EP2A40F672C8N - APEX II 1.5M Gates FPGA | Intel | 672-BGA
Référence : EP2A40F672C8N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $165 | $1 650,00 |
| 100 | $148 | $14 800,00 |
| 500 | $135 | $67 500,00 |
| 1 000 | $122 | $122 000,00 |
EP2A40F672C8N Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. APEX II devices sit in the programmable logic hierarchy as follows: PLD -> CPLD/FPGA -> high-density FPGA with embedded memory and I/O. The APEX II family specifically targets high-performance datapath, communications, and ASIC-replacement designs where dense logic and high I/O count are required.
Key features of the EP2A40F672C8N include 1.5 M system gates, 38,400 logic elements, 4 embedded PLLs for clock synthesis, dedicated high-speed LVDS channels supporting 1 Gbps data rates, a 1.5 V nominal core supply (1.425 V to 1.575 V range), and 492 user I/Os. The propagation delay is rated at 1.55 ns for internal logic, and the device supports in-system programming via the JTAG boundary-scan interface per IEEE 1149.1.
Architecturally, the EP2A40F672C8N uses a MultiCore structure of Look-up Tables (LUTs), embedded array blocks (EABs) for memory and DSP functions, and FastTrack interconnect routing. The 0.15 µm copper process enables high transistor density while maintaining low dynamic power. Built-in PLLs simplify clock tree synthesis, and LVDS support is critical for high-speed parallel interfaces such as SPI-4.2, Rapid I/O, and POS-PHY.
Typical applications include telecommunications switching and routing equipment, ASIC prototyping and emulation, high-speed datapath processing, digital signal processing front-ends, and high-density glue-logic replacement. With 492 user I/Os, the device is well-suited for systems that require wide memory buses (DDR SDRAM controllers) or multiple parallel channel interfaces.
When designing with this device, ensure the 1.5 V core supply is generated by a low-noise regulator such as the TPS7A4701 to meet the VCCINT tolerance. The 672-ball BGA package requires a multilayer PCB (typically 6 or more layers) with controlled-impedance routing for LVDS signals and matched-length traces for clocks.
This page synthesizes distributor pricing, drop-in same-family Altera/Intel APEX II alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP2A40F672C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2A40F672C8N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Process Technology, Operating Temperature, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2A40F672C7N
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →EP2A40F672C6N
✅ Remplacement direct✓ En stock
$165 / unité
Voir la fiche technique →EP2A40F672C7
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP2A40F672C8
✅ Remplacement direct✓ En stock
$68 / unité
Voir la fiche technique →EP2A40F672C6
✅ Remplacement direct✓ En stock
$105 / unité
Voir la fiche technique →EP2A40F672C7ES
✅ Remplacement direct✓ En stock
$124.75 / unité
Voir la fiche technique →EP2A40F672C8ES
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP2A40F672C6N
✅ Remplacement direct✓ En stock
$165 / unité
Voir la fiche technique →EP2A40F672C8N Valeurs maximales et caractéristiques électriques
| Family | APEX II |
| Series | EP2A40 |
| Logic Family | CMOS |
| System Gates | 1.5 M |
| Logic Elements / Cells | 38,400 |
| Maximum Operating Frequency | 376 MHz |
| Propagation Delay | 1.55 ns |
| Technology Node | 0.15 µm |
| Process Feature | All-layer copper, up to 8 metal layers |
