Intel

EP2A40F672C8N - APEX II 1.5M Gates FPGA | Intel | 672-BGA

MPN: EP2A40F672C8N ✗ اختتامِ زندگی
1.5 V Vdss FC-FBGA (FineLine BGA) Package 376 MHz Speed
MOQ: 1 |

EP2A40F672C8N جائزہ

The Intel (formerly Altera) EP2A40F672C8N is a high-density programmable logic device (PLD) from the APEX II family, built on a 0.15 µm all-layer copper CMOS process with up to eight metal layers. It delivers 1.5M system gates, 38,400 logic cells, and operates at up to 376 MHz internal frequency. The device is housed in a 672-ball FineLine BGA (FC-FBGA) measuring 27 x 27 mm with a 1.0 mm ball pitch, providing 492 user I/Os and supporting 1 Gbps LVDS performance.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. APEX II devices sit in the programmable logic hierarchy as follows: PLD -> CPLD/FPGA -> high-density FPGA with embedded memory and I/O. The APEX II family specifically targets high-performance datapath, communications, and ASIC-replacement designs where dense logic and high I/O count are required.

Key features of the EP2A40F672C8N include 1.5 M system gates, 38,400 logic elements, 4 embedded PLLs for clock synthesis, dedicated high-speed LVDS channels supporting 1 Gbps data rates, a 1.5 V nominal core supply (1.425 V to 1.575 V range), and 492 user I/Os. The propagation delay is rated at 1.55 ns for internal logic, and the device supports in-system programming via the JTAG boundary-scan interface per IEEE 1149.1.

Architecturally, the EP2A40F672C8N uses a MultiCore structure of Look-up Tables (LUTs), embedded array blocks (EABs) for memory and DSP functions, and FastTrack interconnect routing. The 0.15 µm copper process enables high transistor density while maintaining low dynamic power. Built-in PLLs simplify clock tree synthesis, and LVDS support is critical for high-speed parallel interfaces such as SPI-4.2, Rapid I/O, and POS-PHY.

Typical applications include telecommunications switching and routing equipment, ASIC prototyping and emulation, high-speed datapath processing, digital signal processing front-ends, and high-density glue-logic replacement. With 492 user I/Os, the device is well-suited for systems that require wide memory buses (DDR SDRAM controllers) or multiple parallel channel interfaces.

When designing with this device, ensure the 1.5 V core supply is generated by a low-noise regulator such as the TPS7A4701 to meet the VCCINT tolerance. The 672-ball BGA package requires a multilayer PCB (typically 6 or more layers) with controlled-impedance routing for LVDS signals and matched-length traces for clocks.

This page synthesizes distributor pricing, drop-in same-family Altera/Intel APEX II alternatives, and practical design notes not found in the manufacturer datasheet alone.

کے لیے ڈراپ اِن متبادل EP2A40F672C8N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔

اس سیریز میں مختلف ورژن

اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP2A40F672C8N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Speed Grade, Process Technology, Operating Temperature, Logic Elements.

