EP2AGX45DF29C6N - Arria II GX FPGA 45K LE 780-FBGA | Intel
MPN: EP2AGX45DF29C6N ✗ اختتامِ زندگیEP2AGX45DF29C6N جائزہ
What is an FPGA? A Field Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as transceivers, memory blocks, and DSP slices. FPGAs occupy a tier above CPLDs in complexity and below ASICs in non-recurring engineering cost, allowing designers to implement custom digital logic, signal processing pipelines, and high-speed serial protocols after fabrication. Arria II GX sits in Intel's mid-range FPGA family, between the lower-cost Cyclone series and the high-end Stratix series, balancing logic density, transceiver performance, and power consumption.
Key features of the EP2AGX45DF29C6N include 1,805 LABs (logic array blocks), 3,517,440 bits of embedded memory, and 42959 (presumed adaptive logic modules / DSP-related count as listed in the datasheet). The integrated transceivers support protocols such as PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and XAUI. The device operates from a 0.9V core supply with multiple I/O voltage standards supported.
The architecture combines an 8-input adaptive logic module (ALM) fabric with per-channel transceiver PLLs and dedicated PHY hard IP. This allows designers to amortize the silicon area of common interfaces rather than implementing them in soft logic, reducing power and improving timing closure on multi-gigabit links.
Typical applications include wireless baseband processing, broadcast video equipment, military radar, and high-speed serial protocol bridging. Designers select Arria II GX when they need proven 6.375 Gbps transceivers with mid-range logic density at lower power than Stratix IV.
When designing with this FPGA, plan power sequencing for the 0.9V core, PLL supplies, and transceiver supplies independently. The 780-FBGA package requires high-layer-count PCB stack-ups with microvia technology for breakout; signal-integrity-aware layout is essential for the transceiver channels.
This page consolidates distributor pricing, drop-in FPGA variants, and practical PCB design guidance synthesized from the Intel Arria II GX device handbook — information not aggregated on any single distributor product page.
کے لیے ڈراپ اِن متبادل EP2AGX45DF29C6N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP2AGX45DF29C6N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
EP2AGX45DF29C5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGX45DF29C4N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGX45DF29C3N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGX45DF29C6G
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGX45DF29C5G
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGX45DF29C6N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Device Family | Arria II GX |
| Logic Elements | 45,000 |
| Number of LABs | 1,805 |
| Embedded Memory Bits | 3,517,440 bits |
| User I/O Count | 364 |
| Maximum Transceiver Data Rate | 6.375 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| پیکیج | 780-FBGA (DF29), 29 mm body |
| آپریٹنگ درجہ حرارت | 0C to +85C (commercial) |
| Speed Grade | C6 |
| ماؤنٹنگ ٹائپ | Surface Mount (BGA) |
| RoHS اسٹیٹس | Compliant |
| Pb-Free / Lead-Free | Yes |
EP2AGX45DF29C6N 780-fbga (df29), 29 mm body پن کنفیگریشن گائیڈ
EP2AGX45DF29C6N (780-fbga (df29), 29 mm body پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP2AGX45DF29C6N.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP2AGX45DF29C6N کے لیے موزوں ہے 6 ایپلیکیشنs: Wireless Baseband Processing, Broadcast Video Processing, High-Speed Serial Protocol Bridging, Military Radar Signal Processing, Test and Measurement Equipment, Industrial Imaging and Machine Vision.
Wireless Baseband Processing
The EP2AGX45DF29C6N's 45,000 logic elements and 6.375 Gbps transceivers make it well-suited for wireless baseband signal processing in 4G LTE small cells and WiMAX base stations. The 3,517,440 embedded memory bits accommodate cyclic-prefix buffers and FFT working memory without external SRAM access. Compared to a DSP + ASSP architecture, the Arria II GX allows algorithmic upgrades in the field — useful as LTE evolved toward LTE-Advanced. The 780-FBGA package supports the high-density board layout required for multi-antenna (MIMO) designs where four transceiver channels feed parallel processing paths.
تجویز کردہ
Broadcast Video Processing
The EP2AGX45DF29C6N is widely deployed in broadcast video routers, format converters, and SDI/HDMI bridging equipment. Its 6.375 Gbps transceivers handle 3G-SDI and 6G-SDI (2160p30) data rates natively, while the 45,000 logic elements provide capacity for color-space conversion, scaling, and frame-rate adaptation. The 364 user I/Os allow connection to multiple parallel video buses plus external DDR2/DDR3 memory for frame buffers. Broadcast equipment manufacturers value the Arria II GX family because the IP cores (SDI, HDMI, DisplayPort) are mature and certified against broadcast industry standards.
تجویز کردہ
High-Speed Serial Protocol Bridging
The EP2AGX45DF29C6N is an excellent fit for protocol bridging applications where multiple serial standards must be converted between. Typical deployments include PCIe Gen1/Gen2 to XAUI bridges, Serial RapidIO to Ethernet gateways, and custom backplane protocol converters. The 6.375 Gbps transceivers support all common multi-gigabit protocols, and the FPGA fabric allows custom packet processing, DMA engines, and protocol-aware logic. The 780-FBGA package keeps board area small enough for adapter card form factors while still delivering 364 user I/Os for parallel side-band interfaces.