| Nominal Supply Voltage (VCCINT) | 1.5 V |
| Supply Voltage Range | 1.425 V to 1.575 V |
| User I/Os | 492 |
| Number of Pins / Balls | 672 |
| Package Type | FC-FBGA (FineLine BGA) |
| Package Dimensions | 27 x 27 mm |
| Ball Pitch | 1.0 mm |
| LVDS Data Rate | 1 Gbps |
| Embedded PLLs | 4 |
| Programming Interface | JTAG (IEEE 1149.1) |
| Operating Temperature (Commercial) | 0 °C to 85 °C |
| Speed Grade | C8 |
Configuration des broches de EP2A40F672C8N
| Broche A1 | I/O — User I/O ball (per BGA map, varies by column/row) |
| Broche A27 | I/O — User I/O ball |
| Broche AA1 | I/O — User I/O ball |
| Broche AA27 | I/O — User I/O ball |
| Broche AB1 | I/O — User I/O ball |
| Broche AB27 | I/O — User I/O ball |
| Broche AC1 | I/O — User I/O ball |
| Broche AC27 | I/O — User I/O ball |
| Broche B1 | I/O — User I/O ball |
| Broche B27 | I/O — User I/O ball |
| Broche C1 | I/O — User I/O ball |
| Broche C27 | I/O — User I/O ball |
| Broche D1 | I/O — User I/O ball |
| Broche D27 | I/O — User I/O ball |
| Broche E1 | I/O — User I/O ball |
| Broche E27 | I/O — User I/O ball |
| Broche F1 | I/O — User I/O ball |
| Broche F27 | I/O — User I/O ball |
| Broche G1 | I/O — User I/O ball |
| Broche G27 | I/O — User I/O ball |
| Broche H1 | I/O — User I/O ball |
| Broche H27 | I/O — User I/O ball |
| Broche J1 | I/O — User I/O ball |
| Broche J27 | I/O — User I/O ball |
| Broche K1 | I/O — User I/O ball |
| Broche K27 | I/O — User I/O ball |
| Broche L1 | I/O — User I/O ball |
| Broche L27 | I/O — User I/O ball |
| Broche M1 | I/O — User I/O ball |
| Broche M27 | I/O — User I/O ball |
| Broche N1 | I/O — User I/O ball |
| Broche N27 | I/O — User I/O ball |
| Broche P1 | I/O — User I/O ball |
| Broche P27 | I/O — User I/O ball |
| Broche R1 | I/O — User I/O ball |
| Broche R27 | I/O — User I/O ball |
| Broche T1 | I/O — User I/O ball |
| Broche T27 | I/O — User I/O ball |
| Broche U1 | I/O — User I/O ball |
| Broche U27 | I/O — User I/O ball |
| Broche V1 | I/O — User I/O ball |
| Broche V27 | I/O — User I/O ball |
| Broche W1 | I/O — User I/O ball |
| Broche W27 | I/O — User I/O ball |
| Broche Y1 | I/O — User I/O ball |
| Broche Y27 | I/O — User I/O ball |
| Broche TDO | JTAG TDO — Dedicated JTAG Test Data Out pin |
| Broche TMS | JTAG TMS — Dedicated JTAG Test Mode Select pin |
| Broche TCK | JTAG TCK — Dedicated JTAG Test Clock pin |
| Broche TDI | JTAG TDI — Dedicated JTAG Test Data In pin |
| Broche MSEL | MSEL — Configuration mode select (sampled at power-up) |
| Broche nCONFIG | nCONFIG — Configuration start (active-low) |
| Broche nSTATUS | nSTATUS — Configuration status (active-low) |
| Broche CONF_DONE | CONF_DONE — Configuration complete indicator |
| Broche DCLK | DCLK — Configuration clock (used in some modes) |
| Broche DATA0 | DATA0 — Configuration data input |
| Broche VCCINT | VCCINT — Core supply (1.5 V nominal, 1.425 V to 1.575 V) |
| Broche VCCIO | VCCIO — I/O supply (per bank, typically 2.5 V or 3.3 V) |
| Broche VCC_PLL | VCC_PLL — Dedicated PLL analog supply |
| Broche GND | GND — Ground reference (multiple balls) |
| Broche NC | NC — Not connected (per datasheet, multiple balls reserved) |
Applications typiques
EP2A40F672C8N convient pour 7 applications: Telecommunications Switching and Routing, ASIC Prototyping and Emulation, High-Speed Datapath Processing, Industrial Automation and Control, Digital Signal Processing Front-Ends, High-Density Glue Logic Replacement, Test and Measurement Instrumentation.