Altera
Package: 672-ball FineLine BGA (FBGA-672)
Speed Grade: C6 (commercial)
Process Technology: 0.18-micron CMOS
موازنہ کریں EP2A40F672C8N →
Intel
Package: 672-ball FineLine BGA
Speed Grade: C6 (per part number suffix)
Process Technology: SRAM-based, 0.18 um (per family datasheet)
موازنہ کریں EP2A40F672C8N →
Intel
Package: 672-ball FC-FBGA (FineLine BGA)
Process Technology: 0.15 µm CMOS, all-layer copper, up to 8 metal layers
Logic Elements: 38,400
موازنہ کریں EP2A40F672C8N →
Intel
Package: 672-pin FC-FBGA (FineLine BGA)
Speed Grade: 7
Process Technology: 0.15 µm CMOS
موازنہ کریں EP2A40F672C8N →
Intel
Package: 672-ball FC-FBGA (FineLine BGA), S-PBGA-B672, 27 x 27 mm, 1.0 mm pitch
Speed Grade: 7
Process Technology: 0.15 µm CMOS, all-layer copper, up to 8 metal layers
موازنہ کریں EP2A40F672C8N →
Intel
Process Technology: 0.15-micron all-layer copper, up to 8 metal layers
Operating Temperature: 0 C to 85 C (commercial)
موازنہ کریں EP2A40F672C8N →
Altera
Package: 672-BBGA, FC-FBGA (FineLine)
Process Technology: 0.15 µm all-layer copper, up to 8 metal layers
Operating Temperature: 0 °C to 85 °C (commercial)
موازنہ کریں EP2A40F672C8N →
Altera
Package: 672-pin FC-FBGA
Speed Grade: -9
Process Technology: 0.15 µm CMOS
موازنہ کریں EP2A40F672C8N →
Intel
Package: BGA-672 (27 x 27 mm, 1.0 mm pitch)
Speed Grade: C9 (~1.55 ns propagation delay)
Process Technology: 0.15 µm all-layer copper, up to 8 metal layers
موازنہ کریں EP2A40F672C8N →
Intel
Package: 672-pin FC-FBGA
Speed Grade: -8
Process Technology: 0.15 µm
موازنہ کریں EP2A40F672C8N →
Altera
Package: 672-ball FC-FBGA
Speed Grade: -7 (speed grade 7)
Process Technology: 0.15 µm CMOS
موازنہ کریں EP2A40F672C8N →
Altera
Package: 672-pin FC-FBGA
Speed Grade: 8
Process Technology: 0.15 micrometer
موازنہ کریں EP2A40F672C8N →

EP2A40F672C7N

✅ ڈراپ-اِن
Intel
📦 672-FC-FBGA (F672)
APEX II · 38,400 · 1.5 M · 492 · 1.55 ns · 562 MHz · 0.15 µm CMOS, all-layer copper, up to 8 metal layers · 1.5 V

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP2A40F672C6N

✅ ڈراپ-اِن
Intel
📦 672-FC-FBGA (F672)
APEX II · 40,000 · 1,125,000 · 442,368 · 160 · 1.5 V · LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP2A40F672C7

✅ ڈراپ-اِن
Intel
📦 672-FC-FBGA (F672)
APEX II · 38,400 · 1,500,000 · 2,560 · 492 · 0.15 µm CMOS, all-layer copper, up to 8 metal layers · 1.5 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP2A40F672C8

✅ ڈراپ-اِن
Intel
📦 672-FC-FBGA (F672)
APEX II · CMOS · 40,000 · Up to 1.5 Mbits · 492 pins · 672 · FineLine BGA, 27 x 27 mm, 1.0 mm pitch · 0.15-micron all-layer copper, up to 8 metal layers

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP2A40F672C6

✅ ڈراپ-اِن
Altera
📦 672-FC-FBGA (F672)
APEX II · EP2A40 · 40,000 · 672-ball FineLine BGA (FBGA-672) · C6 (commercial)

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP2A40F672C7ES

✅ ڈراپ-اِن
Intel
📦 672-FC-FBGA (F672)
APEX II · 38400 · 1.5 M · 40960 · 2560 · 492 · 562 MHz · 0.15 µm CMOS

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP2A40F672C8ES

✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ
📦 672-FC-FBGA (F672)
same F672 672-ball FineLine BGA package, speed grade 8, engineering sample variant

📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)

EP2A40F672C6N

✅ ڈراپ-اِن
Intel
📦 672-FC-FBGA (F672)
APEX II · 40,000 · 1,125,000 · 442,368 · 160 · 1.5 V · LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP2A40F672C8N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات

Family APEX II
Series EP2A40
Logic Family CMOS
System Gates 1.5 M
Logic Elements / Cells 38,400
Maximum Operating Frequency 376 MHz
Propagation Delay 1.55 ns
Technology Node 0.15 µm
Process Feature All-layer copper, up to 8 metal layers
Nominal Supply Voltage (VCCINT) 1.5 V
Supply Voltage Range 1.425 V to 1.575 V
User I/Os 492
Number of Pins / Balls 672
Package Type FC-FBGA (FineLine BGA)
Package Dimensions 27 x 27 mm
Ball Pitch 1.0 mm
LVDS Data Rate 1 Gbps
Embedded PLLs 4
Programming Interface JTAG (IEEE 1149.1)
Operating Temperature (Commercial) 0 °C to 85 °C
Speed Grade C8

EP2A40F672C8N پن کنفیگریشن

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
پن A1 I/O — User I/O ball (per BGA map, varies by column/row)
پن A27 I/O — User I/O ball
پن AA1 I/O — User I/O ball
پن AA27 I/O — User I/O ball
پن AB1 I/O — User I/O ball
پن AB27 I/O — User I/O ball
پن AC1 I/O — User I/O ball
پن AC27 I/O — User I/O ball
پن B1 I/O — User I/O ball
پن B27 I/O — User I/O ball
پن C1 I/O — User I/O ball
پن C27 I/O — User I/O ball
پن D1 I/O — User I/O ball
پن D27 I/O — User I/O ball
پن E1 I/O — User I/O ball
پن E27 I/O — User I/O ball
پن F1 I/O — User I/O ball
پن F27 I/O — User I/O ball
پن G1 I/O — User I/O ball
پن G27 I/O — User I/O ball
پن H1 I/O — User I/O ball
پن H27 I/O — User I/O ball
پن J1 I/O — User I/O ball
پن J27 I/O — User I/O ball
پن K1 I/O — User I/O ball
پن K27 I/O — User I/O ball
پن L1 I/O — User I/O ball
پن L27 I/O — User I/O ball
پن M1 I/O — User I/O ball
پن M27 I/O — User I/O ball
پن N1 I/O — User I/O ball
پن N27 I/O — User I/O ball
پن P1 I/O — User I/O ball
پن P27 I/O — User I/O ball
پن R1 I/O — User I/O ball
پن R27 I/O — User I/O ball
پن T1 I/O — User I/O ball
پن T27 I/O — User I/O ball
پن U1 I/O — User I/O ball
پن U27 I/O — User I/O ball
پن V1 I/O — User I/O ball
پن V27 I/O — User I/O ball
پن W1 I/O — User I/O ball
پن W27 I/O — User I/O ball
پن Y1 I/O — User I/O ball
پن Y27 I/O — User I/O ball
پن TDO JTAG TDO — Dedicated JTAG Test Data Out pin
پن TMS JTAG TMS — Dedicated JTAG Test Mode Select pin
پن TCK JTAG TCK — Dedicated JTAG Test Clock pin
پن TDI JTAG TDI — Dedicated JTAG Test Data In pin
پن MSEL MSEL — Configuration mode select (sampled at power-up)
پن nCONFIG nCONFIG — Configuration start (active-low)
پن nSTATUS nSTATUS — Configuration status (active-low)
پن CONF_DONE CONF_DONE — Configuration complete indicator
پن DCLK DCLK — Configuration clock (used in some modes)
پن DATA0 DATA0 — Configuration data input
پن VCCINT VCCINT — Core supply (1.5 V nominal, 1.425 V to 1.575 V)
پن VCCIO VCCIO — I/O supply (per bank, typically 2.5 V or 3.3 V)
پن VCC_PLL VCC_PLL — Dedicated PLL analog supply
پن GND GND — Ground reference (multiple balls)
پن NC NC — Not connected (per datasheet, multiple balls reserved)

عام استعمالات

EP2A40F672C8N کے لیے موزوں ہے 7 ایپلیکیشنs: Telecommunications Switching and Routing, ASIC Prototyping and Emulation, High-Speed Datapath Processing, Industrial Automation and Control, Digital Signal Processing Front-Ends, High-Density Glue Logic Replacement, Test and Measurement Instrumentation.

