EP2AGX45CU17I3N - Arria II GX FPGA, 42K LEs, 156 I/O, 358-FCBGA | Intel
MPN: EP2AGX45CU17I3N ✓ فعالEP2AGX45CU17I3N جائزہ
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded multipliers, block RAM, and programmable I/O cells that can be rewired post-manufacturing to implement custom digital circuits. FPGAs occupy a position in the broader taxonomy of programmable logic devices (PLDs) and are widely used as glue logic, co-processors, and DSP accelerators between microcontrollers/DSPs and application-specific standard products (ASSPs). Within the programmable logic hierarchy, the Arria II family sits between the lower-cost Cyclone family and the high-performance Stratix family, targeting mid-range applications that need transceivers and DSP blocks.
Key features of the EP2AGX45CU17I3N include 1,805 LABs, 8 transceiver channels, 4 PLLs, 312 (18x18) multipliers, support for DDR2/DDR3/LPDDR/LPDDR2 external memory interfaces, and 0.9 V core operation. The "I3" speed grade and "I" temperature grade designate industrial temperature operation (-40C to +100C) at a moderate performance bin.
The Arria II GX architecture combines a logic fabric with embedded transceivers and DSP blocks, enabling designers to implement protocol bridging, video processing, and baseband DSP without external ASSPs. The 40 nm process node offers a balance of static power and dynamic performance, with dedicated hard IP for PCIe, Ethernet, and serial RapidIO protocols.
Typical applications include wireless backhaul, serial protocol bridging, video processing, industrial imaging, and test & measurement instrumentation. The transceiver-rich architecture is especially useful where multi-gigabit serial links must coexist with custom DSP or control logic on a single device.
When designing with this part, plan the power integrity network carefully: Arria II GX designs typically require multi-rail supplies (0.9 V core, 1.1 V transceiver PLLs, 2.5/3.3 V I/O) with bulk decoupling and high-frequency ceramic capacitors placed close to each bank.
This page synthesizes distributor pricing, the curated Altera/Intel drop-in alternatives in the same 358-ball LFBGA footprint, and practical design notes that go beyond a single datasheet search.
کے لیے ڈراپ اِن متبادل EP2AGX45CU17I3N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP2AGX45CU17I3N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Device Type, Speed Grade, Operating Temperature, Mounting Type.
EP2AGX45CU17I3G
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGX45CU17I6N
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EP2AGX45CU17C6N
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EP2AGX45CU17C5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGX45CU17C4G
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGX45CU17I3N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | Arria II GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 42,959 |
| Number of LABs/CLBs | 1,805 |
| Total RAM Bits | 3,517,440 |
| Number of I/O | 156 |
| Number of Transceivers | 8 |
| Transceiver Data Rate (max) | 3.75 Gbps |
| Number of PLLs | 4 |
| Multiplier Elements (18x18) | 312 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| پیکیج | 358-LFBGA, FCBGA |
| آپریٹنگ درجہ حرارت | -40C to +100C (Industrial) |
| Speed Grade | I3 |
| ماؤنٹنگ ٹائپ | Surface Mount |
| RoHS اسٹیٹس | Compliant |
EP2AGX45CU17I3N 358-lfbga, fcbga پن کنفیگریشن گائیڈ
EP2AGX45CU17I3N (358-lfbga, fcbga پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP2AGX45CU17I3N.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP2AGX45CU17I3N کے لیے موزوں ہے 6 ایپلیکیشنs: Wireless Backhaul Equipment, Serial Protocol Bridge Cards, Industrial Video Processing, Test and Measurement Instrumentation, Medical Imaging Systems, Aerospace and Defense Signal Processing.
Wireless Backhaul Equipment
The EP2AGX45CU17I3N's 8 multi-gigabit transceivers operating up to 3.75 Gbps and 4 on-chip PLLs make it a natural fit for wireless backhaul baseband cards that aggregate Ethernet, CPRI, and serial RapidIO links. The 312 (18x18) multipliers and 3,517,440 bits of block RAM implement channel coding, scrambling, and timing-recovery DSP on a single device, eliminating a discrete DSP+ASIC pair. Industrial temperature grade is critical for outdoor-cabinet deployment. Place the device between PHY and network processor to free the host CPU from PHY housekeeping.
تجویز کردہ
Serial Protocol Bridge Cards
Use the EP2AGX45CU17I3N as a multi-protocol bridge on line cards that must convert PCIe Gen1/Gen2 to Serial RapidIO, Gigabit Ethernet, or custom serial links. The 8 transceivers provide the physical layer for these protocols without external PHYs, and the 42,959 logic elements handle state machines, DMA, and packet buffering. Compared to an ASSP bridge, the FPGA approach lets you tune packet latency and add proprietary extensions. Industrial temperature supports legacy telecom and industrial enclosures.
تجویز کردہ
Industrial Video Processing
The EP2AGX45CU17I3N's 312 DSP blocks and 3.5 Mbit block RAM are well matched to SD/HD video scaling, color-space conversion, and de-interlacing pipelines in factory automation, machine vision, and broadcast gear. The 156 user I/Os interface to DDR2/DDR3 external frame buffers and parallel video busses. Industrial temperature supports factory-floor installations. Place the FPGA between the camera/link receiver and the host processor to offload pixel-rate work.