Telecommunications Switching and Routing
The EP2A40F672C8N's 1.5M gates, 492 user I/Os, and 1 Gbps LVDS capability make it well-suited for telecom switching fabrics and routing line cards. The 672-ball FineLine BGA exposes enough I/O to drive parallel POS-PHY Level 4 (SPI-4.2) interfaces alongside network processors. With 4 embedded PLLs, multiple clock domains for TDM, ATM, and packet pipelines can be synthesized independently. The APEX II embedded array blocks (EABs) implement CAMs and lookup tables for routing table acceleration. This FPGA was commonly paired with network processors such as the Intel IXP1200 in legacy router designs.
Recommandé
ASIC Prototyping and Emulation
With 38,400 logic elements and 1.5M system gates, the EP2A40F672C8N emulates mid-range ASICs in pre-silicon validation. The 492 user I/Os support wide external buses and DDR SDRAM interfaces, allowing real-world firmware bring-up before tapeout. The 1 Gbps LVDS channels mimic high-speed serial ASIC links. Engineers commonly partition ASIC RTL across multiple EP2A40 devices using JTAG chaining. Multi-FPGA partitioning tools such as Synopsys Certify and Mentor Graphics Precision Hi-Rel target this device family.
Recommandé
High-Speed Datapath Processing
The EP2A40F672C8N's 376 MHz maximum internal frequency and 1.55 ns propagation delay enable high-throughput datapath pipelines in DSP, video, and image processing. Embedded array blocks (EABs) implement parallel multipliers and FIR filters efficiently. With 4 PLLs and 492 I/Os, the device connects to external DDR memory and high-speed ADCs/DACs without bottlenecks. APEX II EABs also support dual-port RAM for line buffers in video processing. The 1.5V low core voltage keeps dynamic power manageable at 376 MHz operation.
Recommandé
Industrial Automation and Control
Industrial control systems leverage the EP2A40F672C8N's 492 I/Os for parallel sensor aggregation, motor control PWM, and fieldbus bridging. The 0 °C to 85 °C commercial temperature range suits factory-floor enclosures. APEX II logic density accommodates multi-axis motion controllers and complex state machines. The LVDS channels support high-noise-immunity industrial links such as LVDS-based fieldbus extensions. The device's JTAG support (IEEE 1149.1) enables in-system programming during equipment commissioning and field updates.
Recommandé
Digital Signal Processing Front-Ends
The EP2A40F672C8N's embedded array blocks (EABs) implement fast Fourier transforms (FFTs), digital down-converters (DDCs), and FIR filters directly in hardware. Combined with 4 PLLs for sample-clock synthesis and 1 Gbps LVDS for ADC/DAC interfacing, the device suits radar, sonar, and software-defined radio front-ends. The 38,400-cell capacity supports multiple parallel processing channels. APEX II was widely adopted in 3G/4G base-station digital pre-distortion (DPD) feedback paths where parallel processing is essential.
Recommandé
High-Density Glue Logic Replacement
Designers replace multiple discrete CPLDs and ASICs with the EP2A40F672C8N to consolidate board real-estate and simplify routing. The 1.5M gates provide ample capacity for bus arbitration, interrupt controllers, and protocol bridges. The 672-ball BGA consolidates many TTL-level functions into a single device. APEX II's in-system programmability via JTAG allows post-assembly bug fixes. The 1.5V core and 3.3V I/O compatibility retains legacy 5V-tolerant interfaces via level shifters such as the SN74LVC4245A.