🌐

Telecommunications Switching and Routing

The EP2A40F672C8N's 1.5M gates, 492 user I/Os, and 1 Gbps LVDS capability make it well-suited for telecom switching fabrics and routing line cards. The 672-ball FineLine BGA exposes enough I/O to drive parallel POS-PHY Level 4 (SPI-4.2) interfaces alongside network processors. With 4 embedded PLLs, multiple clock domains for TDM, ATM, and packet pipelines can be synthesized independently. The APEX II embedded array blocks (EABs) implement CAMs and lookup tables for routing table acceleration. This FPGA was commonly paired with network processors such as the Intel IXP1200 in legacy router designs.

🖥️

ASIC Prototyping and Emulation

With 38,400 logic elements and 1.5M system gates, the EP2A40F672C8N emulates mid-range ASICs in pre-silicon validation. The 492 user I/Os support wide external buses and DDR SDRAM interfaces, allowing real-world firmware bring-up before tapeout. The 1 Gbps LVDS channels mimic high-speed serial ASIC links. Engineers commonly partition ASIC RTL across multiple EP2A40 devices using JTAG chaining. Multi-FPGA partitioning tools such as Synopsys Certify and Mentor Graphics Precision Hi-Rel target this device family.

📺

High-Speed Datapath Processing

The EP2A40F672C8N's 376 MHz maximum internal frequency and 1.55 ns propagation delay enable high-throughput datapath pipelines in DSP, video, and image processing. Embedded array blocks (EABs) implement parallel multipliers and FIR filters efficiently. With 4 PLLs and 492 I/Os, the device connects to external DDR memory and high-speed ADCs/DACs without bottlenecks. APEX II EABs also support dual-port RAM for line buffers in video processing. The 1.5V low core voltage keeps dynamic power manageable at 376 MHz operation.

🏭

Industrial Automation and Control

Industrial control systems leverage the EP2A40F672C8N's 492 I/Os for parallel sensor aggregation, motor control PWM, and fieldbus bridging. The 0 °C to 85 °C commercial temperature range suits factory-floor enclosures. APEX II logic density accommodates multi-axis motion controllers and complex state machines. The LVDS channels support high-noise-immunity industrial links such as LVDS-based fieldbus extensions. The device's JTAG support (IEEE 1149.1) enables in-system programming during equipment commissioning and field updates.

✈️

Digital Signal Processing Front-Ends

The EP2A40F672C8N's embedded array blocks (EABs) implement fast Fourier transforms (FFTs), digital down-converters (DDCs), and FIR filters directly in hardware. Combined with 4 PLLs for sample-clock synthesis and 1 Gbps LVDS for ADC/DAC interfacing, the device suits radar, sonar, and software-defined radio front-ends. The 38,400-cell capacity supports multiple parallel processing channels. APEX II was widely adopted in 3G/4G base-station digital pre-distortion (DPD) feedback paths where parallel processing is essential.

🔧

High-Density Glue Logic Replacement

Designers replace multiple discrete CPLDs and ASICs with the EP2A40F672C8N to consolidate board real-estate and simplify routing. The 1.5M gates provide ample capacity for bus arbitration, interrupt controllers, and protocol bridges. The 672-ball BGA consolidates many TTL-level functions into a single device. APEX II's in-system programmability via JTAG allows post-assembly bug fixes. The 1.5V core and 3.3V I/O compatibility retains legacy 5V-tolerant interfaces via level shifters such as the SN74LVC4245A.

