A15F672I8 (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Process Technology, Speed Grade, Embedded Memory.
EP2A15F672C9N
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Xem tài liệu →EP2A15F672C7N
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Xem tài liệu →EP2A15F672C7
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Xem tài liệu →EP2A15F672I8 Tỷ lệ tối đa & tính chất điện
| Family | APEX II |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Metal Layers | Up to 8 |
| Typical Gates | 600 K |
| Logic Elements / Cells | 16,640 |
| User I/Os | 492 |
| Embedded Memory | 416 Kbits |
| Maximum Internal Frequency | 435 MHz |
| Propagation Delay (typ.) | 1.94 ns |
| Core Supply Voltage | 1.5 V (1.425 V – 1.575 V) |
| Supply Voltage Range | 1.425 V to 1.575 V |
| Nhiệt độ hoạt động | -40 °C to +100 °C (TJ, industrial) |
| Hộp | 672-FBGA, FCBGA, 27 x 27 mm, 1.0 mm pitch |
| Kiểu lắp đặt | Surface Mount (BGA) |
| I/O Standards | LVTTL, LVCMOS, LVDS, MultiVolt I/O |
Cấu hình chân EP2A15F672I8
| Chân A1 | I/O — User I/O bank 1 (MultiVolt) |
| Chân A2 | I/O — User I/O bank 1 (MultiVolt) |
| Chân B1 | VCCIO_1 — I/O bank 1 supply (1.8 V / 2.5 V / 3.3 V) |
| Chân B2 | GND — Ground |
| Chân C1 | I/O — User I/O bank 1 |
| Chân C2 | I/O — User I/O bank 1 |
| Chân D1 | VCCINT — Core supply 1.5 V |
| Chân D2 | GND — Ground |
| Chân E1 | I/O — User I/O bank 2 |
| Chân E2 | I/O — User I/O bank 2 |
| Chân F1 | VCCIO_2 — I/O bank 2 supply |
| Chân F2 | GND — Ground |
| Chân G1 | I/O — User I/O bank 3 |
| Chân G2 | I/O — User I/O bank 3 |
| Chân H1 | I/O — User I/O bank 3 |
| Chân H2 | I/O — User I/O bank 3 |
| Chân J1 | VCCIO_3 — I/O bank 3 supply |
| Chân J2 | GND — Ground |
| Chân K1 | I/O — User I/O bank 4 |
| Chân K2 | TCK — JTAG test clock |
| Chân L1 | TMS — JTAG test mode select |
| Chân L2 | TDI — JTAG test data in |
| Chân M1 | TDO — JTAG test data out |
| Chân M2 | nCONFIG — Configuration control (active low) |
| Chân N1 | nSTATUS — Configuration status (active low) |
| Chân N2 | CONF_DONE — Configuration done (open-drain) |
| Chân P1 | DCLK — Configuration clock |
| Chân P2 | DATA0 — Configuration data bit 0 |
| Chân R1 | MSEL0 — Configuration mode select 0 |
| Chân R2 | MSEL1 — Configuration mode select 1 |
Ứng dụng tiêu biểu
EP2A15F672I8 phù hợp cho 6 Áp dụngs: Telecom Line-Card Aggregation, DSP Co-Processing Engine, Industrial Machine-Vision Front-End, PCI / PCI-X Bridge / Endpoint, Legacy Defense / Avionics Backplane Interface, Test & Measurement Instrumentation Backbone.
Telecom Line-Card Aggregation
The EP2A15F672I8 is well-suited to high-density telecom line-card aggregation where 492 user I/Os and 16,640 logic cells provide plenty of state-machine and packet-classification fabric. Its 1.5 V core and MultiVolt I/O banks let designers mix 1.8 V, 2.5 V, and 3.3 V PHY interfaces on one chip without level shifters. The 672-FBGA footprint supports dense board placement alongside 10/40 Gbps PHY devices, and the device's advertised 1 Gbps serial I/O bandwidth matches legacy telecom backplanes. Plan for a 6-layer board with microvias around the 1.0 mm-pitch BGA.
Được đề xuất
DSP Co-Processing Engine
The EP2A15F672I8's 16,640 logic elements and embedded multiplier/ESB blocks make it a competent DSP co-processor for FFT, FIR, and error-correction accelerators in software-defined radio and instrumentation. The 1.5 V core keeps dynamic power manageable even at 435 MHz internal Fmax, and the 416 Kbits of embedded memory serve as distributed line buffers. Place the device adjacent to a host DSP or PowerPC processor and use LVDS pairs for high-speed sample transfer. Watch the BGA escape routing — 1.0 mm pitch requires HDI stack-up.
Được đề xuất
Industrial Machine-Vision Front-End
Industrial machine-vision line-scan and area-scan cameras need abundant I/O for parallel image sensors, plus enough logic for line buffers and basic preprocessing — the EP2A15F672I8 fits this role with 492 user I/Os and 16,640 cells. Its industrial -40 °C to 100 °C junction range survives factory-floor temperature swings, and the MultiVolt I/O banks accept 1.8 V CMOS image sensors and 3.3 V Camera Link drivers on the same silicon. Use the embedded system blocks (ESBs) as dual-port RAM for line buffers.