Recommandé
Test and Measurement Instrumentation
Test equipment designers leverage the EP2A40F672C8N for arbitrary waveform generation, protocol analysis, and logic analyzer capture. The 492 I/Os enable wide parallel stimulus/response channels, while EABs implement deep pattern memories. The 4 PLLs synthesize multiple precise sample clocks for multi-rate acquisition. LVDS channels support high-speed serial protocol decoding such as PCI Express and Serial RapidIO. The 1.5V core is readily generated by the TPS7A4701 low-noise LDO for jitter-sensitive timing paths.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2A40F672C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2A40F672C7N | EP2A40F672C6N | EP2A40F672C7 | EP2A40F672C8 | EP2A40F672C7ES |
|---|---|---|---|---|---|---|
| Package | 672-ball FC-FBGA (F672), 27x27 mm, 1.0 mm pitch | 672-ball FC-FBGA (F672) - same | 672-ball FC-FBGA (F672) - same | 672-ball FC-FBGA (F672) - same | 672-ball FC-FBGA (F672) - same | 672-ball FC-FBGA (F672) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | APEX II | APEX II - same | APEX II - same | APEX II - same | APEX II - same | APEX II - same |
| Speed Grade | C8 (slower commercial) | C7 (faster) | C6 (fastest) | C7 | C8 | C7 engineering sample |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| User I/Os | 492 | 492 | 492 | 492 | 492 | 492 |
| Core Voltage | 1.5 V (1.425-1.575 V) | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| Temperature Range | 0 to 85 °C (commercial) | 0 to 85 °C - same | 0 to 85 °C - same | 0 to 85 °C - same | 0 to 85 °C - same | 0 to 85 °C - same |
Principaux différenciateurs
- Slower speed grade available at lower cost (vs EP2A40F672C7N (speed grade 7))
- Highest-speed available alternative for performance upgrades (vs EP2A40F672C6N (speed grade 6))
- Engineering-sample variant for prototype validation (vs EP2A40F672C7ES)
Notes de conception
Generate the 1.5 V VCCINT rail with a low-noise LDO such as the TPS7A4701 (4.17 uVrms noise) placed within 1 inch of the BGA balls. Use a 6-layer PCB with two dedicated power planes: layer 2 for VCCINT, layer 5 for GND. Decouple each VCCINT ball with a 0.1 µF X7R ceramic plus a 10 µF bulk tantalum; add 1 µF on each VCC_PLL ball to minimize PLL jitter. Decoupling capacitor placement is critical: traces must be shorter than 50 mils to the ball.
Estimated: at 376 MHz toggle rate with 70% logic utilization, the EP2A40F672C8N can dissipate 3-5 W. The 672-ball FC-FBGA has a theta_JA of approximately 12-15 C/W with a properly designed thermal via array under the package. Use a 5x5 thermal via array (0.3 mm drill, 1.0 mm pitch) stitched to the inner GND plane. Without thermal vias, junction temperature can exceed 125 °C at full toggle rate. For continuous high-utilization designs, attach a heatsink via thermal interface material (TIM).
The 27x27 mm 672-ball FC-FBGA with 1.0 mm pitch requires a 6 or 8-layer PCB. Microvia (HDI) technology with 0.1 mm laser-drilled vias is recommended for breakout routing. Use 4-mil traces and 4-mil spaces in inner layers; outer layers should use 5-mil traces. Matched-length routing (±50 mil) is required for LVDS pairs and global clocks. Stitch all GND vias around the BGA perimeter to suppress edge radiation.
LVDS channels operating at 1 Gbps require 100 Ω differential impedance with controlled skew under 20 ps. Use AC-coupled termination at the receiver for inter-board LVDS links. For internal LVDS within the same PCB, use DC-coupled 100 Ω differential termination at the EP2A40F672C8N LVDS pins. Series-damping resistors (10-22 Ω) at the FPGA driver pins reduce reflection and overshoot. Keep LVDS pairs at least 3x trace-width spacing from other signals.
Do not exceed VCCINT beyond 1.575 V or below 1.425 V - permanent damage will occur. JTAG configuration requires TCK slower than 33 MHz for reliable programming. Do not leave unused I/O pins floating; configure them as outputs driving low or as inputs with weak pull-ups to avoid additional leakage. When migrating from speed grade 8 to 7 or 6, re-validate static timing analysis (STA) with the Quartus Prime speed-grade-specific timing models.
Informations de conformité
RoHS/REACH status not stated in verified web data; suffix 'N' historically indicates lead-free finish per Altera naming convention, but compliance should be confirmed with the manufacturer. AEC-Q100 not applicable (commercial-grade FPGA).