🧩

Test and Measurement Instrumentation

Test equipment designers leverage the EP2A40F672C8N for arbitrary waveform generation, protocol analysis, and logic analyzer capture. The 492 I/Os enable wide parallel stimulus/response channels, while EABs implement deep pattern memories. The 4 PLLs synthesize multiple precise sample clocks for multi-rate acquisition. LVDS channels support high-speed serial protocol decoding such as PCI Express and Serial RapidIO. The 1.5V core is readily generated by the TPS7A4701 low-noise LDO for jitter-sensitive timing paths.

تجویز کردہ پروڈکٹس کا خلاصہ

IXP1200 Companion network processor استعمال ہوتا ہے: Telecommunications Switching and Routing TPS7A4701RGWR Texas Instruments استعمال ہوتا ہے: Telecommunications Switching and Routing, Telecommunications Switching and Routing, Industrial Automation and Control, Industrial Automation and Control, Digital Signal Processing Front-Ends, Digital Signal Processing Front-Ends, Test and Measurement Instrumentation, Test and Measurement Instrumentation MT48LC16M16A2 External SDRAM for packet buffering استعمال ہوتا ہے: Telecommunications Switching and Routing EP2A40B724C8N Altera استعمال ہوتا ہے: ASIC Prototyping and Emulation TPS3823-33DBVR Voltage supervisor for power-on reset استعمال ہوتا ہے: ASIC Prototyping and Emulation, High-Density Glue Logic Replacement ADS5474 High-speed 14-bit ADC for DSP front-end استعمال ہوتا ہے: High-Speed Datapath Processing DAC5681 16-bit high-speed DAC companion استعمال ہوتا ہے: High-Speed Datapath Processing SN65LVDS31 LVDS driver for industrial links استعمال ہوتا ہے: Industrial Automation and Control AD6645 14-bit 105 MSPS ADC for IF sampling استعمال ہوتا ہے: Digital Signal Processing Front-Ends SN74LVC4245A 5V to 3.3V level translator for legacy interfaces استعمال ہوتا ہے: High-Density Glue Logic Replacement AD9854 DDS chip for arbitrary waveform generation استعمال ہوتا ہے: Test and Measurement Instrumentation
What is the EP2A40F672C8N?
The EP2A40F672C8N is a high-density FPGA from the Intel (formerly Altera) APEX II family. According to Intel/Altera product documentation, it delivers 1.5 million system gates, 38,400 logic elements, and 492 user I/Os in a 672-ball FineLine BGA package. It operates from a 1.5 V core supply and supports LVDS data rates up to 1 Gbps.
How many logic elements does the EP2A40F672C8N have?
The EP2A40F672C8N contains 38,400 logic elements (cells), equivalent to 1.5 million system gates. This density places it in the high-end of the APEX II family and makes it suitable for ASIC prototyping, telecom datapath, and large DSP pipelines. Memory is implemented via embedded array blocks (EABs) distributed across the logic array.
What is the operating voltage of EP2A40F672C8N?
The EP2A40F672C8N operates from a nominal 1.5 V core supply (VCCINT) with an allowable range of 1.425 V to 1.575 V. I/O banks operate from separate VCCIO rails (commonly 2.5 V or 3.3 V). A low-noise regulator such as the TPS7A4701 is recommended for VCCINT to meet tolerance and minimize jitter.
What package does the EP2A40F672C8N use?
The EP2A40F672C8N is packaged in a 672-ball FineLine BGA (FC-FBGA) measuring 27 x 27 mm with a 1.0 mm ball pitch. The package supports 492 user I/Os. Per the manufacturer package code, the suffix F672 designates this 672-ball FineLine BGA, while C8 indicates the commercial speed grade and temperature range.
What is the difference between EP2A40F672C8N and EP2A40F672C7N?
The EP2A40F672C8N is speed grade 8, while EP2A40F672C7N is speed grade 7. According to Altera/Intel APEX II documentation, lower speed grade numbers (7) indicate a faster device; thus EP2A40F672C7N supports higher maximum operating frequency than EP2A40F672C8N. Both share identical 672-ball FineLine BGA pinout, making them drop-in alternatives on the same PCB.
Where to buy EP2A40F672C8N online?
The EP2A40F672C8N can be sourced from authorized Altera/Intel distributors and independent inventory houses listed in the data sources of this page. Common channels include surplus/obsolete distributors such as Microchip USA, Sourcengine, Partstack, and Jotrin Electronics. Pricing as of 2026-09-08 ranges from approximately USD 122 at 1000-piece quantity to $185 at unit break.
What is the price of EP2A40F672C8N?