تجویز کردہ
Military Radar Signal Processing
Defense and aerospace integrators have long qualified the EP2AGX45DF29C6N for radar front-end preprocessing, beamforming, and I/Q demodulation. The device's combination of mid-range logic density, 6.375 Gbps serial links (useful for digitizer-to-processor backplanes), and 0.9V low-power operation makes it attractive for size, weight, and power-constrained (SWaP) applications. Although Intel has NRND-flagged Arria II GX, many defense programs have long lifecycles and continue to source the part through established authorized channels. The 780-FBGA package supports the ruggedized PCB stack-ups used in Mil/Aero hardware.
تجویز کردہ
Test and Measurement Equipment
Test equipment manufacturers use the EP2AGX45DF29C6N as the core processing element in protocol analyzers, bit-error-rate testers (BERTs), and logic analyzers. Its 6.375 Gbps transceivers capture and analyze high-speed serial traffic in real time, while the 45,000 logic elements implement pattern generators, error injectors, and protocol decoders. The 780-FBGA package allows integration into benchtop form factors, and the C6 speed grade gives consistent timing margins across production builds. The mature Quartus II design flow (still supported for Arria II) provides reliable synthesis and timing closure.
تجویز کردہ
Industrial Imaging and Machine Vision
The EP2AGX45DF29C6N enables high-speed industrial cameras, frame grabbers, and machine vision controllers. Its 6.375 Gbps transceivers interface with CoaXPress, Camera Link HS, and 10 Gigabit Ethernet vision standards, while the FPGA fabric performs image preprocessing (white balance, gamma, edge detection) before forwarding frames to a host processor. The 364 user I/Os accommodate multiple parallel image sensors plus GPIO for trigger and strobe signals. Industrial designers value the long-term availability of Arria II GX and the deterministic latency of the FPGA fabric for real-time vision pipelines.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP2AGX45DF29C6N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP2AGX45DF29C5N | EP2AGX45DF29C4N | EP2AGX45DF29C3N | EP2AGX45DF29C6G | EP2AGX45DF29C5G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (DF29, 29mm) | 780-FBGA (DF29, 29mm) - same | 780-FBGA (DF29, 29mm) - same | 780-FBGA (DF29, 29mm) - same | 780-FBGA (DF29, 29mm) - same | 780-FBGA (DF29, 29mm) - same |
| Speed Grade | C6 | C5 (faster) | C4 (faster) | C3 (fastest) | C6 (same) | C5 (faster) |
| Logic Elements | 45,000 | 45,000 | 45,000 | 45,000 | 45,000 | 45,000 |
| User I/Os | 364 | 364 | 364 | 364 | 364 | 364 |
| Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Lead-Free / Green | Yes | Yes | Yes | Yes | Yes (Green suffix) | Yes (Green suffix) |
اہم امتیازی خصوصیات
- Faster speed grade option available in identical package (بمقابلہEP2AGX45DF29C5N)
- Lead-free / Green compliant variant available (بمقابلہEP2AGX45DF29C6G)
- Same silicon, multiple speed bins allow cost/timing trade-off (بمقابلہEP2AGX45DF29C3N)
ڈیزائن نوٹس
The 780-FBGA (DF29, 29 mm body) package requires a high-layer-count PCB (typically 10+ layers) with microvia technology for breakout routing. Use a 1.0 mm or 1.27 mm pitch BGA fanout with staggered or dog-bone via patterns. Pair each transceiver channel with a continuous reference ground plane on the layer immediately beneath the BGA breakout to control impedance and suppress crosstalk between channels. Estimated: a 14-layer stack-up with 0.4 mm laser-drilled microvias is typical for 6.375 Gbps designs in this package.
The Arria II GX EP2AGX45DF29C6N requires independent power rails for VCC (0.9V core), VCC_PLL, VCCPT (programmable technology voltage), and per-bank VCCIO supplies for the I/O banks. Sequence the core voltage before the I/O voltages to avoid latch-up during power-up; many designs use a power management IC (e.g., LTC3612 or TI TPS5430 family) with PG (power-good) feedback to the FPGA's nCONFIG pin. Decoupling: place 0.1 µF X7R ceramic capacitors within 2 mm of every VCC/VCCPT/VCCIO ball, plus bulk decoupling at the voltage regulator outputs. Estimated: total core current at typical utilization is 1.5-3 A depending on clock rate and toggle activity.
The 780-FBGA package has a typical theta_JA in the range of 12-18 C/W with appropriate PCB thermal design (thermal vias under the BGA, inner copper planes). In still air, the EP2AGX45 at full transceiver utilization can dissipate 5-8 W. For forced-air or enclosed chassis designs, attach a heatsink via thermal interface material (TIM) directly to the top of the BGA package; some BGA variants expose a thermal slug for this purpose. Estimated: junction temperature rise of 7-10 C per watt of dissipation with the recommended thermal via array.
Each 6.375 Gbps transceiver channel requires AC-coupling capacitors (typically 100 nF X7R 0402) on the TX serial output lines, placed as close as practical to the FPGA ball. Match the differential trace length within 5 mils (0.127 mm) and maintain 100 ohm differential impedance over the entire channel. Keep the transceiver power supply (VCCT, VCCR) isolated from noisy digital supplies using a ferrite bead or pi-filter network. Reference the Intel Arria II GX Transceiver User Guide for the full channel budget and recommended PCB stack-up.
تعمیل کی معلومات
RoHS compliance per Altera/Intel product documentation. Lead-free per N/G suffix conventions. AEC-Q100 not applicable (industrial/commercial FPGA, not automotive-qualified).
