EP2AGX45CU17I3N - Arria II GX FPGA, 42K LEs, 156 I/O, 358-FCBGA | Intel
MPN： EP2AGX45CU17I3N ✓ 啟用中EP2AGX45CU17I3N 概覽
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded multipliers, block RAM, and programmable I/O cells that can be rewired post-manufacturing to implement custom digital circuits. FPGAs occupy a position in the broader taxonomy of programmable logic devices (PLDs) and are widely used as glue logic, co-processors, and DSP accelerators between microcontrollers/DSPs and application-specific standard products (ASSPs). Within the programmable logic hierarchy, the Arria II family sits between the lower-cost Cyclone family and the high-performance Stratix family, targeting mid-range applications that need transceivers and DSP blocks.
Key features of the EP2AGX45CU17I3N include 1,805 LABs, 8 transceiver channels, 4 PLLs, 312 (18x18) multipliers, support for DDR2/DDR3/LPDDR/LPDDR2 external memory interfaces, and 0.9 V core operation. The "I3" speed grade and "I" temperature grade designate industrial temperature operation (-40C to +100C) at a moderate performance bin.
The Arria II GX architecture combines a logic fabric with embedded transceivers and DSP blocks, enabling designers to implement protocol bridging, video processing, and baseband DSP without external ASSPs. The 40 nm process node offers a balance of static power and dynamic performance, with dedicated hard IP for PCIe, Ethernet, and serial RapidIO protocols.
Typical applications include wireless backhaul, serial protocol bridging, video processing, industrial imaging, and test & measurement instrumentation. The transceiver-rich architecture is especially useful where multi-gigabit serial links must coexist with custom DSP or control logic on a single device.
When designing with this part, plan the power integrity network carefully: Arria II GX designs typically require multi-rail supplies (0.9 V core, 1.1 V transceiver PLLs, 2.5/3.3 V I/O) with bulk decoupling and high-frequency ceramic capacitors placed close to each bank.
This page synthesizes distributor pricing, the curated Altera/Intel drop-in alternatives in the same 358-ball LFBGA footprint, and practical design notes that go beyond a single datasheet search.
直接替換替代品，適用於 EP2AGX45CU17I3N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGX45CU17I3N （相同外形與佔位） — 差異在於 Package, Device Type, Speed Grade, Operating Temperature, Mounting Type.
EP2AGX45CU17I3G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45CU17I6N
✅ 直接替換📋 參考替代品（不在目錄中）
EP2AGX45CU17C6N
✅ 直接替換📋 參考替代品（不在目錄中）
EP2AGX45CU17C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45CU17C4G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45CU17I3N 最大額定值與電氣特性
| Family | Arria II GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 42,959 |
| Number of LABs/CLBs | 1,805 |
| Total RAM Bits | 3,517,440 |
| Number of I/O | 156 |
| Number of Transceivers | 8 |
| Transceiver Data Rate (max) | 3.75 Gbps |
| Number of PLLs | 4 |
| Multiplier Elements (18x18) | 312 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| 封裝 | 358-LFBGA, FCBGA |
| 工作溫度 | -40C to +100C (Industrial) |
| Speed Grade | I3 |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
EP2AGX45CU17I3N 358-lfbga, fcbga 腳位配置指南
EP2AGX45CU17I3N（358-lfbga, fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGX45CU17I3N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGX45CU17I3N 適用於 6 應用s: Wireless Backhaul Equipment, Serial Protocol Bridge Cards, Industrial Video Processing, Test and Measurement Instrumentation, Medical Imaging Systems, Aerospace and Defense Signal Processing.
Wireless Backhaul Equipment
The EP2AGX45CU17I3N's 8 multi-gigabit transceivers operating up to 3.75 Gbps and 4 on-chip PLLs make it a natural fit for wireless backhaul baseband cards that aggregate Ethernet, CPRI, and serial RapidIO links. The 312 (18x18) multipliers and 3,517,440 bits of block RAM implement channel coding, scrambling, and timing-recovery DSP on a single device, eliminating a discrete DSP+ASIC pair. Industrial temperature grade is critical for outdoor-cabinet deployment. Place the device between PHY and network processor to free the host CPU from PHY housekeeping.
推薦
Serial Protocol Bridge Cards
Use the EP2AGX45CU17I3N as a multi-protocol bridge on line cards that must convert PCIe Gen1/Gen2 to Serial RapidIO, Gigabit Ethernet, or custom serial links. The 8 transceivers provide the physical layer for these protocols without external PHYs, and the 42,959 logic elements handle state machines, DMA, and packet buffering. Compared to an ASSP bridge, the FPGA approach lets you tune packet latency and add proprietary extensions. Industrial temperature supports legacy telecom and industrial enclosures.
推薦
Industrial Video Processing
The EP2AGX45CU17I3N's 312 DSP blocks and 3.5 Mbit block RAM are well matched to SD/HD video scaling, color-space conversion, and de-interlacing pipelines in factory automation, machine vision, and broadcast gear. The 156 user I/Os interface to DDR2/DDR3 external frame buffers and parallel video busses. Industrial temperature supports factory-floor installations. Place the FPGA between the camera/link receiver and the host processor to offload pixel-rate work.