Pricing for the EP2A40F672C8N as of 2026-09-08 is approximately USD 185 at qty 1, USD 165 at qty 10, USD 148 at qty 100, USD 135 at qty 500, and USD 122 at qty 1000. Prices vary by distributor and market availability because the part is now obsolete; stocking distributors typically command a premium versus franchise channels.
What is the lead time for EP2A40F672C8N?
The EP2A40F672C8N is obsolete and not in continuous production. Lead time depends on distributor stock, typically ranging from immediate shipment to 8-12 weeks when sourced via franchise channels. Independent distributors including Sourcengine and Jotrin typically quote per-RFQ; expect quotes only, not real-time inventory, for this part.
Is the EP2A40F672C8N in stock?
The EP2A40F672C8N is obsolete, and distributor stock varies daily. As of 2026-09-08, sources such as Jotrin, Partstack, Sourcengine, and Vyrian list the part with quote-based availability. Engineers planning new designs should consider active APEX II successors or migrate to Cyclone III/IV/MAX families for guaranteed long-term supply.
EP2A40F672C8N vs EP2A40F672C7N - which is better for high-frequency designs?
For high-frequency designs, EP2A40F672C7N (speed grade 7) is faster than EP2A40F672C8N (speed grade 8). According to Altera APEX II speed grade nomenclature, lower numbers denote faster silicon. Both share the same 672-ball FC-FBGA footprint, so the EP2A40F672C7N is a drop-in upgrade for performance-critical applications without PCB rework.
What is the best drop-in replacement for EP2A40F672C8N?
The best drop-in replacements are other EP2A40 devices in the same 672-ball FineLine BGA package, namely EP2A40F672C7N (faster speed grade 7), EP2A40F672C6N (speed grade 6), EP2A40F672C7 (no lead-free suffix), and EP2A40F672C8 (different speed grade). All share identical pinout and 1.5 M gates / 38,400-cell architecture.
Can EP2A40F672C8N replace EP2A40F672C7N?
Yes, the EP2A40F672C8N (speed grade 8) can physically replace an EP2A40F672C7N (speed grade 7) on the same PCB because both share the 672-ball FineLine BGA pinout. However, the EP2A40F672C8N is the slower device, so timing closure must be re-validated. For an upgrade path choose speed grade 7 or 6 instead.
When should I choose EP2A40F672C8N over EP2A40F672C7N?
Choose EP2A40F672C8N (speed grade 8) when cost is prioritized over performance and the design comfortably meets timing at the slower speed grade. Choose EP2A40F672C7N when timing margin is critical, for example in 1 Gbps LVDS datapath or high-frequency DSP pipelines. Both share the same package, so PCB rework is not required.
Where can I download the EP2A40F672C8N datasheet PDF?
The EP2A40F672C8N datasheet PDF can be downloaded from distributor datasheet portals such as DigChip (digchip.info/datasheets/parts/datasheet/033/EP2A40F672C8N.php) and FPGAkey. The Altera APEX II family datasheet covers the EP2A40F672 variant and is also available from the Intel PSG/Altera document library. The datasheet details pinout, electrical characteristics, and configuration specifications.
Where can I find the EP2A40F672C8N pinout?
The EP2A40F672C8N pinout for the 672-ball FineLine BGA package is published in the Altera APEX II datasheet. The package designation F672 denotes the 672-ball variant. For quick reference, distributor pages such as FPGAkey and Jotrin include top-view ball maps. Note: 672 balls are divided between VCC, GND, user I/O, and dedicated configuration/JTAG pins.
What are the key specifications of EP2A40F672C8N that engineers should know?
The EP2A40F672C8N offers 1.5 million system gates, 38,400 logic elements, 492 user I/Os, 1.5 V core supply (1.425-1.575 V), 376 MHz maximum internal frequency, 1.55 ns propagation delay, 1 Gbps LVDS support, 4 embedded PLLs, and JTAG (IEEE 1149.1) programming. The package is a 672-ball FC-FBGA measuring 27 x 27 mm with 1.0 mm pitch.
Is EP2A40F672C8N suitable for ASIC prototyping?
Yes, the EP2A40F672C8N is suitable for ASIC prototyping thanks to its 1.5 million gates, 38,400 logic elements, and 492 user I/Os. With 1 Gbps LVDS capability and 4 PLLs, it can emulate mid-range ASICs in telecommunications, networking, and DSP designs. Engineers typically pair it with 32-bit embedded processors via soft-cores such as Nios II for full system validation.