Được đề xuất
PCI / PCI-X Bridge / Endpoint
The APEX II architecture includes dedicated on-chip PCI cores (32-bit/33 MHz PCI, 64-bit/66 MHz PCI-X) that the EP2A15F672I8 instantiates directly in fabric with full Plug-and-Play compliance. With 492 I/Os and 16,640 cells, the device can host a complete PCI-X endpoint plus custom logic for legacy peripheral bridging. Pair the FPGA with a downstream PHY or use it as a bus master on industrial backplanes. Mind the 5 V tolerance requirement of legacy PCI — confirm I/O bank VCCIO settings.
Được đề xuất
Legacy Defense / Avionics Backplane Interface
The EP2A15F672I8 is commonly found in long-lifecycle defense and avionics systems where the industrial temperature grade and 1.5 V low-power operation are mandatory. Its 600K-gate capacity accommodates MIL-STD-1553, ARINC 429, or custom serial backplane glue logic, while 492 user I/Os handle multiple redundant data buses. Designers use Quartus II 13.0sp1 (the final supported version) for bitstream generation. Component obsolescence management is critical — most users stock last-time-buy quantities through Rochester Electronics or Heisener.
Được đề xuất
Test & Measurement Instrumentation Backbone
High-end oscilloscopes, logic analyzers, and protocol testers historically used APEX II devices like the EP2A15F672I8 as the timing-and-acquisition backbone. The 16,640 logic cells host custom trigger logic and protocol decoders, while 492 I/Os parallel-drive ADC/DAC front-ends and backplane interfaces. The 435 MHz internal Fmax supports deep state-machine sequencing at full acquisition rates. The industrial temperature range suits benchtop and ATE rack environments; pair with a temperature-controlled chassis for best long-term stability.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2A15F672I8 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2A15F672C9N | EP2A15F672C9 | EP2A15F672C7N | EP2A15F672C7 | EP2A15F672C7AA |
|---|---|---|---|---|---|---|
| Package | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Operating Temperature | -40 °C to +100 °C (Industrial I8) | 0 °C to +85 °C (Commercial C9N) | 0 °C to +85 °C (Commercial C9) | 0 °C to +85 °C (Commercial C7N) | 0 °C to +85 °C (Commercial C7) | 0 °C to +85 °C (Commercial C7AA) |
| Speed Grade | -8 | -9 (faster) | -9 (faster) | -7 (slower) | -7 (slower) | -7 (slower) |
| Logic Cells | 16,640 | 16,640 (same die) | 16,640 (same die) | 16,640 (same die) | 16,640 (same die) | 16,640 (same die) |
| User I/Os | 492 | 492 | 492 | 492 | 492 | 492 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Bảo phân biệt quan trọng
- Industrial temperature grade (-40 °C to +100 °C TJ) (vsEP2A15F672C9 / EP2A15F672C9N)
- Mid-tier -8 speed grade balance (vsEP2A15F672C7 (speed grade -7) and EP2A15F672C9 (speed grade -9))
- Full 672-FBGA, 492-I/O silicon populated (vsEP2A15B652C7 (652-ball BGA, fewer I/Os))
Ghi chú thiết kế
The 672-FBGA package uses a 1.0 mm ball pitch on a 27 x 27 mm body. Escape routing requires a high-density interconnect (HDI) PCB stack-up with microvias (laser-drilled, typically 0.1 mm or smaller) or via-in-pad construction. Designers should plan a 6+ layer board with dedicated power and ground planes to deliver clean 1.5 V VCCINT and the per-bank VCCIO rails (1.8/2.5/3.3 V) without IR-drop.
The APEX II device dissipates roughly 1.5–3 W at full utilization depending on toggle rate and clock frequency. With θJA around 14–16 °C/W on a JEDEC test board for the 27 mm FBGA, junction temperature rise above ambient is approximately 25–50 °C. In a sealed industrial enclosure with 60 °C ambient, junction can approach 100 °C — keep utilization and clock rate budgeted and add thermal vias under the BGA thermal balls.
Do not assume new design starts on EP2A15F672I8 — the APEX II family is end-of-life and supported only by Quartus II 13.0sp1 (legacy). Maintain a virtual machine with the original toolchain or freeze the design and qualify through a distributor with last-time-buy inventory. For new designs, evaluate Cyclone III/IV or Cyclone V E families which provide higher logic density, lower core voltage, and active toolchain support.
Use a low-dropout regulator with sub-1% accuracy for VCCINT (1.5 V ±75 mV) to keep the device within spec — Altera recommends a 1.5 V ±5% rail. Decouple each VCCINT/VCCIO ball pair with a 0.1 µF ceramic plus a bulk 47–100 µF tantalum or polymer cap within 25 mm of the package. Add a ferrite bead on the 3.3 V supply feeding VCCIO banks to suppress switching noise.
Thông tin tuân thủ
APEX II family is mature/legacy. RoHS/REACH status was not explicitly listed in the verified distributor data; verify with manufacturer or distributor documentation before compliance-critical designs.