تجویز کردہ
Test and Measurement Instrumentation
The EP2AGX45CU17I3N integrates logic fabric, transceivers, and DSP into one device usable in protocol-aware logic analyzers, bit-error-rate testers, and arbitrary waveform generators. The transceivers capture serial data up to 3.75 Gbps while the DSP blocks run eye-diagram statistics, jitter decomposition, and PRBS checking in real time. Industrial temperature supports laboratory and field-test chassis. Pair the FPGA with a host CPU over PCIe to offload pattern generation.
تجویز کردہ
Medical Imaging Systems
The EP2AGX45CU17I3N's combination of 42K logic elements and 312 (18x18) multipliers enables real-time beamforming, FFT, and image reconstruction for ultrasound and endoscopy systems. The 8 transceivers support multi-channel probe data ingest at link rates to 3.75 Gbps, and the 156 I/Os drive DDR2/DDR3 frame memory without external bus controllers. Industrial temperature grade supports portable cart and bedside equipment. Place the FPGA between probe receiver ASIC and display processor to consolidate DSP.
تجویز کردہ
Aerospace and Defense Signal Processing
The EP2AGX45CU17I3N is well suited to avionics and defense subsystems that demand industrial temperature, deterministic DSP, and reconfigurable serial links. The 3.75 Gbps transceivers connect to MIL-STD-1553, ARINC 429, or custom serial backplanes, while the multipliers implement radar FFT and electronic-warfare pulse processing. The 40 nm process node and mature Quartus toolchain make this part a long-life candidate for defense programs. Industrial temperature supports -40C to +100C ambient conditions.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP2AGX45CU17I3N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP2AGX45CU17I3G | EP2AGX45CU17I6N | EP2AGX45CU17C6N | EP2AGX45CU17C5N | EP2AGX45CU17C4G |
|---|---|---|---|---|---|---|
| Package | 358-LFBGA, FCBGA | 358-LFBGA, FCBGA - same | 358-LFBGA, FCBGA - same | 358-LFBGA, FCBGA - same | 358-LFBGA, FCBGA - same | 358-LFBGA, FCBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 |
| Speed Grade | I3 | I3 | I6 (faster) | C6 (faster) | C5 | C4 (fastest) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Number of Transceivers | 8 | 8 | 8 | 8 | 8 | 8 |
| Transceiver Data Rate (max) | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps |
| Number of I/O | 156 | 156 | 156 | 156 | 156 | 156 |
| Multiplier Elements (18x18) | 312 | 312 | 312 | 312 | 312 | 312 |
| Lead Finish | SnPb (N) | Pb-free (G) | SnPb (N) | SnPb (N) | SnPb (N) | Pb-free (G) |
اہم امتیازی خصوصیات
- Industrial temperature variant at mid-range density (بمقابلہEP2AGX45CU17C6N)
- 8 transceivers up to 3.75 Gbps in mid-density FPGA (بمقابلہCyclone V E (5CGXFC7C7F23C8N))
- 40 nm mature process with full Quartus toolchain support (بمقابلہStratix V (5SGXEA7H3F35C3))
ڈیزائن نوٹس
Estimated: Arria II GX designs typically require at least four power rails: 0.9 V core (VCC), 1.1 V transceiver PLL (VCCH_GXB), 2.5 V/3.3 V I/O banks, and 1.2 V/1.5 V auxiliary supplies. Budget 3-8 W core plus 0.5-1.5 W per active transceiver, depending on data rate and pre-emphasis. Use the PowerPlay Early Power Estimator in Quartus to refine before place-and-route.
Place 100 nF and 4.7 uF X7R ceramic decoupling capacitors within 1-2 mm of each VCC/VCCH/GXB pin pair, with bulk 22-100 uF tantalum or polymer capacitors on each rail. A 4-layer PCB with continuous VCC and GND planes beneath the BGA improves power integrity; for 8-layer stack-ups add dedicated signal layers for high-speed serial routing.
Transceiver channels operating at 3.75 Gbps require 100-ohm differential routing, length matching within +/- 5 mils for intra-pair and within +/- 50 mils for inter-pair, and AC-coupling capacitors near the transmitter side. Reference the Arria II GX Altium/Quartus pin planner for pre-tuned output pre-emphasis and equalization settings.
Do not mix industrial and commercial temperature-grade variants without re-running timing closure across -40C to +100C; jitter budget shrinks at cold corners. Verify all configuration pins (MSEL0-3) match the chosen configuration scheme (AS, PS, FPP) before final board bring-up; misconfigured MSELs cause hard configuration failures.
تعمیل کی معلومات
SnPb lead finish indicated by N suffix - non-RoHS but useful for defense and aerospace exemptions. For RoHS-compliant production use the G-suffix variants (EP2AGX45CU17I3G, EP2AGX45CU17C4G). Not AEC-Q100 qualified; FPGAs in this class are typically not used directly in safety-critical automotive without additional system-level qualification.