کے لیے انجینئرنگ ریفرنس ڈیٹا EP2A40F672C8N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔

انتخاب کی گائیڈ

Choose the EP2A40F672C8N when designing APEX II-based systems where the timing budget tolerates the slower speed grade and cost reduction is prioritized. The grade 8 device is typically 10-15% cheaper than grade 7. Choose EP2A40F672C7N when a small Fmax upgrade is needed while maintaining commercial volume production. Choose EP2A40F672C6N when the design demands the fastest timing closure on the same 672-ball FC-FBGA footprint. For prototype builds needing speed-grade margin analysis, choose EP2A40F672C7ES. Avoid non-N-suffix variants (without 'N') unless the assembly process explicitly supports non-lead-free finishes, as most modern PCB assembly lines require lead-free (RoHS-compliant) finishes. For new designs, consider migrating to active Intel/Altera families (Cyclone IV/V, MAX 10) for guaranteed long-term supply.

متبادلات کے ساتھ موازنہ

پیرامیٹر یہ پروڈکٹ EP2A40F672C7N EP2A40F672C6N EP2A40F672C7 EP2A40F672C8 EP2A40F672C7ES
Package 672-ball FC-FBGA (F672), 27x27 mm, 1.0 mm pitch 672-ball FC-FBGA (F672) - same 672-ball FC-FBGA (F672) - same 672-ball FC-FBGA (F672) - same 672-ball FC-FBGA (F672) - same 672-ball FC-FBGA (F672) - same
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Family APEX II APEX II - same APEX II - same APEX II - same APEX II - same APEX II - same
Speed Grade C8 (slower commercial) C7 (faster) C6 (fastest) C7 C8 C7 engineering sample
System Gates 1.5 M 1.5 M 1.5 M 1.5 M 1.5 M 1.5 M
Logic Elements 38,400 38,400 38,400 38,400 38,400 38,400
User I/Os 492 492 492 492 492 492
Core Voltage 1.5 V (1.425-1.575 V) 1.5 V - same 1.5 V - same 1.5 V - same 1.5 V - same 1.5 V - same
Temperature Range 0 to 85 °C (commercial) 0 to 85 °C - same 0 to 85 °C - same 0 to 85 °C - same 0 to 85 °C - same 0 to 85 °C - same

اہم امتیازی خصوصیات

  • Slower speed grade available at lower cost (بمقابلہEP2A40F672C7N (speed grade 7))
  • Highest-speed available alternative for performance upgrades (بمقابلہEP2A40F672C6N (speed grade 6))
  • Engineering-sample variant for prototype validation (بمقابلہEP2A40F672C7ES)

ڈیزائن نوٹس

Generate the 1.5 V VCCINT rail with a low-noise LDO such as the TPS7A4701 (4.17 uVrms noise) placed within 1 inch of the BGA balls. Use a 6-layer PCB with two dedicated power planes: layer 2 for VCCINT, layer 5 for GND. Decouple each VCCINT ball with a 0.1 µF X7R ceramic plus a 10 µF bulk tantalum; add 1 µF on each VCC_PLL ball to minimize PLL jitter. Decoupling capacitor placement is critical: traces must be shorter than 50 mils to the ball.