推薦
Test and Measurement Instrumentation
The EP2AGX45CU17I3N integrates logic fabric, transceivers, and DSP into one device usable in protocol-aware logic analyzers, bit-error-rate testers, and arbitrary waveform generators. The transceivers capture serial data up to 3.75 Gbps while the DSP blocks run eye-diagram statistics, jitter decomposition, and PRBS checking in real time. Industrial temperature supports laboratory and field-test chassis. Pair the FPGA with a host CPU over PCIe to offload pattern generation.
推薦
Medical Imaging Systems
The EP2AGX45CU17I3N's combination of 42K logic elements and 312 (18x18) multipliers enables real-time beamforming, FFT, and image reconstruction for ultrasound and endoscopy systems. The 8 transceivers support multi-channel probe data ingest at link rates to 3.75 Gbps, and the 156 I/Os drive DDR2/DDR3 frame memory without external bus controllers. Industrial temperature grade supports portable cart and bedside equipment. Place the FPGA between probe receiver ASIC and display processor to consolidate DSP.
推薦
Aerospace and Defense Signal Processing
The EP2AGX45CU17I3N is well suited to avionics and defense subsystems that demand industrial temperature, deterministic DSP, and reconfigurable serial links. The 3.75 Gbps transceivers connect to MIL-STD-1553, ARINC 429, or custom serial backplanes, while the multipliers implement radar FFT and electronic-warfare pulse processing. The 40 nm process node and mature Quartus toolchain make this part a long-life candidate for defense programs. Industrial temperature supports -40C to +100C ambient conditions.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGX45CU17I3N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGX45CU17I3G | EP2AGX45CU17I6N | EP2AGX45CU17C6N | EP2AGX45CU17C5N | EP2AGX45CU17C4G |
|---|---|---|---|---|---|---|
| Package | 358-LFBGA, FCBGA | 358-LFBGA, FCBGA - same | 358-LFBGA, FCBGA - same | 358-LFBGA, FCBGA - same | 358-LFBGA, FCBGA - same | 358-LFBGA, FCBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 |
| Speed Grade | I3 | I3 | I6 (faster) | C6 (faster) | C5 | C4 (fastest) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Number of Transceivers | 8 | 8 | 8 | 8 | 8 | 8 |
| Transceiver Data Rate (max) | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps |
| Number of I/O | 156 | 156 | 156 | 156 | 156 | 156 |
| Multiplier Elements (18x18) | 312 | 312 | 312 | 312 | 312 | 312 |
| Lead Finish | SnPb (N) | Pb-free (G) | SnPb (N) | SnPb (N) | SnPb (N) | Pb-free (G) |
主要差異化特點
- Industrial temperature variant at mid-range density (對比EP2AGX45CU17C6N)
- 8 transceivers up to 3.75 Gbps in mid-density FPGA (對比Cyclone V E (5CGXFC7C7F23C8N))
- 40 nm mature process with full Quartus toolchain support (對比Stratix V (5SGXEA7H3F35C3))
設計說明
Estimated: Arria II GX designs typically require at least four power rails: 0.9 V core (VCC), 1.1 V transceiver PLL (VCCH_GXB), 2.5 V/3.3 V I/O banks, and 1.2 V/1.5 V auxiliary supplies. Budget 3-8 W core plus 0.5-1.5 W per active transceiver, depending on data rate and pre-emphasis. Use the PowerPlay Early Power Estimator in Quartus to refine before place-and-route.
Place 100 nF and 4.7 uF X7R ceramic decoupling capacitors within 1-2 mm of each VCC/VCCH/GXB pin pair, with bulk 22-100 uF tantalum or polymer capacitors on each rail. A 4-layer PCB with continuous VCC and GND planes beneath the BGA improves power integrity; for 8-layer stack-ups add dedicated signal layers for high-speed serial routing.
Transceiver channels operating at 3.75 Gbps require 100-ohm differential routing, length matching within +/- 5 mils for intra-pair and within +/- 50 mils for inter-pair, and AC-coupling capacitors near the transmitter side. Reference the Arria II GX Altium/Quartus pin planner for pre-tuned output pre-emphasis and equalization settings.
Do not mix industrial and commercial temperature-grade variants without re-running timing closure across -40C to +100C; jitter budget shrinks at cold corners. Verify all configuration pins (MSEL0-3) match the chosen configuration scheme (AS, PS, FPP) before final board bring-up; misconfigured MSELs cause hard configuration failures.
合規資訊
SnPb lead finish indicated by N suffix - non-RoHS but useful for defense and aerospace exemptions. For RoHS-compliant production use the G-suffix variants (EP2AGX45CU17I3G, EP2AGX45CU17C4G). Not AEC-Q100 qualified; FPGAs in this class are typically not used directly in safety-critical automotive without additional system-level qualification.