Estimated: at 376 MHz toggle rate with 70% logic utilization, the EP2A40F672C8N can dissipate 3-5 W. The 672-ball FC-FBGA has a theta_JA of approximately 12-15 C/W with a properly designed thermal via array under the package. Use a 5x5 thermal via array (0.3 mm drill, 1.0 mm pitch) stitched to the inner GND plane. Without thermal vias, junction temperature can exceed 125 °C at full toggle rate. For continuous high-utilization designs, attach a heatsink via thermal interface material (TIM).

The 27x27 mm 672-ball FC-FBGA with 1.0 mm pitch requires a 6 or 8-layer PCB. Microvia (HDI) technology with 0.1 mm laser-drilled vias is recommended for breakout routing. Use 4-mil traces and 4-mil spaces in inner layers; outer layers should use 5-mil traces. Matched-length routing (±50 mil) is required for LVDS pairs and global clocks. Stitch all GND vias around the BGA perimeter to suppress edge radiation.

LVDS channels operating at 1 Gbps require 100 Ω differential impedance with controlled skew under 20 ps. Use AC-coupled termination at the receiver for inter-board LVDS links. For internal LVDS within the same PCB, use DC-coupled 100 Ω differential termination at the EP2A40F672C8N LVDS pins. Series-damping resistors (10-22 Ω) at the FPGA driver pins reduce reflection and overshoot. Keep LVDS pairs at least 3x trace-width spacing from other signals.

Do not exceed VCCINT beyond 1.575 V or below 1.425 V - permanent damage will occur. JTAG configuration requires TCK slower than 33 MHz for reliable programming. Do not leave unused I/O pins floating; configure them as outputs driving low or as inputs with weak pull-ups to avoid additional leakage. When migrating from speed grade 8 to 7 or 6, re-validate static timing analysis (STA) with the Quartus Prime speed-grade-specific timing models.

تعمیل کی معلومات

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
لیڈ فری
Unknown
ہیلوجن فری
Unknown
کنفلیکٹ منرلز
Unknown

RoHS/REACH status not stated in verified web data; suffix 'N' historically indicates lead-free finish per Altera naming convention, but compliance should be confirmed with the manufacturer. AEC-Q100 not applicable (commercial-grade FPGA).

ڈیٹا کی تصدیق کی تاریخ: 2026-09-08 — ڈیٹا XAIPART کی کمپوننٹ انجینئرنگ ٹیم کے ذریعے تصدیق شدہ اور ترتیب شدہ

متعلقہ تلاشیں

EP2A40F672C8N EP2A40F672C8N datasheet Altera APEX II EP2A40 1.5M gates FPGA BGA-672 672-ball FineLine BGA FPGA APEX II 38400 logic elements EP2A40F672C8N vs EP2A40F672C7N EP2A40F672C8N drop-in replacement EP2A40F672C8N buy price Altera APEX II telecom FPGA high density ASIC prototyping FPGA EP2A40F672C8N pinout

متعلقہ اجزاء اور اصطلاحات

Intel Altera APEX II EP2A40F672C8N EP2A40F672C7N EP2A40F672C6N EP2A40F672C7 EP2A40F672C8 FPGA Programmable Logic Device PLD FineLine BGA FC-FBGA LVDS JTAG IEEE 1149.1 EAB Embedded Array Block Look-up Table 1.5V core supply teleommunications switching ASIC prototyping DSP datapath RoHS 0.15 µm CMOS process
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